Inventor · disambiguated record
Bok Leng Ser
Also filed as: SER BOK LENG
8 granted patents·1 pending application·201 citations·filing 1997–2014
88Inventor score
Technology areasH10W
Top patents by PatentIndex Score
9 records- 0190US5956233AHigh density single inline memory moduleTEXAS INSTRUMENTS INC·Filed 1997·Granted Sep 21, 1999·132 cites·20 claims
- 0285US7579681B2Super high density module with integrated wafer level packagesMICRON TECHNOLOGY INC·Filed 2002·Granted Aug 25, 2009·28 cites·21 claims
- 0384US7884007B2Super high density module with integrated wafer level packagesMICRON TECHNOLOGY INC·Filed 2007·Granted Feb 8, 2011·8 cites·22 claims
- 0484US7368374B2Super high density module with integrated wafer level packagesMICRON TECHNOLOGY INC·Filed 2004·Granted May 6, 2008·24 cites·36 claims
- 0579US8304894B2Super high-density module with integrated wafer level packagesCHIA YONG POO·Filed 2007·Granted Nov 6, 2012·6 cites·31 claims
- 0667US8698295B2Super high-density module with integrated wafer level packagesCHIA YONG POO·Filed 2007·Granted Apr 15, 2014·2 cites·20 claims
- 0764US9418872B2Packaged microelectronic componentsMICRON TECHNOLOGY INC·Filed 2014·Granted Aug 16, 2016·1 cites·21 claims
- 0842US9806013B2Multilayer structure for a semiconductor device and a method of forming a multilayer structure for a semiconductor deviceINST OF TECHNICAL EDUCATION·Filed 2013·Granted Oct 31, 2017·0 cites·35 claims
- 0942US2008006940A1Lead frames, microelectronic devices with lead frames, and methods for manufacturing lead frames and microelectronic devices with lead framesMICRON TECHNOLOGY INC·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →