Inventor · disambiguated record
Bo Xie
Also filed as: XIE BO · XIE BO PING
46 granted patents·42 pending applications·760 citations·filing 2000–2025
97Inventor score
Files withAPPLIED MATERIALS INC40HUAWEI TECH CO LTD15Baidu online network technology beijing co ltd5LU WEI4XIE BO4
Top patents by PatentIndex Score
88 records- 0199US6517221B1Heat pipe heat sink for cooling a laser diodeCIENA CORP·Filed 2000·Granted Feb 11, 2003·152 cites·14 claims
- 0297US8492170B2UV assisted silylation for recovery and pore sealing of damaged low K filmsXIE BO·Filed 2011·Granted Jul 23, 2013·522 cites·20 claims
- 0392US12125675B2RF pulsing assisted low-k film deposition with high mechanical strengthAPPLIED MATERIALS INC·Filed 2021·Granted Oct 22, 2024·2 cites·20 claims
- 0491US9018878B2Derating vehicle electric drive motor and generator componentsHENDRICKSON MATTHEW·Filed 2012·Granted Apr 28, 2015·11 cites·20 claims
- 0591US8657961B2Method for UV based silylation chamber cleanAPPLIED MATERIALS INC·Filed 2013·Granted Feb 25, 2014·8 cites·16 claims
- 0689US11621162B2Systems and methods for forming UV-cured low-κ dielectric filmsAPPLIED MATERIALS INC·Filed 2020·Granted Apr 4, 2023·2 cites·20 claims
- 0789US11600486B2Systems and methods for depositing low-κdielectric filmsAPPLIED MATERIALS INC·Filed 2020·Granted Mar 7, 2023·2 cites·20 claims
- 0888US9506145B2Method and hardware for cleaning UV chambersAPPLIED MATERIALS INC·Filed 2016·Granted Nov 29, 2016·3 cites·20 claims
- 0988US9364871B2Method and hardware for cleaning UV chambersAPPLIED MATERIALS INC·Filed 2013·Granted Jun 14, 2016·4 cites·11 claims
- 1088US8216861B1Dielectric recovery of plasma damaged low-k films by UV-assisted photochemical depositionYIM KANG SUB·Filed 2011·Granted Jul 10, 2012·14 cites·10 claims
- 1182US10614803B2Wake-on-voice method, terminal and storage mediumBaidu online network technology beijing co ltd·Filed 2017·Granted Apr 7, 2020·5 cites·15 claims
- 1282US9360310B2Multi-sensor indoor localization method and device based on light intensitySHENZHEN INST OF ADV TECH CAS·Filed 2013·Granted Jun 7, 2016·9 cites·10 claims
- 1382US9058980B1UV-assisted photochemical vapor deposition for damaged low K films pore sealingAPPLIED MATERIALS INC·Filed 2013·Granted Jun 16, 2015·5 cites·18 claims
- 1481US11967498B2Systems and methods for depositing low-k dielectric filmsAPPLIED MATERIALS INC·Filed 2020·Granted Apr 23, 2024·1 cites·13 claims
- 1576US12240888B1Composition comprising aflibercept and a variant thereof, and related methods and usesQILU PHARMACEUTICAL CO LTD·Filed 2024·Granted Mar 4, 2025·0 cites·5 claims
- 1676US10845772B2Method and system for controlling clothing care machineFOSHAN SHUNDE MIDEA ELECTRICAL HEATING APPLIANCES MFG CO LTD·Filed 2015·Granted Nov 24, 2020·2 cites·20 claims
- 1774US11548402B2Host system with AC charging inlet and method for identifying an electrical device connected theretoGM GLOBAL TECH OPERATIONS LLC·Filed 2020·Granted Jan 10, 2023·1 cites·20 claims
- 1874US9391024B2Multi-layer dielectric stack for plasma damage protectionAPPLIED MATERIALS INC·Filed 2015·Granted Jul 12, 2016·2 cites·20 claims
- 1973US8635000B1Brake monitoring systemCATERPILLAR INC·Filed 2012·Granted Jan 21, 2014·5 cites·16 claims
- 2072US2025333478A1Composition comprising aflibercept and a variant thereof, and related methods and usesQILU PHARMACEUTICAL CO LTD·Filed 2024·Application pending·0 cites
- 2169US8482238B2System and method for estimating a generator rotor temperature in an electric drive machineXIE BO·Filed 2010·Granted Jul 9, 2013·5 cites·20 claims
- 2268US2025369102A1Lower k and higher hardness with improved plasma induced damage (pid) dielectric film depositionAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 2367US12303069B2OvenSHINERICH IND LTD·Filed 2022·Granted May 20, 2025·0 cites·10 claims
- 2466US10923102B2Method and apparatus for broadcasting a response based on artificial intelligence, and storage mediumBaidu online network technology beijing co ltd·Filed 2018·Granted Feb 16, 2021·1 cites·15 claims
