Inventor · disambiguated record
Byoung-Youl Min
Also filed as: MIN BYOUNG Y · MIN BYOUNG YOUL
21 granted patents·13 pending applications·596 citations·filing 1996–2012
96Inventor score
Files withSAMSUNG ELECTRO MECH22MICROMODULE SYSTEMS INC4AMKOR TECHNOLOGY INC2CHO SEUNG-HYUN1KANG MYUNG-SAM1
Top patents by PatentIndex Score
34 records- 0196US7170384B2Printed circuit board having three-dimensional spiral inductor and method of fabricating sameSAMSUNG ELECTRO MECH·Filed 2005·Granted Jan 30, 2007·53 cites·8 claims
- 0294US5623213AMembrane probing of circuitsMICROMODULE SYSTEMS INC·Filed 1996·Granted Apr 22, 1997·128 cites·12 claims
- 0393US8143727B2Adhesive on wire stacked semiconductor packageOH KWANG SEOK·Filed 2010·Granted Mar 27, 2012·16 cites·18 claims
- 0493US7875340B2Heat radiation substrate having metal core and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2007·Granted Jan 25, 2011·25 cites·5 claims
- 0593US7863723B2Adhesive on wire stacked semiconductor packageAMKOR TECHNOLOGY INC·Filed 2008·Granted Jan 4, 2011·21 cites·20 claims
- 0693US6910266B2Printed circuit board with embedded capacitors therein, and process for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2003·Granted Jun 28, 2005·69 cites·14 claims
- 0792US7697301B2Printed circuit board having embedded electronic components and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2006·Granted Apr 13, 2010·21 cites·8 claims
- 0892US7408120B2Printed circuit board having axially parallel via holesSAMSUNG ELECTRO MECH·Filed 2005·Granted Aug 5, 2008·27 cites·7 claims
- 0991US7888599B2Printed circuit board including embedded capacitor and method of fabricating sameSAMSUNG ELECTRO MECH·Filed 2008·Granted Feb 15, 2011·24 cites·3 claims
- 1089US7092237B2Printed circuit board with embedded capacitors therein, and process for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2005·Granted Aug 15, 2006·18 cites·6 claims
- 1188US7485490B2Method of forming a stacked semiconductor packageAMKOR TECHNOLOGY INC·Filed 2005·Granted Feb 3, 2009·13 cites·19 claims
- 1281US7326858B2Printed circuit board with embedded capacitors and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2003·Granted Feb 5, 2008·29 cites·5 claims
- 1378US7435911B2Printed circuit board including embedded capacitor and method of fabricating sameSAMSUNG ELECTRO MECH·Filed 2005·Granted Oct 14, 2008·7 cites·4 claims
- 1478US5847571AMembrane probing of circuitsMICROMODULE SYSTEMS INC·Filed 1996·Granted Dec 8, 1998·44 cites·3 claims
- 1574US8065797B2Fabricating method for printed circuit boardWATANABE RYOICHI·Filed 2007·Granted Nov 29, 2011·8 cites·10 claims
- 1674US8061025B2Method of manufacturing heat radiation substrate having metal coreCHO SEUNG HYUN·Filed 2010·Granted Nov 22, 2011·2 cites·5 claims
- 1773US5796164APackaging and interconnect system for integrated circuitsMICROMODULE SYSTEMS INC·Filed 1996·Granted Aug 18, 1998·55 cites·36 claims
- 1872US5841291AExchangeable membrane probe testing of circuitsMICROMODULE SYSTEMS INC·Filed 1996·Granted Nov 24, 1998·30 cites·9 claims
- 1962US8022311B2Printed circuit board for improving tolerance of embedded capacitors, and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2007·Granted Sep 20, 2011·2 cites·11 claims
- 2055US2009325105A1Printed circuit board with embedded capacitors therein, and process for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 2152US7570491B2Printed circuit board with embedded capacitors therein, and process for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2003·Granted Aug 4, 2009·4 cites·8 claims
- 2250US2008264684A1Carrier member for transmitting circuits, coreless printed circuit board using the carrier member, and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2007·Application pending·0 cites
- 2349US2013042472A1Method of manufacturing a printed circuit board having embedded electronic componentsSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
- 2449US2008006942A1Bottom substrate of package on package and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2007·Application pending·0 cites
- 2549US2008115355A1Method of manufacturing printed circuit boardSAMSUNG ELECTRO MECH·Filed 2007·Application pending·0 cites
- 2648US2008251494A1Method for manufacturing circuit boardSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 2747US2010154210A1Method of manufacturing a printed circuit board having embedded electronic componentsSAMSUNG ELECTRO MECH·Filed 2010·Application pending·0 cites
- 2847US2012073865A1Carrier member for transmitting circuits, coreless printed circuit board using the carrier member, and method of manufacturing the sameKANG MYUNG SAM·Filed 2011·Application pending·0 cites
- 2945US2006258053A1Method for manufacturing electronic component-embedded printed circuit boardSAMSUNG ELECTRO MECH·Filed 2006·Application pending·0 cites
- 3045US2010255634A1Manufacturing method of bottom substrate of packageSAMSUNG ELECTRO MECH·Filed 2010·Application pending·0 cites
- 3143US2007290344A1Printed circuit board for package of electronic components and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2007·Application pending·0 cites
- 3241US2008000680A1Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2007·Application pending·0 cites
- 3339US2002125556A1Stacking structure of semiconductor chips and semiconductor package using itFiled 2001·Application pending·0 cites
- 3430US6380001B1Flexible pin count package for semiconductor deviceVLSI TECHNOLOGY INC·Filed 1999·Granted Apr 30, 2002·0 cites·6 claims
Join the waitlist — get patent alerts
Get an alert when Byoung-Youl Min files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →