Inventor · disambiguated record
Caroline Catharina Maria Beelen-Hendrikx
Also filed as: BEELEN-HENDRIKX CAROLINE CATHARINA MARIA
6 granted patents·2 pending applications·38 citations·filing 2013–2019
80Inventor score
Top patents by PatentIndex Score
8 records- 0193US9466585B1Reducing defects in wafer level chip scale package (WLCSP) devicesNXP BV·Filed 2015·Granted Oct 11, 2016·17 cites·12 claims
- 0292US10177111B2Reduction of defects in wafer level chip scale package (WLCSP) devicesNXP BV·Filed 2017·Granted Jan 8, 2019·10 cites·12 claims
- 0390US9704823B2Reduction of defects in wafer level chip scale package (WLCSP) devicesNXP BV·Filed 2015·Granted Jul 11, 2017·8 cites·4 claims
- 0468US8895357B2Integrated circuit and method of manufacturing the sameNXP BV·Filed 2013·Granted Nov 25, 2014·2 cites·9 claims
- 0567US10315821B2Component carrierNXP BV·Filed 2016·Granted Jun 11, 2019·1 cites·18 claims
- 0653US11893440B2Card-type substrate having biometric functionality and a method of forming the sameLINXENS HOLDING·Filed 2019·Granted Feb 6, 2024·0 cites·22 claims
- 0751US2015069587A1Integrated circuit and method of manufacturing the sameNXP BV·Filed 2014·Application pending·0 cites
- 0843US2016005653A1Flexible wafer-level chip-scale packages with improved board-level reliabilityNXP BV·Filed 2014·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →