Inventor · disambiguated record
Cai Qiaoming
Also filed as: QIAOMING CAI
3 granted patents·0 citations·filing 2021–2023
43Inventor score
Top patents by PatentIndex Score
3 records- 0156US12068233B2Adapter board and method for forming same, packaging method, and package structureSEMICONDUCTOR MFG NORTH CHINA BEIJING CORPORATION·Filed 2023·Granted Aug 20, 2024·0 cites·12 claims
- 0250US11637059B2Adapter board and method for forming same, packaging method, and package structureSEMICONDUCTOR MFG NORTH CHINA BEIJING CORPORATION·Filed 2021·Granted Apr 25, 2023·0 cites·8 claims
- 0336US12159868B2Semiconductor structure and method for forming sameSEMICONDUCTOR MFG NORTH CHINA BEIJING CORPORATION·Filed 2022·Granted Dec 3, 2024·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →