Inventor · disambiguated record
Byoung-Ho Kwon
Also filed as: KWON BYOUNG HO
25 granted patents·5 pending applications·177 citations·filing 2001–2022
95Inventor score
Top patents by PatentIndex Score
30 records- 0196US8916460B1Semiconductor device and method for fabricating the sameKWON BYOUNG-HO·Filed 2014·Granted Dec 23, 2014·74 cites·8 claims
- 0294US7531456B2Method of forming self-aligned double patternSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted May 12, 2009·29 cites·23 claims
- 0393US9269720B1Methods of fabricating semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Feb 23, 2016·11 cites·20 claims
- 0492US9659940B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted May 23, 2017·10 cites·20 claims
- 0592US9627542B2Semiconductor device and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Apr 18, 2017·6 cites·20 claims
- 0690US11637019B2Method for forming a semiconductor device having protrusion structures on a substrate and a planarized capping insulating layer on the protrusion structuresSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Apr 25, 2023·2 cites·20 claims
- 0787US8398874B2Methods of manufacturing semiconductors using dummy patternsKWON BYOUNG-HO·Filed 2010·Granted Mar 19, 2013·8 cites·16 claims
- 0886US10109529B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Oct 23, 2018·6 cites·11 claims
- 0986US9190407B2Semiconductor device and method for fabricating the sameKWON BYOUNG-HO·Filed 2014·Granted Nov 17, 2015·5 cites·19 claims
- 1082US8053845B2Semiconductor device including dummy gate part and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Nov 8, 2011·7 cites·9 claims
- 1179US10403640B2Semiconductor devices including insulating capping structuresSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Sep 3, 2019·3 cites·20 claims
- 1276US8597081B2Chemical mechanical polishing apparatus having pad conditioning disk and pre-conditioner unitCHOI JAE-KWANG·Filed 2011·Granted Dec 3, 2013·4 cites·20 claims
- 1375US7535052B2Method of fabricating non-volatile memory integrated circuit device and non-volatile memory integrated circuit device fabricated using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted May 19, 2009·4 cites·10 claims
- 1474US9035396B2Semiconductor device including dummy gate part and method of fabricating the sameKWON BYOUNG-HO·Filed 2011·Granted May 19, 2015·3 cites·32 claims
- 1568US8241988B2Photo key and method of fabricating semiconductor device using the photo keyKWON BYOUNG-HO·Filed 2011·Granted Aug 14, 2012·2 cites·20 claims
- 1661US8736058B2Low-resistance conductive pattern structures and methods of fabricating the sameKWON BYOUNG-HO·Filed 2010·Granted May 27, 2014·1 cites·22 claims
- 1761US8030150B2Method of fabricating non-volatile memory integrated circuit device and non-volatile memory integrated circuit device fabricated using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Oct 4, 2011·1 cites·4 claims
- 1860US8018078B2Photo key and method of fabricating semiconductor device using the photo keySAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Sep 13, 2011·1 cites·9 claims
- 1959US11986921B2Chemical mechanical polishing apparatus, chemical mechanical polishing method and method for fabricating semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted May 21, 2024·0 cites·17 claims
- 2056US10964303B2Vehicular apparatus and method for active noise control, and vehicle including vehicular apparatusHYUNDAI MOTOR CO LTD·Filed 2019·Granted Mar 30, 2021·0 cites·18 claims
- 2154US11087990B2Semiconductor device with a stacked structure and a capping insulation layerSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Aug 10, 2021·0 cites·19 claims
- 2253US2016064380A1Semiconductor device and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Application pending·0 cites
- 2348US10741409B2Method of manufacturing a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Aug 11, 2020·0 cites·20 claims
- 2447US2023219191A1Polishing pad, chemical mechanical polishing apparatus including the same, and method for manufacturing semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 2545US2008176403A1Method of polishing a layer and method of manufacturing a semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 2643US9960169B2Methods of manufacturing semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted May 1, 2018·0 cites·6 claims
- 2742US7781330B2Method of fabricating a semiconductor device comprising high and low density patterned contactsSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Aug 24, 2010·0 cites·22 claims
- 2838US9831186B2Methods of manufacturing semiconductor devices using alignment marks to align layersSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Nov 28, 2017·0 cites·20 claims
- 2936US2002151137A1Method for semiconductor device planarizationFiled 2001·Application pending·0 cites
- 3034US2017098653A1Methods of manufacturing semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2016·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Byoung-Ho Kwon files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →