Inventor · disambiguated record
Bryan R. Seppala
Also filed as: SEPPALA BRYAN · SEPPALA BRYAN R · SEPPALA BRYAN ROGER
5 granted patents·4 pending applications·240 citations·filing 1985–2024
82Inventor score
Top patents by PatentIndex Score
9 records- 0189US5665639AProcess for manufacturing a semiconductor device bump electrode using a rapid thermal annealCYPRESS SEMICONDUCTOR CORP·Filed 1994·Granted Sep 9, 1997·154 cites·27 claims
- 0286US7736946B2System and method for sealing a MEMS deviceHONEYWELL INT INC·Filed 2007·Granted Jun 15, 2010·16 cites·20 claims
- 0368US4904340ALaser-assisted liquid-phase etching of copper conductorsMICROELECTRONICS & COMPUTER·Filed 1988·Granted Feb 27, 1990·40 cites·19 claims
- 0465US4586778ACompliant pinBMC IND INC·Filed 1985·Granted May 6, 1986·30 cites·10 claims
- 0554US2025239545A1Electrical contacts and systems and techniques for forming electrical contactsHONEYWELL INT INC·Filed 2024·Application pending·0 cites
- 0646US7800190B2Getter on die in an upper sense plate designed systemHONEYWELL INT INC·Filed 2008·Granted Sep 21, 2010·0 cites·13 claims
- 0746US2010020517A1Mems bump pattern die alignment systems and methodsHONEYWELL INT INC·Filed 2008·Application pending·0 cites
- 0843US2009014499A1Automated preform attach for vacuum packagingHONEYWELL INT INC·Filed 2007·Application pending·0 cites
- 0936US2011227173A1Mems sensor with integrated asic packagingHONEYWELL INT INC·Filed 2010·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Bryan R. Seppala files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →