Inventor · disambiguated record
Brook Raymond
Also filed as: RAYMOND BROOK D · RAYMOND BROOK DAVID · Raymond Brook
38 granted patents·6 pending applications·320 citations·filing 1991–2023
97Inventor score
Top patents by PatentIndex Score
44 records- 0199US11037912B1LED color displays with multiple LEDs connected in series and parallel in different sub-pixels of a pixelX DISPLAY COMPANY TECH LTD·Filed 2020·Granted Jun 15, 2021·26 cites·20 claims
- 0298US11488943B2Modules with integrated circuits and devicesX DISPLAY COMPANY TECH LTD·Filed 2020·Granted Nov 1, 2022·6 cites·20 claims
- 0398US10224231B2Micro-transfer-printable flip-chip structures and methodsX CELEPRINT LTD·Filed 2017·Granted Mar 5, 2019·22 cites·20 claims
- 0496US10395966B2Micro-transfer-printable flip-chip structures and methodsX CELEPRINT LTD·Filed 2018·Granted Aug 27, 2019·17 cites·20 claims
- 0595US10832935B2Multi-level micro-device tethersX DISPLAY COMPANY TECH LTD·Filed 2018·Granted Nov 10, 2020·9 cites·28 claims
- 0695US10600671B2Micro-transfer-printable flip-chip structures and methodsX CELEPRINT LTD·Filed 2019·Granted Mar 24, 2020·11 cites·18 claims
- 0795US10453826B2Voltage-balanced serial iLED pixel and displayX CELEPRINT LTD·Filed 2017·Granted Oct 22, 2019·14 cites·20 claims
- 0895US10332868B2Stacked pixel structuresX CELEPRINT LTD·Filed 2018·Granted Jun 25, 2019·9 cites·19 claims
- 0993US10796971B2Pressure-activated electrical interconnection with additive repairX DISPLAY COMPANY TECH LTD·Filed 2018·Granted Oct 6, 2020·7 cites·22 claims
- 1092US10690920B2Displays with transparent bezelsX CELEPRINT LTD·Filed 2018·Granted Jun 23, 2020·5 cites·20 claims
- 1191US12074583B2Printing components to adhesive substrate postsX DISPLAY COMPANY TECH LTD·Filed 2021·Granted Aug 27, 2024·2 cites·20 claims
- 1291US10431487B2Micro-transfer-printable flip-chip structures and methodsX CELEPRINT LTD·Filed 2018·Granted Oct 1, 2019·5 cites·25 claims
- 1390US11881475B2Modules with integrated circuits and devicesX DISPLAY COMPANY TECH LTD·Filed 2022·Granted Jan 23, 2024·1 cites·22 claims
- 1490US11101417B2Structures and methods for electrically connecting printed componentsX DISPLAY COMPANY TECH LTD·Filed 2019·Granted Aug 24, 2021·5 cites·20 claims
- 1590US10910355B2Bezel-free displaysX DISPLAY COMPANY TECH LTD·Filed 2018·Granted Feb 2, 2021·6 cites·17 claims
- 1689US11540398B2Methods of making printed structuresX DISPLAY COMPANY TECH LTD·Filed 2022·Granted Dec 27, 2022·1 cites·20 claims
- 1789US11024608B2Structures and methods for electrical connection of micro-devices and substratesX DISPLAY COMPANY TECH LTD·Filed 2018·Granted Jun 1, 2021·6 cites·19 claims
- 1889US10593827B2Device source wafers with patterned dissociation interfacesX CELEPRINT LTD·Filed 2018·Granted Mar 17, 2020·2 cites·20 claims
- 1989US5378926ABonding of integrated circuit chip to carrier using gold/tin eutectic alloy and refractory metal nitride barrier layer to block migration of tin through via holesHUGHES AIRCRAFT CO·Filed 1994·Granted Jan 3, 1995·98 cites·9 claims
- 2088US11189605B2Displays with transparent bezelsX DISPLAY COMPANY TECH LTD·Filed 2018·Granted Nov 30, 2021·5 cites·24 claims
- 2187US10944027B2Pixel modules with controllers and light emittersX DISPLAY COMPANY TECH LTD·Filed 2019·Granted Mar 9, 2021·4 cites·22 claims
- 2284US11705439B2LED color displays with multi-LED sub-pixelsX DISPLAY COMPANY TECH LTD·Filed 2021·Granted Jul 18, 2023·1 cites·16 claims
- 2384US11670533B2Multi-level micro-device tethersX DISPLAY COMPANY TECH LTD·Filed 2020·Granted Jun 6, 2023·1 cites·20 claims
- 2482US12249532B2Multi-level micro-device tethersX DISPLAY COMPANY TECH LTD·Filed 2023·Granted Mar 11, 2025·0 cites·14 claims
- 2582US10964583B2Micro-transfer-printable flip-chip structures and methodsX DISPLAY COMPANY TECH LTD·Filed 2019·Granted Mar 30, 2021·2 cites·23 claims
- 2681US12482799B2Modules with integrated circuits and devicesX DISPLAY COMPANY TECH LTD·Filed 2023·Granted Nov 25, 2025·0 cites·20 claims
- 2777US11600744B2Device source wafers with patterned dissociation interfacesX DISPLAY COMPANY TECH LTD·Filed 2021·Granted Mar 7, 2023·0 cites·17 claims
- 2872US5156998ABonding of integrated circuit chip to carrier using gold/tin eutectic alloy and refractory metal barrier layer to block migration of tin through via holesHUGHES AIRCRAFT CO·Filed 1991·Granted Oct 20, 1992·40 cites·10 claims
- 2972US2023091571A1Methods of making printed structuresX DISPLAY COMPANY TECH LTD·Filed 2022·Application pending·0 cites
- 3071US11233170B2Device source wafers with patterned dissociation interfacesX DISPLAY COMPANY TECH LTD·Filed 2020·Granted Jan 25, 2022·0 cites·14 claims
- 3168US11393730B2Pressure-activated electrical interconnection with additive repairX DISPLAY COMPANY TECH LTD·Filed 2020·Granted Jul 19, 2022·0 cites·21 claims
- 3268US11387153B2Pressure-activated electrical interconnection with additive repairX DISPLAY COMPANY TECH LTD·Filed 2020·Granted Jul 12, 2022·0 cites·18 claims
- 3367US11527691B2Structures and methods for electrically connecting printed componentsX DISPLAY COMPANY TECH LTD·Filed 2021·Granted Dec 13, 2022·0 cites·12 claims
- 3463US11483937B2Methods of making printed structuresX DISPLAY COMPANY TECH LTD·Filed 2019·Granted Oct 25, 2022·0 cites·22 claims
- 3562US11430774B2Bezel-free displaysX DISPLAY COMPANY TECH LTD·Filed 2020·Granted Aug 30, 2022·0 cites·18 claims
- 3660US2021151630A1Pixel modules with controllers and light emittersX DISPLAY COMPANY TECH LTD·Filed 2021·Application pending·0 cites
- 3758US2025046751A1Controlling adhesive reflow for transfer printingX DISPLAY COMPANY TECH LTD·Filed 2023·Application pending·0 cites
- 3857US10749093B2Interconnection by lateral transfer printingX DISPLAY COMPANY TECH LTD·Filed 2019·Granted Aug 18, 2020·0 cites·20 claims
- 3956US10510937B2Interconnection by lateral transfer printingX CELEPRINT LTD·Filed 2018·Granted Dec 17, 2019·0 cites·20 claims
- 4056US2020052164A1Flexible devices and methods using laser lift-offX CELEPRINT LTD·Filed 2019·Application pending·0 cites
- 4154US10505079B2Flexible devices and methods using laser lift-offX CELEPRINT LTD·Filed 2018·Granted Dec 10, 2019·0 cites·21 claims
- 4249US6541301B1Low RF loss direct die attach process and apparatusFiled 1999·Granted Apr 1, 2003·15 cites·21 claims
- 4345US2009108437A1Wafer scale integrated thermal heat spreaderMA COM INC·Filed 2007·Application pending·0 cites
- 4438US2018286734A1Micro-device pockets for transfer printingX CELEPRINT LTD·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →