Inventor · disambiguated record
Bruno Michel
Also filed as: MICHEL BRUNO
100 granted patents·11 pending applications·1,574 citations·filing 1991–2023
99Inventor score
Top patents by PatentIndex Score
111 records- 0199US7928565B2Semiconductor device with a high thermal dissipation efficiencyIBM·Filed 2010·Granted Apr 19, 2011·67 cites·9 claims
- 0298US5817242AStamp for a lithographic processIBM·Filed 1996·Granted Oct 6, 1998·265 cites·9 claims
- 0397US8363402B2Integrated circuit stackIBM·Filed 2008·Granted Jan 29, 2013·47 cites·20 claims
- 0496US7808780B2Variable flow computer cooling system for a data center and method of operationIBM·Filed 2008·Granted Oct 5, 2010·53 cites·3 claims
- 0594US9630862B2Desalination system and method for desalinationIBM·Filed 2016·Granted Apr 25, 2017·11 cites·19 claims
- 0694US8106505B2Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assemblyBERNSTEIN KERRY·Filed 2007·Granted Jan 31, 2012·18 cites·1 claims
- 0794US7740472B2Method and device for flowing a liquid on a surfaceIBM·Filed 2007·Granted Jun 22, 2010·19 cites·20 claims
- 0894US7547582B2Method of fabricating a surface adapting cap with integral adapting material for single and multi chip assembliesIBM·Filed 2006·Granted Jun 16, 2009·36 cites·5 claims
- 0993US10091909B2Method and device for cooling a heat generating componentGLOBALFOUNDRIES INC·Filed 2015·Granted Oct 2, 2018·13 cites·12 claims
- 1093US9416031B2Desalination system and method for desalinationIBM·Filed 2013·Granted Aug 16, 2016·17 cites·18 claims
- 1193US9252072B2Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assemblyIBM·Filed 2013·Granted Feb 2, 2016·8 cites·20 claims
- 1293US8659898B2Integrated circuit stackBRUNSCHWILER THOMAS J·Filed 2012·Granted Feb 25, 2014·15 cites·4 claims
- 1393US8427833B2Thermal power plane for integrated circuitsBAROWSKI HARRY·Filed 2010·Granted Apr 23, 2013·19 cites·24 claims
- 1493US7866173B2Variable performance server system and method of operationIBM·Filed 2008·Granted Jan 11, 2011·35 cites·20 claims
- 1593US7255153B2High performance integrated MLC cooling device for high power density ICS and method for manufacturingIBM·Filed 2005·Granted Aug 14, 2007·25 cites·17 claims
- 1693US5925259ALithographic surface or thin layer modificationIBM·Filed 1996·Granted Jul 20, 1999·154 cites·9 claims
- 1792US9905505B2Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assemblyIBM·Filed 2015·Granted Feb 27, 2018·5 cites·19 claims
- 1892US9252071B2Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assemblyIBM·Filed 2013·Granted Feb 2, 2016·7 cites·20 claims
- 1992US8413712B2Cooling deviceBRUNSCHWILER THOMAS J·Filed 2006·Granted Apr 9, 2013·27 cites·19 claims
- 2091US8004832B2Variable flow computer cooling system for a data center and method of operationIBM·Filed 2010·Granted Aug 23, 2011·23 cites·17 claims
- 2191US7271034B2Semiconductor device with a high thermal dissipation efficiencyIBM·Filed 2005·Granted Sep 18, 2007·17 cites·4 claims
- 2291US6596346B2Silicone elastomer stamp with hydrophilic surfaces and method of making sameIBM·Filed 2001·Granted Jul 22, 2003·49 cites·21 claims
- 2391US6521285B1Method for printing a catalyst on substrates for electroless depositionIBM·Filed 2000·Granted Feb 18, 2003·50 cites·24 claims
- 2490US9905506B2Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assemblyIBM·Filed 2015·Granted Feb 27, 2018·4 cites·19 claims
- 2590US8253234B2Optimized semiconductor packaging in a three-dimensional stackBAROWSKI HARRY·Filed 2010·Granted Aug 28, 2012·11 cites·6 claims
- 2690US7748440B2Patterned structure for a thermal interfaceIBM·Filed 2005·Granted Jul 6, 2010·19 cites·14 claims
- 2788US7713789B2Semiconductor device with a high thermal dissipation efficiencyIBM·Filed 2007·Granted May 11, 2010·12 cites·4 claims
- 2888US7532475B2Semiconductor chip assembly with flexible metal cantileversIBM·Filed 2006·Granted May 12, 2009·18 cites·17 claims
- 2988US6798464B2Liquid crystal displayIBM·Filed 2002·Granted Sep 28, 2004·34 cites·16 claims
- 3087US8107234B2Variable flow computer cooling system for a data center and method of operationBRUNSCHWILER THOMAS J·Filed 2010·Granted Jan 31, 2012·16 cites·15 claims
- 3187US7168939B2System, method, and apparatus for multilevel UV molding lithography for air bearing surface patterningHITACHI GLOBAL STORAGE TECH·Filed 2004·Granted Jan 30, 2007·30 cites·16 claims
- 3287US6794589B2Multiple electrical switch arrangementITT MFG ENTERPRISES INC·Filed 2003·Granted Sep 21, 2004·36 cites·11 claims
- 3386US9437766B2Photovoltaic thermal hybrid systems and method of operation thereofIBM·Filed 2013·Granted Sep 6, 2016·7 cites·12 claims
- 3486US7434512B2Printing in a mediumIBM·Filed 2003·Granted Oct 14, 2008·20 cites·1 claims
- 3586US7235464B2Patterning methodIBM·Filed 2003·Granted Jun 26, 2007·30 cites·8 claims
- 3685US8805132B2Integrated circuit package connected to a data transmission mediumBAROWSKI HARRY·Filed 2011·Granted Aug 12, 2014·8 cites·14 claims
- 3785US5804709ACantilever deflection sensor and use thereofIBM·Filed 1995·Granted Sep 8, 1998·92 cites·20 claims
- 3884US8629554B2Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assemblyBERNSTEIN KERRY·Filed 2009·Granted Jan 14, 2014·6 cites·7 claims
- 3984US7282799B2Thermal interface with a patterned structureIBM·Filed 2006·Granted Oct 16, 2007·12 cites·16 claims
- 4082US8487427B2Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assemblyBERNSTEIN KERRY·Filed 2009·Granted Jul 16, 2013·5 cites·11 claims
- 4180US10622294B2Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assemblyIBM·Filed 2017·Granted Apr 14, 2020·1 cites·20 claims
- 4280US10586760B2Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assemblyIBM·Filed 2017·Granted Mar 10, 2020·1 cites·20 claims
- 4380US10278306B2Method and device for cooling a heat generating componentGLOBALFOUNDRIES INC·Filed 2015·Granted Apr 30, 2019·3 cites·8 claims
- 4480US9219183B2Photovoltaic thermal hybrid solar receiversIBM·Filed 2013·Granted Dec 22, 2015·5 cites·15 claims
- 4580US6569575B1Optical lithography beyond conventional resolution limitsIBM·Filed 1997·Granted May 27, 2003·43 cites·44 claims
- 4680US6096386AMethod of oriented depositing chemically defined bodiesIBM·Filed 1996·Granted Aug 1, 2000·50 cites·13 claims
- 4779US9153722B2Photovoltaic module cooling devicesIBM·Filed 2013·Granted Oct 6, 2015·5 cites·15 claims
- 4879US8476112B2Optimized semiconductor packaging in a three-dimensional stackBAROWSKI HARRY·Filed 2012·Granted Jul 2, 2013·4 cites·8 claims
- 4979US8405998B2Heat sink integrated power delivery and distribution for integrated circuitsBAROWSKI HARRY·Filed 2010·Granted Mar 26, 2013·5 cites·24 claims
- 5077US8336456B2Printing in a mediumBIETSCH ALEXANDER·Filed 2011·Granted Dec 25, 2012·3 cites·3 claims
Showing the top 50 of 111 patent records by PatentIndex Score.
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