Inventor · disambiguated record
Cathryn J. Christiansen
Also filed as: CHRISTIANSEN CATHRYN · CHRISTIANSEN CATHRYN J · CHRISTIANSEN CATHRYN JEANNE
21 granted patents·3 pending applications·131 citations·filing 2005–2023
93Inventor score
Top patents by PatentIndex Score
24 records- 0198US9435852B1Integrated circuit (IC) test structure with monitor chain and test wiresGLOBALFOUNDRIES INC·Filed 2015·Granted Sep 6, 2016·64 cites·20 claims
- 0293US9768065B1Interconnect structures with variable dopant levelsGLOBALFOUNDRIES INC·Filed 2016·Granted Sep 19, 2017·10 cites·13 claims
- 0390US8120179B2Air gap interconnect structures and methods for forming the sameCHANDA KAUSHIK·Filed 2009·Granted Feb 21, 2012·19 cites·18 claims
- 0488US8383507B2Method for fabricating air gap interconnect structuresIBM·Filed 2012·Granted Feb 26, 2013·8 cites·19 claims
- 0583US9831194B1Edge compression layersGLOBALFOUNDRIES INC·Filed 2016·Granted Nov 28, 2017·4 cites·20 claims
- 0681US10770407B2IC structure with interdigitated conductive elements between metal guard structuresGLOBALFOUNDRIES INC·Filed 2019·Granted Sep 8, 2020·3 cites·19 claims
- 0778US10297546B2Interconnect structures for a security applicationGLOBALFOUNDRIES INC·Filed 2017·Granted May 21, 2019·2 cites·11 claims
- 0873US9851397B2Electromigration testing of interconnect analogues having bottom-connected sensory pinsGLOBALFOUNDRIES INC·Filed 2015·Granted Dec 26, 2017·2 cites·18 claims
- 0971US9087841B2Self-correcting power grid for semiconductor structures methodIBM·Filed 2013·Granted Jul 21, 2015·2 cites·10 claims
- 1071US9059052B2Alternating open-ended via chains for testing via formation and dielectric integrityIBM·Filed 2013·Granted Jun 16, 2015·2 cites·20 claims
- 1171US8562210B2Thermal sensor for semiconductor circuitsCHRISTIANSEN CATHRYN J·Filed 2010·Granted Oct 22, 2013·4 cites·14 claims
- 1271US7709401B2Method of making thermally programmable anti-reverse engineering interconnects wherein interconnects only conduct when heated above room temperatureIBM·Filed 2008·Granted May 4, 2010·4 cites·12 claims
- 1367US7843062B2Thermally programmable anti-reverse engineering interconnects wherein interconnects only conduct when heated above room temperatureIBM·Filed 2010·Granted Nov 30, 2010·2 cites·13 claims
- 1466US10109599B2Integrated circuit structure with continuous metal crack stopGLOBALFOUNDRIES INC·Filed 2016·Granted Oct 23, 2018·1 cites·20 claims
- 1565US10475677B2Parallel test structureGLOBALFOUNDRIES INC·Filed 2017·Granted Nov 12, 2019·1 cites·19 claims
- 1664US9685370B2Titanium tungsten liner used with copper interconnectsIBM·Filed 2014·Granted Jun 20, 2017·1 cites·19 claims
- 1754US8018017B2Thermo-mechanical cleavable structureIBM·Filed 2005·Granted Sep 13, 2011·1 cites·17 claims
- 1850US11841296B2Semiconductor substrates for electrical resistivity measurementsGLOBALFOUNDRIES US INC·Filed 2021·Granted Dec 12, 2023·0 cites·17 claims
- 1949US2024405019A1Polysilicon resistor aligned between gate structuresGLOBALFOUNDRIES US INC·Filed 2023·Application pending·0 cites
- 2047US9214427B2Method of self-correcting power grid for semiconductor structuresIBM·Filed 2015·Granted Dec 15, 2015·0 cites·17 claims
- 2147US8232809B2Determining critical current density for interconnectBURKE CHAD M·Filed 2009·Granted Jul 31, 2012·1 cites·20 claims
- 2246US9780031B2Wiring structuresIBM·Filed 2014·Granted Oct 3, 2017·0 cites·17 claims
- 2345US2015221567A1Alternating open-ended via chains for testing via formation and dielectric integrityIBM·Filed 2015·Application pending·0 cites
- 2437US2018102318A1Compound resistor structure for semiconductor deviceGLOBALFOUNDRIES INC·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →