Inventor · disambiguated record
Ching Fu Chang
Also filed as: Chang Ching Fu
31 granted patents·4 pending applications·116 citations·filing 2016–2025
96Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD35
Top patents by PatentIndex Score
35 records- 0198US9837359B1Integrated fan-out package and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 5, 2017·43 cites·6 claims
- 0297US9922896B1Info structure with copper pillar having reversed profileTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Mar 20, 2018·18 cites·20 claims
- 0395US9922895B2Package with tilted interface between device die and encapsulating materialTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Mar 20, 2018·8 cites·20 claims
- 0493US10290530B2Info structure with copper pillar having reversed profileTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 14, 2019·6 cites·20 claims
- 0593US10276506B2Integrated fan-out packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 30, 2019·7 cites·20 claims
- 0692US11322419B2Package with tilted interface between device die and encapsulating materialTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 3, 2022·2 cites·20 claims
- 0791US11362037B2Integrated fan-out packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 14, 2022·2 cites·20 claims
- 0890US10529697B2Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 7, 2020·5 cites·19 claims
- 0988US10770402B2Integrated fan-out packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 8, 2020·3 cites·20 claims
- 1088US10163745B2Package with tilted interface between device die and encapsulating materialTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 25, 2018·3 cites·20 claims
- 1188US10128182B2Semiconductor package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Nov 13, 2018·4 cites·20 claims
- 1287US10692809B2Manufacturing method for semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 23, 2020·3 cites·20 claims
- 1387US10037961B2Integrated fan-out package and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jul 31, 2018·6 cites·20 claims
- 1486US10109589B2Integrated fan-out package and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Oct 23, 2018·3 cites·20 claims
- 1586US2025279325A1Package with tilted interface between device die and encapsulating materialTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1683US12261074B2Info structure with copper pillar having reversed profileTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 25, 2025·0 cites·20 claims
- 1782US2025201617A1Info structure with copper pillar having reversed profileTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1880US11901303B2Integrated fan-out packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 13, 2024·0 cites·20 claims
- 1979US11854993B2Integrated fan-out packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·0 cites·20 claims
- 2078US12334406B2Package with tilted interface between device die and encapsulating materialTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 17, 2025·0 cites·20 claims
- 2176US10790235B2Integrated fan-out package and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 29, 2020·1 cites·20 claims
- 2275US11984342B2Info structure with copper pillar having reversed profileTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 14, 2024·0 cites·20 claims
- 2375US10170430B2Integrated fan-out package and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 1, 2019·1 cites·20 claims
- 2474US11948881B2Semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 2, 2024·0 cites·20 claims
- 2573US11282796B2Integrated fan-out package and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 22, 2022·0 cites·20 claims
- 2671US11990454B2Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 21, 2024·0 cites·19 claims
- 2770US11069614B2Semiconductor package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 20, 2021·0 cites·20 claims
- 2865US10950478B2Info structure with copper pillar having reversed profileTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 16, 2021·0 cites·20 claims
- 2965US2021118804A1Package structure with bumpTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Application pending·0 cites
- 3064US10734299B2Package with tilted interface between device die and encapsulating materialTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 4, 2020·0 cites·20 claims
- 3163US10879185B2Package structure with bumpTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 29, 2020·0 cites·20 claims
- 3262US9941216B2Conductive pattern and integrated fan-out package having the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 10, 2018·1 cites·17 claims
- 3362US2024266336A1Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3461US10867973B2Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 15, 2020·0 cites·20 claims
- 3554US10515899B2Package structure with bumpTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 24, 2019·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →