Inventor · disambiguated record
Bradley D. Boland
Also filed as: BOLAND BRADLEY D · BOLAND BRADLEY DAVID
7 granted patents·493 citations·filing 1999–2003
90Inventor score
Technology areasH10W
Files withAMKOR TECHNOLOGY INC7
Top patents by PatentIndex Score
7 records- 0193US6630726B1Power semiconductor package with strapAMKOR TECHNOLOGY INC·Filed 2001·Granted Oct 7, 2003·102 cites·29 claims
- 0290US6707138B2Semiconductor device including metal strap electrically coupled between semiconductor die and metal leadframeAMKOR TECHNOLOGY INC·Filed 2002·Granted Mar 16, 2004·78 cites·26 claims
- 0389US6756658B1Making two lead surface mounting high power microleadframe semiconductor packagesAMKOR TECHNOLOGY INC·Filed 2001·Granted Jun 29, 2004·67 cites·20 claims
- 0489US6521982B1Packaging high power integrated circuit devicesAMKOR TECHNOLOGY INC·Filed 2000·Granted Feb 18, 2003·52 cites·23 claims
- 0588US6873041B1Power semiconductor package with strapAMKOR TECHNOLOGY INC·Filed 2003·Granted Mar 29, 2005·52 cites·18 claims
- 0687US6198163B1Thin leadframe-type semiconductor package having heat sink with recess and exposed surfaceAMKOR TECHNOLOGY INC·Filed 1999·Granted Mar 6, 2001·102 cites·17 claims
- 0784US6396130B1Semiconductor package having multiple dies with independently biased back surfacesAMKOR TECHNOLOGY INC·Filed 2001·Granted May 28, 2002·40 cites·30 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →