Methods of making printed structures

Abstract

An example of a method of making a printed structure comprises providing a destination substrate, contact pads disposed on the destination substrate, and a layer of adhesive disposed on the destination substrate. A stamp with a component adhered to the stamp is provided. The component comprises a stamp side in contact with the stamp and a post side opposite the stamp side, a circuit, and connection posts extending from the post side. Each of the connection posts is electrically connected to the circuit. The component is pressed into contact with the adhesive layer to adhere the component to the destination substrate and to form a printed structure having a volume defined between the component and the destination substrate. The stamp is removed and the printed structure is processed to fill or reduce the volume.

1 - 35 . (canceled) 
     
     
         36 . An electrical interconnection structure, comprising:
 a destination substrate, contact pads disposed on or in the destination substrate, and a patterned layer of adhesive disposed on the destination substrate;   a component having a post side and comprising connection posts extending from the post side, each of the connection posts electrically connected to one of the contact pads, and at least a portion of the post side in contact with the patterned layer of adhesive,   wherein the patterned layer of adhesive occupies a portion of a volume between the component and the destination substrate and the patterned layer of adhesive presses the connection posts to the contact pads.   
     
     
         37 . The electrical interconnection structure of  claim 36 , wherein the patterned layer of adhesive does not contact the connection posts. 
     
     
         38 . The electrical interconnection structure of  claim 36 , wherein the adhesive is not crosslinked. 
     
     
         39 . The electrical interconnection structure of  claim 36 , wherein the adhesive is crosslinked. 
     
     
         40 . The electrical interconnection structure of  claim 36 , wherein the layer of adhesive is disposed such that at least a portion of the contact pads are uncovered. 
     
     
         41 . The electrical interconnection structure of  claim 36 , wherein the layer of adhesive is disposed such that no adhesive is between the connection posts and the contact pads. 
     
     
         42 . The electrical interconnection structure of  claim 36 , wherein the layer of adhesive has a thickness over the destination substrate that is less than a distance between the post side and the destination substrate. 
     
     
         43 . The electrical interconnection structure of  claim 36 , wherein the adhesive is cured. 
     
     
         44 . The electrical interconnection structure of  claim 36 , wherein the adhesive pattern is defined by spacing of components over the destination substrate. 
     
     
         45 . The electrical interconnection structure of  claim 36 , wherein the adhesive is one or more of polybenzoxazole (PBO), an epoxy, a polyimide, a photoresist, and an acrylic. 
     
     
         46 . The electrical interconnection structure of  claim 36 , wherein an amount of volumetric contraction is greater than an amount of thermal expansion of the adhesive at an upper working temperature of the adhesive. 
     
     
         47 . The electrical interconnection structure of  claim 36 , wherein the volume is partially unfilled. 
     
     
         48 . The electrical interconnection structure of  claim 36 , wherein the adhesive is wicked over or on one or more surfaces of one or more of the component, the contact pads, and the destination substrate into the volume. 
     
     
         49 . The electrical interconnection structure of  claim 36 , wherein each of the connection posts is electrically conductive and comprises a sharp point. 
     
     
         50 . The electrical interconnection structure of  claim 36 , wherein each of the connection posts is electrically conductive and has a height that is greater than a base width, and a base area that is greater than a peak area. 
     
     
         51 . The electrical interconnection structure of  claim 36 , wherein each of the connection posts comprises a conductive metal. 
     
     
         52 . The electrical interconnection structure of  claim 36 , wherein the component comprises an active circuit. 
     
     
         53 . The electrical interconnection structure of  claim 36 , wherein the component comprises an integrated circuit, a transistor, or an LED. 
     
     
         54 . The electrical interconnection structure of  claim 36 , wherein the component has at least one dimension between 1 micron and 200 microns. 
     
     
         55 . The electrical interconnection structure of  claim 36 , wherein the component comprises more than two connection posts extending from the post side, each of the more than two connection posts electrically connected to the circuit and each of the more than two connection posts connected to one of the contact pads.