- 2566US7682457B2Frontside structure damage protected megasonics cleanAPPLIED MATERIALS INC·Filed 2007·Granted Mar 23, 2010·2 cites·15 claims
- 2665US2025053086A1Post development treatment for metal-oxide photoresistsAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 2763US10657964B2Method for controlling smart device, computer device and storage mediumBaidu online network technology beijing co ltd·Filed 2018·Granted May 19, 2020·1 cites·13 claims
- 2861US2024345013A1Catalytic combustion type hydrogen sensor and manufacturing method thereforUNIV ZHEJIANG TECHNOLOGY·Filed 2024·Application pending·0 cites
- 2961US2025391656A1Low-k film coefficient of thermal expansion modulation by uv treatmentAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 3060US12500080B2Systems and methods for depositing low-K dielectric filmsAPPLIED MATERIALS INC·Filed 2022·Granted Dec 16, 2025·0 cites·20 claims
- 3160US12410523B1Integrated low k recovery and ALD metal deposition process for advanced technology nodeAPPLIED MATERIALS INC·Filed 2024·Granted Sep 9, 2025·0 cites·21 claims
- 3260US12119223B2Single precursor low-k film deposition and UV cure for advanced technology nodeAPPLIED MATERIALS INC·Filed 2021·Granted Oct 15, 2024·0 cites·20 claims
- 3360US11456943B2Packet transmission method and apparatusHUAWEI TECH CO LTD·Filed 2020·Granted Sep 27, 2022·0 cites·20 claims
- 3457US10721155B2Packet transmission method and apparatusHUAWEI TECH CO LTD·Filed 2018·Granted Jul 21, 2020·0 cites·20 claims
- 3557US2025253158A1Dry deposition of extreme ultraviolet (euv) underlayer for lithography and patterningAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 3657US2025062117A1Methods for forming low-k dielectric materials with reduced dielectric constant and increased densityAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 3757US2025259835A1Method of integrated copper oxide removal and low k repair processAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 3856US11289369B2Low-k dielectric with self-forming barrier layerAPPLIED MATERIALS INC·Filed 2020·Granted Mar 29, 2022·0 cites·19 claims
- 3956US2020075321A1Non-uv high hardness low k film depositionAPPLIED MATERIALS INC·Filed 2019·Application pending·0 cites
- 4056US2024420953A1Systems and methods for improving mechanical strength of low dielectric constant materialsAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 4156US2025357107A1Rf pulsing assisted low-k material deposition with high densityAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 4256US2025280404A1Communication method and communication apparatusHUAWEI TECH CO LTD·Filed 2025·Application pending·0 cites
- 4356US2024387167A1Methods for forming low-k dielectric materials with increased etch selectivityAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 4455US2025054749A1Rf pulsing assisted low-k film deposition with high mechanical strengthAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 4555US2024363337A1Methods for forming low-k dielectric materialsAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 4655US2024332005A1Methods for depositing dielectric films with increased stabilityAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 4755US2025069884A1Methods for forming low-k dielectric materials with reduced dielectric constant and high mechanical strengthAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 4854US2025112038A1Methods for forming low-k dielectric materials with reduced dielectric constant and enhanced electrical propertiesAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 4954US2024361207A1Wear diagnosis system and method for floating tile of oil receiver based on industrial internetHUANENG LANCANG RIVER HYDROPOWER INC·Filed 2024·Application pending·0 cites
- 5053US12375255B2Interference coordination method and apparatusHUAWEI TECH CO LTD·Filed 2022·Granted Jul 29, 2025·0 cites·20 claims
Showing the top 50 of 88 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →