Inventor · disambiguated record
Byung Hoon Moon
Also filed as: MOON BYUNG HOON
5 granted patents·5 pending applications·7 citations·filing 1999–2025
68Inventor score
Top patents by PatentIndex Score
10 records- 0171US12334469B2Piezoelectric materials for on-die thermal enhancement of hybrid bonding and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2022·Granted Jun 17, 2025·0 cites·20 claims
- 0271US2025286015A1Piezoelectric materials for on-die thermal enhancement of hybrid bonding and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 0365US12191164B2Hybrid mold chase surface for semiconductor bonding and related systems and methodsMICRON TECHNOLOGY INC·Filed 2022·Granted Jan 7, 2025·0 cites·14 claims
- 0462US7844989B2Method and broadcasting receiver for displaying the receiving status of broadcasting program informationSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Nov 30, 2010·2 cites·26 claims
- 0560US2025040027A1Substrate with a current limiterMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 0659US12368131B2Embedded nanoparticles for on-die thermal enhancement of hybrid bonding and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2022·Granted Jul 22, 2025·0 cites·20 claims
- 0759US2025140574A1Hybrid mold chase surface for semiconductor bonding and related systems and methodsMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 0849US2023050652A1Elastic bonding layers for semiconductor die assemblies and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2022·Application pending·0 cites
- 0940US2007083891A1Image processing apparatus and control method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 1031US6225379B1Epoxy resin composition for bonding semiconductor chipsAMKOR TECHNOLOGY INC·Filed 1999·Granted May 1, 2001·5 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →