Inventor · disambiguated record
Bo-Yu Tseng
Also filed as: TSENG BO-YU
0 granted patents·4 pending applications·0 citations·filing 2008–2014
Top patents by PatentIndex Score
4 records- 0153US2009308527A1Method For Fabricating Circuit Trace On Core Board Having Buried HoleCHANG CHIEN-WEI·Filed 2008·Application pending·0 cites
- 0240US2015271915A1Enhanced chip board package structureKINSUS INTERCONNECT TECH CORP·Filed 2014·Application pending·0 cites
- 0316US2013072012A1Method For Forming Package Substrate With Ultra-Thin Seed LayerTSENG BO-YU·Filed 2011·Application pending·0 cites
- 0411US2013118794A1Package Substrate StructureTSENG BO-YU·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →