Inventor · disambiguated record
Bun Kian Tay
Also filed as: TAY BUN KIAN
3 granted patents·1 pending application·0 citations·filing 2018–2022
43Inventor score
Technology areasH10W
Files withINFINEON TECHNOLOGIES AG4
Top patents by PatentIndex Score
4 records- 0162US2023051100A1Semiconductor package having a lead frame and a clip frameINFINEON TECHNOLOGIES AG·Filed 2022·Application pending·0 cites
- 0255US11515244B2Clip frame assembly, semiconductor package having a lead frame and a clip frame, and method of manufactureINFINEON TECHNOLOGIES AG·Filed 2020·Granted Nov 29, 2022·0 cites·11 claims
- 0352US10964628B2Clip frame assembly, semiconductor package having a lead frame and a clip frame, and method of manufactureINFINEON TECHNOLOGIES AG·Filed 2019·Granted Mar 30, 2021·0 cites·12 claims
- 0440US10978378B2Encapsulated leadless package having an at least partially exposed interior sidewall of a chip carrierINFINEON TECHNOLOGIES AG·Filed 2018·Granted Apr 13, 2021·0 cites·13 claims
Join the waitlist — get patent alerts
Get an alert when Bun Kian Tay files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →