Inventor · disambiguated record
Chi-Min Chang
Also filed as: CHANG CHI-MIN
13 granted patents·8 pending applications·20 citations·filing 2006–2024
84Inventor score
Top patents by PatentIndex Score
21 records- 0195US9635757B1Circuit board and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2016·Granted Apr 25, 2017·17 cites·9 claims
- 0274US12052815B2Manufacturing method of circuit boardUNIMICRON TECHNOLOGY CORP·Filed 2023·Granted Jul 30, 2024·0 cites·15 claims
- 0369US10314179B2Manufacturing method of circuit structureUNIMICRON TECHNOLOGY CORP·Filed 2018·Granted Jun 4, 2019·1 cites·13 claims
- 0467US12133323B2Transmission device for suppressing glass fiber effectUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted Oct 29, 2024·0 cites·10 claims
- 0565US11785707B2Circuit board and manufacturing method thereof and electronic deviceUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted Oct 10, 2023·0 cites·9 claims
- 0665US10051748B2Circuit structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2016·Granted Aug 14, 2018·1 cites·6 claims
- 0760US2025358927A1Circuit board structure and method for manufacturing the sameUNIMICRON TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 0859US8171626B1Method for forming embedded circuitYU CHENG-PO·Filed 2011·Granted May 8, 2012·1 cites·16 claims
- 0956US12315981B2Transmission line device compriing first and second conductive lines on one level separated from a third conductive line on another level by an intervening ground layerUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted May 27, 2025·0 cites·17 claims
- 1055US12396096B2Circuit board deviceUNIMICRON TECHNOLOGY CORP·Filed 2023·Granted Aug 19, 2025·0 cites·20 claims
- 1155US2011094778A1Circuit board and fabrication method thereofYU CHENG-PO·Filed 2009·Application pending·0 cites
- 1254US2013040071A1Circuit board and fabrication method thereofUNIMICRON TECHNOLOGY CORP·Filed 2012·Application pending·0 cites
- 1353US2025287497A1Circuit board deviceUNIMICRON TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 1451US12144113B2Circuit board structureUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted Nov 12, 2024·0 cites·22 claims
- 1551US11895772B2Interlayer connective structure of wiring board and method of manufacturing the sameUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted Feb 6, 2024·0 cites·8 claims
- 1650US11737209B2Circuit board and manufacturing method thereof and electronic deviceUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted Aug 22, 2023·0 cites·43 claims
- 1746US2007263862A1Manufacturing process and apparatus for printing imprint on defective boardUNIMICRON TECHNOLOGY CORP·Filed 2006·Application pending·0 cites
- 1846US2022240375A1Co-axial via structure and manufacturing method of the sameUNIMICRON TECHNOLOGY CORP·Filed 2021·Application pending·0 cites
- 1944US10470317B2Method for manufacturing circuit boardUNIMICRON TECHNOLOGY CORP·Filed 2017·Granted Nov 5, 2019·0 cites·10 claims
- 2042US2007281388A1Selective metal surface treatment process and apparatus for circuit board and resist used in the processUNIMICRON TECHNOLOGY CORP·Filed 2006·Application pending·0 cites
- 2138US2018160543A1Manufacturing method of circuit board and structure thereofUNIMICRON TECHNOLOGY CORP·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →