Inventor · disambiguated record
Chintan Buch
Also filed as: BUCH CHINTAN
15 granted patents·5 pending applications·12 citations·filing 2018–2024
87Inventor score
Top patents by PatentIndex Score
20 records- 0193US10937726B1Package structure with embedded coreAPPLIED MATERIALS INC·Filed 2020·Granted Mar 2, 2021·3 cites·20 claims
- 0289US11521937B2Package structures with built-in EMI shieldingAPPLIED MATERIALS INC·Filed 2020·Granted Dec 6, 2022·2 cites·20 claims
- 0385US10727083B1Method for via formation in flowable epoxy materials by micro-imprintAPPLIED MATERIALS INC·Filed 2019·Granted Jul 28, 2020·4 cites·20 claims
- 0480US11388822B2Methods for improved polymer-copper adhesionAPPLIED MATERIALS INC·Filed 2020·Granted Jul 12, 2022·1 cites·20 claims
- 0578US11281094B2Method for via formation by micro-imprintingAPPLIED MATERIALS INC·Filed 2018·Granted Mar 22, 2022·2 cites·17 claims
- 0675US2025029900A1Glass core package substratesADVANCED MICRO DEVICES INC·Filed 2024·Application pending·0 cites
- 0773US12374611B2Package core assembly and fabrication methodsAPPLIED MATERIALS INC·Filed 2021·Granted Jul 29, 2025·0 cites·24 claims
- 0873US11927885B2Fluoropolymer stamp fabrication methodAPPLIED MATERIALS INC·Filed 2022·Granted Mar 12, 2024·0 cites·14 claims
- 0973US11881447B2Package core assembly and fabrication methodsAPPLIED MATERIALS INC·Filed 2021·Granted Jan 23, 2024·0 cites·18 claims
- 1071US12087679B2Package core assembly and fabrication methodsAPPLIED MATERIALS INC·Filed 2020·Granted Sep 10, 2024·0 cites·9 claims
- 1171US11798903B2Methods of forming microvias with reduced diameterAPPLIED MATERIALS INC·Filed 2022·Granted Oct 24, 2023·0 cites·19 claims
- 1269US12080632B2Glass core package substratesADVANCED MICRO DEVICES INC·Filed 2021·Granted Sep 3, 2024·0 cites·13 claims
- 1365US11315890B2Methods of forming microvias with reduced diameterAPPLIED MATERIALS INC·Filed 2020·Granted Apr 26, 2022·0 cites·19 claims
- 1464US11862546B2Package core assembly and fabrication methodsAPPLIED MATERIALS INC·Filed 2019·Granted Jan 2, 2024·0 cites·19 claims
- 1564US2022171281A1Method for via formation by micro-imprintingAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 1661US11454884B2Fluoropolymer stamp fabrication methodAPPLIED MATERIALS INC·Filed 2020·Granted Sep 27, 2022·0 cites·20 claims
- 1751US2024113070A1Integrating devices into a carrier wafer for three dimensionally stacked semiconductor devicesADVANCED MICRO DEVICES INC·Filed 2022·Application pending·0 cites
- 1850US2023120305A1Testing a semiconductor die using temporary test pads applied to conductive pads of the semiconductor dieADVANCED MICRO DEVICES INC·Filed 2022·Application pending·0 cites
- 1949US2025323212A1Systems and methods for stack construction of a semiconductor device having redistribution layers in a silicon carrierADVANCED MICRO DEVICES INC·Filed 2023·Application pending·0 cites
- 2047US11931855B2Planarization methods for packaging substratesAPPLIED MATERIALS INC·Filed 2020·Granted Mar 19, 2024·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →