Inventor · disambiguated record
Bong-Sub Lee
Also filed as: LEE BONG SUB
4 granted patents·3 pending applications·19 citations·filing 2012–2017
66Inventor score
Top patents by PatentIndex Score
7 records- 0192US10381326B2Structure and method for integrated circuits packaging with increased densityINVENSAS CORP·Filed 2014·Granted Aug 13, 2019·19 cites·5 claims
- 0255US10440822B2Interposers with electrically conductive features having different porositiesINVENSAS CORP·Filed 2017·Granted Oct 8, 2019·0 cites·20 claims
- 0354US9769923B2InterposersINVENSAS CORP·Filed 2016·Granted Sep 19, 2017·0 cites·9 claims
- 0450US9570385B2Method for fabrication of interconnection circuitry with electrically conductive features passing through a support and comprising core portions formed using nanoparticle-containing inksINVENSAS CORP·Filed 2015·Granted Feb 14, 2017·0 cites·10 claims
- 0549US2013340981A1Electrohydrodynamic (ehd) air mover configuration with flow path expansion and/or spreading for improved ozone catalysisTESSERA INC·Filed 2013·Application pending·0 cites
- 0637US2014034283A1Operational control of electrohydrodynamic (ehd) air mover and electrode conditioning mechanismLEE BONG SUB·Filed 2012·Application pending·0 cites
- 0737US2018030971A1Variable-capacity swashplate-type compressorDOOWON TECHNICAL COLLEGE·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →