Inventor · disambiguated record
Byoung Youp Kim
Also filed as: KIM BYOUNG YOUP
7 granted patents·39 citations·filing 2001–2017
82Inventor score
Top patents by PatentIndex Score
7 records- 0194US9786545B1Method of forming ANA regions in an integrated circuitGLOBALFOUNDRIES INC·Filed 2016·Granted Oct 10, 2017·11 cites·20 claims
- 0293US9337087B1Multilayer structure in an integrated circuit for damage prevention and detection and methods of creating the sameST MICROELECTRONICS INC·Filed 2014·Granted May 10, 2016·13 cites·16 claims
- 0389US9818623B2Method of forming a pattern for interconnection lines and associated continuity blocks in an integrated circuitGLOBALFOUNDRIES INC·Filed 2016·Granted Nov 14, 2017·6 cites·17 claims
- 0483US9646939B2Multilayer structure in an integrated circuit for damage prevention and detection and methods of creating the sameIBM·Filed 2016·Granted May 9, 2017·3 cites·20 claims
- 0572US9812396B1Interconnect structure for semiconductor devices with multiple power rails and redundancyGLOBALFOUNDRIES INC·Filed 2016·Granted Nov 7, 2017·2 cites·8 claims
- 0659US6780463B2Method of forming a MOCVD-TiN thin filmJUSUNG ENG CO LTD·Filed 2001·Granted Aug 24, 2004·4 cites·16 claims
- 0744US10199265B2Variable space mandrel cut for self aligned double patterningGLOBALFOUNDRIES INC·Filed 2017·Granted Feb 5, 2019·0 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →