Inventor · disambiguated record

Chao-Chia Chang

Also filed as: CHANG CHAO-CHIA

1 granted patent·1 pending application·257 citations·filing 2001–2001

57Inventor score

Technology areasH10W

Files withWALSIN ADVANCED ELECTRONICS2

Top patents by PatentIndex Score

2 records

0193US6437429B1Semiconductor package with metal padsWALSIN ADVANCED ELECTRONICS·Filed 2001·Granted Aug 20, 2002·257 cites·12 claims
0230US2002182773A1Method for bonding inner leads of leadframe to substrateWALSIN ADVANCED ELECTRONICS·Filed 2001·Application pending·0 cites

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →