Inventor · disambiguated record
Byung-Hee Kim
Also filed as: KIM BYUNG H · KIM BYUNG J · KIM BYUNG-HEE
92 granted patents·39 pending applications·1,655 citations·filing 1997–2024
99Inventor score
Files withSAMSUNG ELECTRONICS CO LTD73SAMSUNG MOBILE DISPLAY CO LTD7SAMSUNG DISPLAY DEVICES CO LTD4LG ELECTRONICS INC3AHN SANG HOON2
Top patents by PatentIndex Score
131 records- 0198US6144060AIntegrated circuit devices having buffer layers therein which contain metal oxide stabilized by heat treatment under low temperatureSAMSUNG ELECTRONICS CO LTD·Filed 1998·Granted Nov 7, 2000·457 cites·17 claims
- 0297US6815285B2Methods of forming dual gate semiconductor devices having a metal nitride layerSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Nov 9, 2004·147 cites·27 claims
- 0397US6391769B1Method for forming metal interconnection in semiconductor device and interconnection structure fabricated therebySAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted May 21, 2002·177 cites·21 claims
- 0495US7825584B2Organic light emitting display device and method for fabricating the sameSAMSUNG MOBILE DISPLAY CO LTD·Filed 2006·Granted Nov 2, 2010·28 cites·33 claims
- 0592US7804466B2Display device and driving method thereofSAMSUNG MOBILE DISPLAY CO LTD·Filed 2005·Granted Sep 28, 2010·13 cites·25 claims
- 0691US8426308B2Method of forming through silicon via of semiconductor device using low-k dielectric materialHAN KYU-HEE·Filed 2011·Granted Apr 23, 2013·16 cites·20 claims
- 0791US7098131B2Methods for forming atomic layers and thin films including tantalum nitride and devices including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Aug 29, 2006·48 cites·25 claims
- 0891US6204902B1Flexible plate liquid crystal display deviceSAMSUNG DISPLAY DEVICES CO LTD·Filed 1999·Granted Mar 20, 2001·130 cites·3 claims
- 0990US10199263B2Semiconductor devices and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Feb 5, 2019·7 cites·20 claims
- 1090US6432820B1Method of selectively depositing a metal layer in an opening in a dielectric layer by forming a metal-deposition-prevention layer around the opening of the dielectric layerSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Aug 13, 2002·43 cites·33 claims
- 1187US8173506B2Method of forming buried gate electrode utilizing formation of conformal gate oxide and gate electrode layersJUNG EUN-JI·Filed 2009·Granted May 8, 2012·17 cites·17 claims
- 1286US7846796B2Semiconductor devices including buried bit linesSAMSUNG ELECTRONICS CO LTD·Filed 2010·Granted Dec 7, 2010·6 cites·5 claims
- 1386US7749840B2Methods of forming a semiconductor device including buried bit lineSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Jul 6, 2010·9 cites·39 claims
- 1486US6229166B1Ferroelectric random access memory device and fabrication method thereforSAMSUNG ELECTRONICS CO LTD·Filed 1998·Granted May 8, 2001·66 cites·15 claims
- 1585US7838880B2Flat panel display deviceSAMSUNG MOBILE DISPLAY CO LTD·Filed 2006·Granted Nov 23, 2010·13 cites·9 claims
- 1685US7244645B2Methods of forming electronic devices including high-k dielectric layers and electrode barrier layers and related structuresSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Jul 17, 2007·10 cites·20 claims
- 1785US7148100B2Methods of forming electronic devices including high-k dielectric layers and electrode barrier layersSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Dec 12, 2006·30 cites·7 claims
- 1885US6787468B2Method of fabricating metal lines in a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Sep 7, 2004·40 cites·3 claims
- 1984US9812450B2Semiconductor devices and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Nov 7, 2017·4 cites·10 claims
- 2082US10128148B2Methods for fabricating semiconductor devices including surface treatment processesSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Nov 13, 2018·4 cites·18 claims
- 2182US10008407B2Methods of manufacturing semiconductor devices including conductive structuresSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Jun 26, 2018·4 cites·19 claims
- 2282US9728604B2Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Aug 8, 2017·3 cites·20 claims
- 2381US8963332B2Semiconductor device with dummy linesSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Feb 24, 2015·5 cites·20 claims
- 2481US6697122B2Apparatus for adaptively processing an externally input video signal in digital televisionSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Feb 24, 2004·21 cites·10 claims
- 2579US6586340B2Wafer processing apparatus and wafer processing method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Jul 1, 2003·19 cites·19 claims
- 2678US10867923B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Dec 15, 2020·2 cites·8 claims
- 2778US10304734B2Semiconductor devices and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted May 28, 2019·2 cites·20 claims
- 2878US7638433B2Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Dec 29, 2009·7 cites·20 claims
- 2978US6340998B1Thin film transistor liquid crystal display including at least three transistors associated with an unit pixelSAMSUNG DISPLAY DEVICES CO LTD·Filed 1999·Granted Jan 22, 2002·57 cites·12 claims
- 3076US7759263B2Methods for fabricating improved gate dielectricsSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Jul 20, 2010·5 cites·16 claims
- 3176US7550353B2Method of forming semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Jun 23, 2009·6 cites·22 claims
- 3275US10388563B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Aug 20, 2019·2 cites·19 claims
- 3375US10062609B2Semiconductor devices and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Aug 28, 2018·2 cites·20 claims
- 3475US9812353B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Nov 7, 2017·2 cites·20 claims
- 3575US6849555B2Wafer processing apparatus and wafer processing method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Feb 1, 2005·15 cites·39 claims
- 3675US6602782B2Methods for forming metal wiring layers and metal interconnects and metal interconnects formed therebySAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Aug 5, 2003·18 cites·36 claims
- 3775US5879982AMethods of forming integrated circuit memory devices having improved electrical interconnects thereinSAMSUNG ELECTRONICS CO LTD·Filed 1997·Granted Mar 9, 1999·38 cites·9 claims
- 3874US8501606B2Methods of forming wiring structuresLEE EUN-OK·Filed 2010·Granted Aug 6, 2013·4 cites·17 claims
- 3974US7423372B2Organic electroluminescence display device having organic passivation layerSAMSUNG SDI CO LTD·Filed 2005·Granted Sep 9, 2008·3 cites·12 claims
- 4072US10700164B2Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jun 30, 2020·1 cites·20 claims
- 4172US10418326B2Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Sep 17, 2019·2 cites·21 claims
- 4272US7918428B2Supporting apparatus of display deviceLG ELECTRONICS INC·Filed 2009·Granted Apr 5, 2011·11 cites·19 claims
- 4371US10217820B2Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Feb 26, 2019·1 cites·19 claims
- 4471US9773699B2Methods of forming wiring structures including a plurality of metal layersSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Sep 26, 2017·2 cites·15 claims
- 4570US6981772B2Apparatus to align panels in projectorLG ELECTRONICS INC·Filed 2001·Granted Jan 3, 2006·9 cites·18 claims
- 4669US7170225B2Flat panel display for displaying screens at both sidesSAMSUNG SDI CO LTD·Filed 2004·Granted Jan 30, 2007·12 cites·12 claims
- 4769US7067420B2Methods for forming a metal layer on a semiconductorSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Jun 27, 2006·12 cites·27 claims
- 4868US9224593B2Method of manufacturing a semiconductor device having a porous, low-k dielectric layerAHN SANG-HOON·Filed 2011·Granted Dec 29, 2015·2 cites·5 claims
- 4968US7928498B2Gate structures in semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Apr 19, 2011·3 cites·2 claims
- 5068US7759303B2Method for improving solubility and folding efficiency of target proteins using RNA as molecular chaperoneBIOTRION CO LTD·Filed 2006·Granted Jul 20, 2010·1 cites·11 claims
Showing the top 50 of 131 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →