Inventor · disambiguated record
Byung-Seo Kim
Also filed as: KIM BYUNG SEO
22 granted patents·4 pending applications·361 citations·filing 2002–2015
96Inventor score
Top patents by PatentIndex Score
26 records- 0198US8179711B2Semiconductor memory device with stacked memory cell and method of manufacturing the stacked memory cellKIM SUNG-MIN·Filed 2008·Granted May 15, 2012·122 cites·32 claims
- 0297US8901749B2Semiconductor packages and electronic systems including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Dec 2, 2014·29 cites·23 claims
- 0395US8971118B2Methods of forming non-volatile memory devices including vertical NAND stringsJIN BEOM-JUN·Filed 2014·Granted Mar 3, 2015·35 cites·19 claims
- 0494US8659946B2Non-volatile memory devices including vertical NAND strings and methods of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2012·Granted Feb 25, 2014·13 cites·14 claims
- 0594US8325527B2Non-volatile memory devices including vertical NAND strings and methods of forming the sameJIN BEOM-JUN·Filed 2009·Granted Dec 4, 2012·30 cites·15 claims
- 0692US7453716B2Semiconductor memory device with stacked control transistorsSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Nov 18, 2008·28 cites·41 claims
- 0789US8222089B2Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the sameCHOI KYOUNG-SEI·Filed 2011·Granted Jul 17, 2012·10 cites·12 claims
- 0886US9373633B2Methods of forming non-volatile memory devices including vertical NAND stringsJIN BEOM-JUN·Filed 2015·Granted Jun 21, 2016·4 cites·18 claims
- 0983US8299627B2Semiconductor packages and electronic systems including the sameKIM HYE-JIN·Filed 2010·Granted Oct 30, 2012·7 cites·16 claims
- 1082US7915727B2Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Mar 29, 2011·8 cites·20 claims
- 1177US7453794B2Channel estimation and synchronization with preamble using polyphase codeUNIV FLORIDA·Filed 2003·Granted Nov 18, 2008·32 cites·8 claims
- 1276US7981750B2Methods of fabrication of channel-stressed semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Jul 19, 2011·6 cites·23 claims
- 1374US9184156B2Semiconductor packages and electronic systems including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Nov 10, 2015·2 cites·20 claims
- 1469US7319254B2Semiconductor memory device having resistor and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Jan 15, 2008·12 cites·23 claims
- 1566US8643193B2Semiconductor packages and electronic systems including the sameKIM HYE-JIN·Filed 2012·Granted Feb 4, 2014·1 cites·7 claims
- 1666US7324613B2Multi-layer differential phase shift keying with bit-interleaved coded modulation and OFDMUNIV FLORIDA·Filed 2003·Granted Jan 29, 2008·13 cites·18 claims
- 1763US7812265B2Semiconductor package, printed circuit board, and electronic deviceSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Oct 12, 2010·3 cites·17 claims
- 1856US8116088B2Semiconductor package and method of forming the same, and printed circuit boardSHIN MU-SEOB·Filed 2008·Granted Feb 14, 2012·2 cites·14 claims
- 1955US7932102B2Phase change memory and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Apr 26, 2011·0 cites·16 claims
- 2052US6794247B2Method of fabricating a semiconductor memory device having resistorSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Sep 21, 2004·4 cites·17 claims
- 2151US8164079B2Phase change memorySONG YOON-JONG·Filed 2011·Granted Apr 24, 2012·0 cites·10 claims
- 2251US2012175580A1Variable resistance memorySONG YOON-JONG·Filed 2012·Application pending·0 cites
- 2345US7620397B2Method for managing scanning of channels in a wireless networkMOTOROLA INC·Filed 2006·Granted Nov 17, 2009·0 cites·17 claims
- 2443US2008159209A1Method and system for allocating channels in a wireless networkMOTOROLA INC·Filed 2007·Application pending·0 cites
- 2541US2007267669A1Phase-changeable memory device and method of manufacturing the sameKIM HYEONG-JUN·Filed 2007·Application pending·0 cites
- 2638US2011069606A1Communication node and method of processing communication fault thereofKOREA ELECTRONICS TELECOMM·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →