Inventor · disambiguated record
Bohan Shan
Also filed as: SHAN BOHAN
6 granted patents·93 pending applications·1 citations·filing 2016–2024
67Inventor score
Top patents by PatentIndex Score
99 records- 0174US2025125307A1Microelectronic assemblies including interconnects with different solder materialsINTEL CORP·Filed 2024·Application pending·0 cites
- 0271US9716239B2Phototunable metal-organic framework compositions, and methods of synthesis thereofUNIV ARIZONA STATE·Filed 2016·Granted Jul 25, 2017·1 cites·20 claims
- 0367US2023383427A1Two-dimensional metal-organic framework alloy photocatalystsMU BIN·Filed 2023·Application pending·0 cites
- 0466US12412868B2Microelectronic assemblies including interconnects with different solder materialsINTEL CORP·Filed 2021·Granted Sep 9, 2025·0 cites·20 claims
- 0561US2025022786A1Methods and apparatus for edge protected glass coresINTEL CORP·Filed 2024·Application pending·0 cites
- 0661US2025105074A1Glass cores including protruding through glass vias and related methodsINTEL CORP·Filed 2024·Application pending·0 cites
- 0759US2025391718A1Integrated circuit packages including substrates with reinforced glass coresINTEL CORP·Filed 2024·Application pending·0 cites
- 0859US2025201485A1Vertically embedded pre-formed deep trench capacitor modulesINTEL CORP·Filed 2023·Application pending·0 cites
- 0959US2024264530A1Light responsive photoresists and methodsINTEL CORP·Filed 2022·Application pending·0 cites
- 1059US2025218678A1Die within a hole in a substrate core attached to metal features over the holeINTEL CORP·Filed 2023·Application pending·0 cites
- 1159US2025386432A1Coaxial vias in glass core architecturesINTEL CORP·Filed 2024·Application pending·0 cites
- 1259US2025309015A1Integrated circuit packages including a glass-core substrate with ultra-high aspect ratio through-glass viasINTEL CORP·Filed 2024·Application pending·0 cites
- 1359US2025300086A1Optical and electrical glass interposer with embedded bridgeINTEL CORP·Filed 2024·Application pending·0 cites
- 1459US2025300088A1Integrated circuit packages including interposers having a glass layer and embedded diesINTEL CORP·Filed 2024·Application pending·0 cites
- 1558US12119326B2Microelectronic structures including bridgesINTEL CORP·Filed 2020·Granted Oct 15, 2024·0 cites·20 claims
- 1658US11753731B2Two-dimensional metal-organic framework alloy photocatalystsMU BIN·Filed 2020·Granted Sep 12, 2023·0 cites·10 claims
- 1758US2025218999A1Passive component assembly for thickness modification to match core thicknessINTEL CORP·Filed 2023·Application pending·0 cites
- 1858US2025125201A1Package substrates with components included in cavities of glass coresINTEL CORP·Filed 2024·Application pending·0 cites
- 1958US2025126814A1Package substrates with components included in cavities of glass coresINTEL CORP·Filed 2024·Application pending·0 cites
- 2058US2025125202A1Package substrates with components included in cavities of glass coresINTEL CORP·Filed 2024·Application pending·0 cites
- 2158US2025120102A1Package substrates with components included in cavities of glass coresINTEL CORP·Filed 2024·Application pending·0 cites
- 2258US2025218998A1Low temperature solder interconnect for package pitch scalingINTEL CORP·Filed 2023·Application pending·0 cites
- 2358US2025266395A1Multi-die bridge assemblies and methods for three-dimensional packagingINTEL CORP·Filed 2024·Application pending·0 cites
- 2457US12354883B2Omni directional interconnect with magnetic fillers in mold matrixINTEL CORP·Filed 2021·Granted Jul 8, 2025·0 cites·18 claims
- 2557US2025219028A1Deep trench capacitors in multi-core integrated circuit device package substratesINTEL CORP·Filed 2023·Application pending·0 cites
- 2657US2025096053A1Microelectronic assemblies having a bridge die over a glass patchINTEL CORP·Filed 2023·Application pending·0 cites
- 2757US2025218963A1Die and conductive vias embedded in a substrateINTEL CORP·Filed 2023·Application pending·0 cites
- 2857US2025218915A1Pedestal structure for passive circuit component structureINTEL CORP·Filed 2023·Application pending·0 cites
- 2957US2025210426A1Microelectronic assemblies with strengthened glass coresINTEL CORP·Filed 2023·Application pending·0 cites
- 3057US2025112124A1Deep cavity arrangements on integrated circuit packagingINTEL CORP·Filed 2023·Application pending·0 cites
- 3157US2025220818A1Flow enhanced dummy structure to enable capillary flow based sidewall fillingINTEL CORP·Filed 2023·Application pending·0 cites
- 3257US2025218964A1Technologies for connected components embedded in a substrate coreINTEL CORP·Filed 2023·Application pending·0 cites
- 3357US2025105156A1Integrated circuit packages including a substrate coupled to a glass core by interconnectsINTEL CORP·Filed 2023·Application pending·0 cites
- 3457US2025218958A1Pedestals for semiconductor components embedded in package substrates and related methodsINTEL CORP·Filed 2023·Application pending·0 cites
- 3557US2025218904A1Technologies for power and spacer components embedded in a substrate coreINTEL CORP·Filed 2023·Application pending·0 cites
- 3657US2025218880A1Microelectronic assemblies with pillar-first conductive via formation in glass coresINTEL CORP·Filed 2023·Application pending·0 cites
- 3757US2025273582A1Interconnections to package substrates for interconnect bridgesINTEL CORP·Filed 2024·Application pending·0 cites
- 3857US2025218960A1Methods and apparatus to embed semiconductor devices in cores of package substratesINTEL CORP·Filed 2023·Application pending·0 cites
- 3957US2025218926A1Microelectronic assemblies including cavity-less encapsulated diesINTEL CORP·Filed 2023·Application pending·0 cites
- 4056US2025218952A1Spacer for embedded component in coreINTEL CORP·Filed 2023·Application pending·0 cites
- 4156US2025218879A1Resist tenting and plating in core cavity for component attachmentINTEL CORP·Filed 2023·Application pending·0 cites
- 4256US2025273607A1Methods and architectures for shallow fiducial and metal defined pad designsINTEL CORP·Filed 2024·Application pending·0 cites
- 4356US2025219021A1Vertically embedded components in package substratesINTEL CORP·Filed 2023·Application pending·0 cites
- 4456US2025112085A1Apparatus and methods for capillary underfill of embedded devicesINTEL CORP·Filed 2023·Application pending·0 cites
- 4556US2025183180A1Direct bonding for embedded bridges with viasINTEL CORP·Filed 2023·Application pending·0 cites
- 4656US2025218957A1Methods and apparatus to embed a semiconductor device in a glass coreINTEL CORP·Filed 2023·Application pending·0 cites
- 4756US2025210469A1Mixed depth cavity for embedded bridge structuresINTEL CORP·Filed 2023·Application pending·0 cites
- 4855US2025105209A1High performance microelectronic assemblies including through-silicon via bridges with top die first approachINTEL CORP·Filed 2023·Application pending·0 cites
- 4955US2025218906A1Reconstituted passive assemblies for embedding in thick coresINTEL CORP·Filed 2023·Application pending·0 cites
- 5055US2025112165A1Anisotropic conductive connections for interconnect bridges and related methodsINTEL CORP·Filed 2023·Application pending·0 cites
Showing the top 50 of 99 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →