Inventor · disambiguated record
Byeongchan Kim
Also filed as: KIM BYEONGCHAN
6 granted patents·6 pending applications·1 citations·filing 2021–2024
68Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD12
Top patents by PatentIndex Score
12 records- 0186US12512427B2Semiconductor device including lower pads having different widths and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 30, 2025·1 cites·19 claims
- 0278US2025015009A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0376US12119306B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Oct 15, 2024·0 cites·20 claims
- 0474US2025105181A1Semiconductor device, semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0571US2024312923A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0669US11682630B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 20, 2023·0 cites·20 claims
- 0767US12199056B2Semiconductor device, semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jan 14, 2025·0 cites·20 claims
- 0863US12451474B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Oct 21, 2025·0 cites·19 claims
- 0963US12021034B2Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 25, 2024·0 cites·20 claims
- 1057US2024347510A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1155US2024178202A1Semiconductor devices including bonded semiconductor layers and manufacturing methods of the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1255US2024128239A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →