Inventor · disambiguated record
Bor-Chen Tsai
Also filed as: TSAI BOR-CHEN
11 granted patents·6 pending applications·50 citations·filing 2004–2020
87Inventor score
Files withIND TECH RES INST8CCP CONTACT PROBES CO LTD5APEX PROBES TECH CO LTD2HUNG CHIN-WEI1WANG HSIN-CHIEH1
Top patents by PatentIndex Score
17 records- 0191US7837333B2ProjectorIND TECH RES INST·Filed 2007·Granted Nov 23, 2010·17 cites·19 claims
- 0278US9130317B2Connector assemblyWANG HSIN-CHIEH·Filed 2014·Granted Sep 8, 2015·18 cites·17 claims
- 0377US11143675B2Insulator applied in a probe base and the probe baseCCP CONTACT PROBES CO LTD·Filed 2019·Granted Oct 12, 2021·2 cites·9 claims
- 0470US11226494B2Wearable device and electrical connector with magnetic attractionCCP CONTACT PROBES CO LTD·Filed 2019·Granted Jan 18, 2022·1 cites·10 claims
- 0564US7501149B2Electrode and method for forming the sameIND TECH RES INST·Filed 2006·Granted Mar 10, 2009·2 cites·8 claims
- 0663US7915065B2Wafer level sensing package and manufacturing process thereofIND TECH RES INST·Filed 2008·Granted Mar 29, 2011·2 cites·10 claims
- 0758US7409124B2Fiber waveguide optical subassembly moduleIND TECH RES INST·Filed 2005·Granted Aug 5, 2008·3 cites·29 claims
- 0853US2009133903A1Electrode and method for forming the sameIND TECH RES INST·Filed 2009·Application pending·0 cites
- 0950US7198413B2Parallel optical subassembly module structureIND TECH RES INST·Filed 2004·Granted Apr 3, 2007·4 cites·16 claims
- 1049US2009121299A1Wafer level sensing package and manufacturing process thereofIND TECH RES INST·Filed 2008·Application pending·0 cites
- 1146US9991629B1Magnetic automobile vehicle device and multifunctional module thereofCCP CONTACT PROBES CO LTD·Filed 2017·Granted Jun 5, 2018·1 cites·6 claims
- 1242US2006211936A1Flexible biomonitorIND TECH RES INST·Filed 2005·Application pending·0 cites
- 1339US11226352B2Electrical connection assemblyCCP CONTACT PROBES CO LTD·Filed 2020·Granted Jan 18, 2022·0 cites·6 claims
- 1437US2020348339A1Supplementary bushing, test probe, and supplementary testing deviceAPEX PROBES TECH CO LTD·Filed 2019·Application pending·0 cites
- 1533US2020348338A1Test pin contact bufferAPEX PROBES TECH CO LTD·Filed 2019·Application pending·0 cites
- 1630US8603366B2Electrical contact material of silver matrix capable of resisting arc erosion and containing no cadmium-compositeHUNG CHIN-WEI·Filed 2010·Granted Dec 10, 2013·0 cites·2 claims
- 1725US2019020151A1High frequency electronic connectorCCP CONTACT PROBES CO LTD·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →