Inventor · disambiguated record
Boon Ping Koh
Also filed as: KOH BOON PING
24 granted patents·11 pending applications·44 citations·filing 2005–2023
92Inventor score
Top patents by PatentIndex Score
35 records- 0197US10978434B2Systems in packages including wide-band phased-array antennas and methods of assembling sameINTEL CORP·Filed 2020·Granted Apr 13, 2021·5 cites·20 claims
- 0294US10580761B2Systems in packages including wide-band phased-array antennas and methods of assembling sameINTEL CORP·Filed 2018·Granted Mar 3, 2020·9 cites·21 claims
- 0388US9836095B1Microelectronic device package electromagnetic shieldINTEL CORP·Filed 2016·Granted Dec 5, 2017·6 cites·22 claims
- 0486US10796999B2Floating-bridge interconnects and methods of assembling sameINTEL CORP·Filed 2019·Granted Oct 6, 2020·4 cites·18 claims
- 0577US7202836B2Antenna apparatus and method of forming sameMOTOROLA INC·Filed 2005·Granted Apr 10, 2007·12 cites·2 claims
- 0671US11658127B2RFI free picture frame metal stiffenerINTEL CORP·Filed 2019·Granted May 23, 2023·1 cites·28 claims
- 0769US11552403B2Slot antenna on a printed circuit board (PCB)INTEL CORP·Filed 2021·Granted Jan 10, 2023·0 cites·16 claims
- 0868US12471262B2Radiation shield with radiation shield gapINTEL CORP·Filed 2021·Granted Nov 11, 2025·0 cites·19 claims
- 0966US11393760B2Floating-bridge interconnects and methods of assembling sameINTEL CORP·Filed 2020·Granted Jul 19, 2022·0 cites·19 claims
- 1064US9455752B2Apparatus and method for adaptive common mode noise decomposition and tuningINTEL CORP·Filed 2014·Granted Sep 27, 2016·1 cites·20 claims
- 1164US8115690B2Coupled multiband antennaKOH BOON PING·Filed 2009·Granted Feb 14, 2012·6 cites·18 claims
- 1262US12250800B2Radiation shield with zipperINTEL CORP·Filed 2021·Granted Mar 11, 2025·0 cites·20 claims
- 1358US10334736B2Flexible integrated circuit that includes an antennaINTEL CORP·Filed 2017·Granted Jun 25, 2019·0 cites·19 claims
- 1455US12309984B2Radiation shield and groove in support structureINTEL CORP·Filed 2021·Granted May 20, 2025·0 cites·19 claims
- 1555US9839134B2Flexible integrated circuit that includes an antennaINTEL CORP·Filed 2015·Granted Dec 5, 2017·0 cites·20 claims
- 1655US2025107003A1Methods and apparatus to manage noise for timing circuitryINTEL CORP·Filed 2023·Application pending·0 cites
- 1753US11211714B2Slot antenna on a printed circuit board (PCB)INTEL CORP·Filed 2017·Granted Dec 28, 2021·0 cites·4 claims
- 1853US10396834B2Apparatus and method for adaptive common mode noise decomposition and tuningINTEL CORP·Filed 2016·Granted Aug 27, 2019·0 cites·18 claims
- 1952US11652057B2Disaggregated die interconnection with on-silicon cavity bridgeINTEL CORP·Filed 2019·Granted May 16, 2023·0 cites·25 claims
- 2052US2023074049A1Differential signal skew compensation technique for rfi mitigation with no reflection penaltyINTEL CORP·Filed 2022·Application pending·0 cites
- 2152US2023016486A1Low-cost surface mount emi gasketsINTEL CORP·Filed 2022·Application pending·0 cites
- 2251US12424779B2Flexible printed circuit board arrangementINTEL CORP·Filed 2021·Granted Sep 23, 2025·0 cites·20 claims
- 2351US10256519B2Stranded transmission line and uses thereofINTEL CORP·Filed 2016·Granted Apr 9, 2019·0 cites·20 claims
- 2451US2023317680A1Ribbon shield device and methodINTEL CORP·Filed 2022·Application pending·0 cites
- 2550US10939540B2Shielded folded circuit boardINTEL CORP·Filed 2019·Granted Mar 2, 2021·0 cites·24 claims
- 2649US2023396025A1Magnetic grounding techniques for cable shieldsINTEL CORP·Filed 2023·Application pending·0 cites
- 2739US11178768B2Flexible printed circuit EMI enclosureINTEL CORP·Filed 2016·Granted Nov 16, 2021·0 cites·22 claims
- 2838US2019221529A1On-package integrated stiffener antennaINTEL CORP·Filed 2018·Application pending·0 cites
- 2938US2018189217A1Techniques for an extendable peripheral portINTEL CORP·Filed 2016·Application pending·0 cites
- 3038US2019103357A1Methods of forming package on package assemblies with reduced z height and structures formed therebyINTEL CORP·Filed 2017·Application pending·0 cites
- 3137US11239126B2Rod-based substrate with ringed interconnect layersINTEL CORP·Filed 2017·Granted Feb 1, 2022·0 cites·26 claims
- 3236US2018088627A1Interconnects for wearable deviceCHEAH BOK ENG·Filed 2016·Application pending·0 cites
- 3332US8130153B2Electronic device and electronic assemblyKOH BOON PING·Filed 2008·Granted Mar 6, 2012·0 cites·18 claims
- 3432US2016380386A1Electrostatic discharge for electronic device couplingINTEL CORP·Filed 2015·Application pending·0 cites
- 3532US2016211619A1Electrostatic discharge for electronic device couplingINTEL CORP·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →