Inventor · disambiguated record
Bor-Rung Su
Also filed as: SU BOR-RUNG
7 granted patents·14 citations·filing 2011–2022
78Inventor score
Technology areasH10W
Top patents by PatentIndex Score
7 records- 0183US9887144B2Ring structure for chip packagingLIN WEN YI·Filed 2011·Granted Feb 6, 2018·7 cites·20 claims
- 0278US11289373B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 29, 2022·2 cites·20 claims
- 0378US9449933B2Packaging device and method of making the sameHUANG CHANG-CHIA·Filed 2012·Granted Sep 20, 2016·5 cites·19 claims
- 0469US11848233B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 19, 2023·0 cites·20 claims
- 0559US10700033B2Packaging device and method of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 30, 2020·0 cites·20 claims
- 0655US10050001B2Packaging device and method of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 14, 2018·0 cites·20 claims
- 0740US9748212B2Shadow pad for post-passivation interconnect structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 29, 2017·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →