Inventor · disambiguated record
Bret K. Street
Also filed as: STREET BRET · STREET BRET K
85 granted patents·22 pending applications·600 citations·filing 1998–2025
99Inventor score
Top patents by PatentIndex Score
107 records- 0196US11289440B1Combination-bonded die pair packaging and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2020·Granted Mar 29, 2022·3 cites·19 claims
- 0293US11756844B2Semiconductor device with a protection mechanism and associated systems, devices, and methodsMICRON TECHNOLOGY INC·Filed 2021·Granted Sep 12, 2023·2 cites·17 claims
- 0393US6524881B1Method and apparatus for marking a bare semiconductor dieMICRON TECHNOLOGY INC·Filed 2000·Granted Feb 25, 2003·67 cites·74 claims
- 0490US6734032B2Method and apparatus for marking a bare semiconductor dieMICRON TECHNOLOGY INC·Filed 2002·Granted May 11, 2004·44 cites·74 claims
- 0590US6400574B1Molded ball grid arrayMICRON TECHNOLOGY INC·Filed 2000·Granted Jun 4, 2002·49 cites·23 claims
- 0689US10381329B1Semiconductor device with a layered protection mechanism and associated systems, devices, and methodsMICRON TECHNOLOGY INC·Filed 2018·Granted Aug 13, 2019·5 cites·9 claims
- 0789US7557452B1Reinforced, self-aligning conductive structures for semiconductor device components and methods for fabricating sameMICRON TECHNOLOGY INC·Filed 2000·Granted Jul 7, 2009·43 cites·129 claims
- 0889US6692978B2Methods for marking a bare semiconductor dieMICRON TECHNOLOGY INC·Filed 2002·Granted Feb 17, 2004·41 cites·84 claims
- 0986US10475771B2Semiconductor device with an electrically-coupled protection mechanism and associated systems, devices, and methodsMICRON TECHNOLOGY INC·Filed 2018·Granted Nov 12, 2019·4 cites·15 claims
- 1086US9865578B2Methods of manufacturing multi-die semiconductor device packages and related assembliesMICRON TECHNOLOGY INC·Filed 2015·Granted Jan 9, 2018·4 cites·21 claims
- 1186US7276393B2Microelectronic imaging units and methods of manufacturing microelectronic imaging unitsMICRON TECHNOLOGY INC·Filed 2004·Granted Oct 2, 2007·33 cites·7 claims
- 1286US6329832B1Method for in-line testing of flip-chip semiconductor assembliesMICRON TECHNOLOGY INC·Filed 1998·Granted Dec 11, 2001·28 cites·14 claims
- 1385US9589933B2Methods of processing wafer-level assemblies to reduce warpage, and related assembliesMICRON TECHNOLOGY INC·Filed 2014·Granted Mar 7, 2017·6 cites·20 claims
- 1483US11410962B2Methods and systems for manufacturing semiconductor devicesMICRON TECHNOLOGY INC·Filed 2020·Granted Aug 9, 2022·1 cites·22 claims
- 1582US9786612B2Methods of processing wafer-level assemblies to reduce warpage, and related assembliesMICRON TECHNOLOGY INC·Filed 2017·Granted Oct 10, 2017·3 cites·20 claims
- 1682US7498606B2Microelectronic imaging units and methods of manufacturing microelectronic imaging unitsMICRON TECHNOLOGY INC·Filed 2006·Granted Mar 3, 2009·9 cites·25 claims
- 1782US7238543B2Methods for marking a bare semiconductor die including applying a tape having energy-markable propertiesMICRON TECHNOLOGY INC·Filed 2005·Granted Jul 3, 2007·14 cites·24 claims
- 1882US6730998B1Stereolithographic method for fabricating heat sinks, stereolithographically fabricated heat sinks, and semiconductor devices including sameMICRON TECHNOLOGY INC·Filed 2000·Granted May 4, 2004·24 cites·39 claims
- 1981US10943842B2Semiconductor device with a protection mechanism and associated systems, devices, and methodsMICRON TECHNOLOGY INC·Filed 2020·Granted Mar 9, 2021·1 cites·15 claims
- 2081US10861797B2Electrically or temperature activated shape-memory materials for warpage controlMICRON TECHNOLOGY INC·Filed 2018·Granted Dec 8, 2020·2 cites·3 claims
- 2181US10840210B2Methods and systems for manufacturing semiconductor devicesMICRON TECHNOLOGY INC·Filed 2018·Granted Nov 17, 2020·2 cites·11 claims
- 2281US10103134B2Methods of manufacturing multi-die semiconductor device packages and related assembliesMICRON TECHNOLOGY INC·Filed 2017·Granted Oct 16, 2018·2 cites·20 claims
- 2379US7858420B2Microelectronic imaging units and methods of manufacturing microelectronic imaging unitsMICRON TECHNOLOGY INC·Filed 2008·Granted Dec 28, 2010·6 cites·12 claims
- 2479US7786574B2Microelectronic imaging unitsAPTINA IMAGING CORP·Filed 2009·Granted Aug 31, 2010·6 cites·17 claims
- 2579US7655507B2Microelectronic imaging units and methods of manufacturing microelectronic imaging unitsMICRON TECHNOLOGY INC·Filed 2008·Granted Feb 2, 2010·6 cites·19 claims
- 2678US10840209B2Methods and systems for manufacturing semiconductor devicesMICRON TECHNOLOGY INC·Filed 2018·Granted Nov 17, 2020·2 cites·14 claims
- 2778US7094618B2Methods for marking a packaged semiconductor die including applying tape and subsequently marking the tapeMICRON TECHNOLOGY INC·Filed 2004·Granted Aug 22, 2006·25 cites·72 claims
- 2878US2025336774A1Monolithic conductive column in a semiconductor device and associated methodsMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 2977US6503781B2Molded ball grid arrayMICRON TECHNOLOGY INC·Filed 2001·Granted Jan 7, 2003·18 cites·32 claims
- 3077US2025140756A1Monolithic conductive columns in a semiconductor device and associated methodsMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 3176US12080678B2Methods and systems for manufacturing semiconductor devicesMICRON TECHNOLOGY INC·Filed 2022·Granted Sep 3, 2024·0 cites·11 claims
- 3276US7511374B2Microelectronic imaging units having covered image sensorsAPTINA IMAGING CORP·Filed 2006·Granted Mar 31, 2009·5 cites·30 claims
- 3376US6891108B2Semiconductor packages and methods for making the sameMICRON TECHNOLOGY INC·Filed 2001·Granted May 10, 2005·15 cites·13 claims
- 3476US6548764B1Semiconductor packages and methods for making the sameMICRON TECHNOLOGY INC·Filed 2000·Granted Apr 15, 2003·16 cites·14 claims
- 3575US7476955B2Die package having an adhesive flow restriction areaMICRON TECHNOLOGY INC·Filed 2004·Granted Jan 13, 2009·17 cites·14 claims
- 3675US2024379503A1Monolithic conductive column in a semiconductor device and associated methodsMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 3774US10615150B2Semiconductor device with a layered protection mechanism and associated systems, devices, and methodsMICRON TECHNOLOGY INC·Filed 2019·Granted Apr 7, 2020·1 cites·17 claims
- 3874US6916683B2Methods of fabricating a molded ball grid arrayMICRON TECHNOLOGY INC·Filed 2002·Granted Jul 12, 2005·17 cites·27 claims
- 3973US10580710B2Semiconductor device with a protection mechanism and associated systems, devices, and methodsMICRON TECHNOLOGY INC·Filed 2017·Granted Mar 3, 2020·1 cites·18 claims
- 4071US11410973B2Microelectronic device assemblies and packages and related methods and systemsMICRON TECHNOLOGY INC·Filed 2020·Granted Aug 9, 2022·0 cites·24 claims
- 4171US10748857B2Die features for self-alignment during die bondingMICRON TECHNOLOGY INC·Filed 2018·Granted Aug 18, 2020·1 cites·16 claims
- 4271US10741528B2Semiconductor device with an electrically-coupled protection mechanism and associated systems, devices, and methodsMICRON TECHNOLOGY INC·Filed 2019·Granted Aug 11, 2020·1 cites·20 claims
- 4370US12300570B2Grindable heat sink for multiple die packagingMICRON TECHNOLOGY INC·Filed 2022·Granted May 13, 2025·0 cites·20 claims
- 4470US2025218990A1Bond pads for semiconductor die assemblies and associated methods and systemsMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 4568US12255163B2Bond pads for semiconductor die assemblies and associated methods and systemsMICRON TECHNOLOGY INC·Filed 2022·Granted Mar 18, 2025·0 cites·13 claims
- 4668US11114415B2Semiconductor device with a layered protection mechanism and associated systems, devices, and methodsMICRON TECHNOLOGY INC·Filed 2020·Granted Sep 7, 2021·0 cites·11 claims
- 4768US6776599B2Method and apparatus for gate blocking X-outs during a molding processMICRON TECHNOLOGY INC·Filed 2002·Granted Aug 17, 2004·11 cites·6 claims
- 4868US2025385205A1Modular construction of hybrid-bonded semiconductor die assemblies and related systems and methodsMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 4967US12424516B2Monolithic conductive column in a semiconductor device and associated methodsMICRON TECHNOLOGY INC·Filed 2022·Granted Sep 23, 2025·0 cites·8 claims
- 5067US11658129B2Electrically or temperature activated shape-memory materials for warpage controlMICRON TECHNOLOGY INC·Filed 2020·Granted May 23, 2023·0 cites·10 claims
Showing the top 50 of 107 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →