Inventor · disambiguated record
Chang Chao-Chia
Also filed as: CHAO CHIA-CHANG
3 granted patents·3 pending applications·617 citations·filing 2000–2001
80Inventor score
Technology areasH10W
Files withWALSIN ADVANCED ELECTRONICS6
Top patents by PatentIndex Score
6 records- 0194US6337510B1Stackable QFN semiconductor packageWALSIN ADVANCED ELECTRONICS·Filed 2000·Granted Jan 8, 2002·353 cites·4 claims
- 0293US6459148B1QFN semiconductor packageWALSIN ADVANCED ELECTRONICS·Filed 2000·Granted Oct 1, 2002·214 cites·7 claims
- 0381US6521485B2Method for manufacturing wafer level chip size packageWALSIN ADVANCED ELECTRONICS·Filed 2001·Granted Feb 18, 2003·50 cites·6 claims
- 0430US2002173074A1Method for underfilling bonding gap between flip-chip and circuit substrateWALSIN ADVANCED ELECTRONICS·Filed 2001·Application pending·0 cites
- 0530US2003006055A1Semiconductor package for fixed surface mountingWALSIN ADVANCED ELECTRONICS·Filed 2001·Application pending·0 cites
- 0629US2002094683A1Method for manufacturing chip size package and its structureWALSIN ADVANCED ELECTRONICS·Filed 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →