Inventor · disambiguated record
Bumjoon Hong
Also filed as: HONG BUMJOON
10 granted patents·2 pending applications·94 citations·filing 2006–2010
89Inventor score
Technology areasH10W
Top patents by PatentIndex Score
12 records- 0194US8067268B2Stacked integrated circuit package system and method for manufacturing thereofCARSON FLYNN·Filed 2010·Granted Nov 29, 2011·26 cites·15 claims
- 0292US7750454B2Stacked integrated circuit package systemSTATS CHIPPAC LTD·Filed 2008·Granted Jul 6, 2010·21 cites·5 claims
- 0389US7659609B2Integrated circuit package-in-package system with carrier interposerSTATS CHIPPAC LTD·Filed 2007·Granted Feb 9, 2010·19 cites·18 claims
- 0484US7872340B2Integrated circuit package system employing an offset stacked configurationSTATS CHIPPAC LTD·Filed 2008·Granted Jan 18, 2011·10 cites·18 claims
- 0579US8383458B2Integrated circuit package system employing an offset stacked configuration and method for manufacturing thereofSTATS CHIPPAC LTD·Filed 2010·Granted Feb 26, 2013·4 cites·15 claims
- 0673US7741154B2Integrated circuit package system with stacking moduleSTATS CHIPPAC LTD·Filed 2008·Granted Jun 22, 2010·5 cites·20 claims
- 0771US9236319B2Stacked integrated circuit package systemHA JONG-WOO·Filed 2008·Granted Jan 12, 2016·5 cites·16 claims
- 0864US7812435B2Integrated circuit package-in-package system with side-by-side and offset stackingSTATS CHIPPAC LTD·Filed 2007·Granted Oct 12, 2010·2 cites·17 claims
- 0962US8642383B2Dual-die package structure having dies externally and simultaneously connected via bump electrodes and bond wiresHA JONG-WOO·Filed 2006·Granted Feb 4, 2014·2 cites·5 claims
- 1047US8093727B2Integrated circuit package-in-package system with side-by-side and offset stacking and method for manufacturing thereofPARK SOO-SAN·Filed 2010·Granted Jan 10, 2012·0 cites·17 claims
- 1144US2009152740A1Integrated circuit package system with flip chipPARK SOO-SAN·Filed 2007·Application pending·0 cites
- 1242US2009001549A1Integrated circuit package system with symmetric packagingPARK SOO-SAN·Filed 2007·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Bumjoon Hong files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →