Inventor · disambiguated record
Brunella Cafra
Also filed as: CAFRA BRUNELLA
1 granted patent·2 pending applications·0 citations·filing 2022–2024
7Inventor score
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3 records- 0150US2025125232A1Wettable metalization multilayer with increased adhesion energy, integrated electronic device having a wettable metalization multilayer and manufacturing processST MICROELECTRONICS INT NV·Filed 2024·Application pending·0 cites
- 0243US11894432B2Back side contact structure for a semiconductor device and corresponding manufacturing processST MICROELECTRONICS SRL·Filed 2022·Granted Feb 6, 2024·0 cites·20 claims
- 0340US2023128739A1Cmp process applied to a thin sic wafer for stress release and damage recoveryST MICROELECTRONICS SRL·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →