Inventor · disambiguated record
Bradley P. Jones
Also filed as: ARNDT RUSSELL H · JONES BRADLEY P · JONES BRADLEY PAUL
11 granted patents·11 pending applications·242 citations·filing 1997–2015
91Inventor score
Top patents by PatentIndex Score
22 records- 0194US7369911B1Methods, systems, and computer program products for managing movement of work-in-process materials in an automated manufacturing environmentIBM·Filed 2007·Granted May 6, 2008·65 cites·6 claims
- 0283US6117778ASemiconductor wafer edge bead removal method and toolIBM·Filed 1998·Granted Sep 12, 2000·60 cites·9 claims
- 0379US7480538B2Methods, systems, and computer program products for managing movement of work-in-process materials in an automated manufacturing environmentIBM·Filed 2007·Granted Jan 20, 2009·6 cites·14 claims
- 0469US6171513B1Chemical-mechanical polishing system having a bi-material wafer backing film and two-piece wafer carrierIBM·Filed 1999·Granted Jan 9, 2001·30 cites·20 claims
- 0562US5985768AMethod of forming a semiconductorIBM·Filed 1997·Granted Nov 16, 1999·21 cites·39 claims
- 0660US2007087541A1Method and apparatus for deposition & formation of metal silicidesGIEWONT KENNETH J·Filed 2006·Application pending·0 cites
- 0759US6497784B1Semiconductor wafer edge bead removal method and toolIBM·Filed 1999·Granted Dec 24, 2002·20 cites·3 claims
- 0857US2011079702A1Forming a protective layer on a mold and mold having a protective layerIBM·Filed 2009·Application pending·0 cites
- 0955US2008319565A1System and methods for managing process flow changesIBM·Filed 2007·Application pending·0 cites
- 1055US2008167743A1Methods, systems, and computer program products for managing movement of work-in-process materials in an automated manufacturing environmentIBM·Filed 2007·Application pending·0 cites
- 1154US6060388AConductors for microelectronic circuits and method of manufactureIBM·Filed 1997·Granted May 9, 2000·20 cites·24 claims
- 1253US2008306797A1Method and system for automated resource management and optimizationIBM·Filed 2007·Application pending·0 cites
- 1352US6344414B1Chemical-mechanical polishing system having a bi-material wafer backing film assemblyIBM·Filed 1999·Granted Feb 5, 2002·15 cites·20 claims
- 1450US8668834B2Protecting a mold having a substantially planar surface provided with a plurality of mold cavitiesJONES BRADLEY P·Filed 2012·Granted Mar 11, 2014·0 cites·9 claims
- 1549US7208414B2Method for enhanced uni-directional diffusion of metal and subsequent silicide formationIBM·Filed 2004·Granted Apr 24, 2007·3 cites·23 claims
- 1648US2005067745A1Method and apparatus for deposition & formation of metal silicidesFiled 2003·Application pending·0 cites
- 1747US2007128867A1Method for enhanced uni-directional diffusion of metal and subsequent silicide formationIBM·Filed 2007·Application pending·0 cites
- 1846US7129169B2Method for controlling voiding and bridging in silicide formationIBM·Filed 2004·Granted Oct 31, 2006·2 cites·6 claims
- 1944US2015325531A1Through crack stop viaIBM·Filed 2014·Application pending·0 cites
- 2044US2009181532A1Integration scheme for extension of via opening depthIBM·Filed 2008·Application pending·0 cites
- 2137US2004137745A1Method and apparatus for removing backside edge polymerIBM·Filed 2003·Application pending·0 cites
- 2234US2016260674A1Removal of integrated circuit chips from a waferGLOBALFOUNDRIES INC·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →