Inventor · disambiguated record
Bongyeol Lee
Also filed as: LEE BONGYEOL
1 granted patent·8 pending applications·0 citations·filing 2022–2024
11Inventor score
Top patents by PatentIndex Score
9 records- 0166US12408274B2Printed circuit board and electronic device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Sep 2, 2025·0 cites·20 claims
- 0265US2025079289A1Substrate and manufacturing method for the sameABSOLICS INC·Filed 2024·Application pending·0 cites
- 0354US2025149400A1Packaging substrate and manufacturing method of packaging substrateABSOLICS INC·Filed 2024·Application pending·0 cites
- 0454US2025140669A1Packaging substrate and manufacturing method of packaging substrateABSOLICS INC·Filed 2024·Application pending·0 cites
- 0554US2025140707A1Packaging substrate and manufacturing method of packaging substrateABSOLICS INC·Filed 2024·Application pending·0 cites
- 0649US2025079244A1Method of manufacturing packaging substrate and packaging substrate manufactured therebyABSOLICS INC·Filed 2023·Application pending·0 cites
- 0745US2025174538A1Packaging substrate and manufacturing method of packaging substrateABSOLICS INC·Filed 2024·Application pending·0 cites
- 0845US2025210423A1Plate shaped substrate and packaging substrateABSOLICS INC·Filed 2024·Application pending·0 cites
- 0940US2023051147A1Electronic device and method for charging thereofSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →