Inventor · disambiguated record
Chuan Cheah
Also filed as: CHEAH CHUAN
60 granted patents·5 pending applications·1,342 citations·filing 1997–2024
99Inventor score
Files withINT RECTIFIER CORP34INFINEON TECHNOLOGIES AMERICAS CORP9CHO EUNG SAN8CHEAH CHUAN4INFINEON TECHNOLOGIES AUSTRIA AG3
Top patents by PatentIndex Score
65 records- 0197US5814884ACommonly housed diverse semiconductor dieINT RECTIFIER CORP·Filed 1997·Granted Sep 29, 1998·307 cites·40 claims
- 0296US8426952B2Stacked half-bridge package with a common conductive leadframeCHO EUNG SAN·Filed 2011·Granted Apr 23, 2013·25 cites·20 claims
- 0396US6040626ASemiconductor packageINT RECTIFIER CORP·Filed 1999·Granted Mar 21, 2000·375 cites·28 claims
- 0495US9583477B2Stacked half-bridge packageINFINEON TECHNOLOGIES AMERICAS CORP·Filed 2016·Granted Feb 28, 2017·10 cites·20 claims
- 0594US8497574B2High power semiconductor package with conductive clips and flip chip driver ICCHO EUNG SAN·Filed 2011·Granted Jul 30, 2013·12 cites·20 claims
- 0693US9349677B2Stacked half-bridge package with a common leadframeINT RECTIFIER CORP·Filed 2013·Granted May 24, 2016·12 cites·20 claims
- 0793US8664754B2High power semiconductor package with multiple conductive clipsCHO EUNG SAN·Filed 2011·Granted Mar 4, 2014·11 cites·20 claims
- 0893US8497573B2High power semiconductor package with conductive clip on multiple transistorsCHO EUNG SAN·Filed 2011·Granted Jul 30, 2013·10 cites·20 claims
- 0993US7804131B2Multi-chip moduleINT RECTIFIER CORP·Filed 2007·Granted Sep 28, 2010·29 cites·20 claims
- 1093US7301235B2Semiconductor device module with flip chip devices on a common lead frameINT RECTIFIER CORP·Filed 2005·Granted Nov 27, 2007·41 cites·17 claims
- 1191US8399912B2III-nitride power device with solderable front metalCHEAH CHUAN·Filed 2011·Granted Mar 19, 2013·10 cites·20 claims
- 1289US8253224B2Semiconductor package with metal strapsHU KUNZHONG·Filed 2010·Granted Aug 28, 2012·10 cites·11 claims
- 1389US7304372B2Semiconductor packageINT RECTIFIER CORP·Filed 2006·Granted Dec 4, 2007·19 cites·11 claims
- 1489US6184585B1Co-packaged MOS-gated device and control integrated circuitINT RECTIFIER CORP·Filed 1998·Granted Feb 6, 2001·134 cites·20 claims
- 1586US8987883B2Semiconductor package with multiple conductive clipsINT RECTIFIER CORP·Filed 2014·Granted Mar 24, 2015·4 cites·18 claims
- 1686US6404050B2Commonly housed diverse semiconductorINT RECTIFIER CORP·Filed 2001·Granted Jun 11, 2002·38 cites·19 claims
- 1785US9449899B2Semiconductor package with heat spreaderINFINEON TECHNOLOGIES AMERICAS CORP·Filed 2013·Granted Sep 20, 2016·5 cites·10 claims
- 1885US8674497B2Stacked half-bridge package with a current carrying layerCHO EUNG SAN·Filed 2011·Granted Mar 18, 2014·6 cites·20 claims
- 1984US10204873B2Breakable substrate for semiconductor dieINFINEON TECHNOLOGIES AMERICAS CORP·Filed 2017·Granted Feb 12, 2019·4 cites·20 claims
- 2084US8749034B2High power semiconductor package with conductive clip and flip chip driver IC with integrated control transistorCHO EUNG SAN·Filed 2011·Granted Jun 10, 2014·4 cites·16 claims
- 2183US6448643B2Three commonly housed diverse semiconductor diceINT RECTIFIER CORP·Filed 2001·Granted Sep 10, 2002·42 cites·23 claims
- 2281US8680627B2Stacked half-bridge package with a common conductive clipCHO EUNG SAN·Filed 2011·Granted Mar 25, 2014·4 cites·20 claims
- 2380US7728420B2High current lead electrode for semiconductor deviceINT RECTIFIER CORP·Filed 2007·Granted Jun 1, 2010·9 cites·14 claims
- 2478US6396138B1Chip array with two-sided coolingINT RECTIFIER CORP·Filed 2000·Granted May 28, 2002·22 cites·4 claims
- 2577US10083884B2Compact high-voltage semiconductor packageINFINEON TECHNOLOGIES AMERICAS CORP·Filed 2017·Granted Sep 25, 2018·2 cites·10 claims
- 2677US8790965B2High voltage cascoded III-nitride rectifier packageINT RECTIFIER CORP·Filed 2013·Granted Jul 29, 2014·3 cites·20 claims
- 2775US8546849B2High voltage cascoded III-nitride rectifier package utilizing clips on package surfaceCHEAH CHUAN·Filed 2012·Granted Oct 1, 2013·3 cites·11 claims
- 2875US7999365B2Package for monolithic compound semiconductor (CSC) devices for DC to DC convertersINT RECTIFIER CORP·Filed 2008·Granted Aug 16, 2011·6 cites·20 claims
- 2974US8853744B2Power device with solderable front metalINT RECTIFIER CORP·Filed 2013·Granted Oct 7, 2014·2 cites·20 claims
- 3074US8786068B1Packaging of electronic circuitryPHILLIPS TIMOTHY A·Filed 2011·Granted Jul 22, 2014·5 cites·20 claims
- 3173US8791560B2Interdigitated conductive support for GaN semiconductor dieHU KUNZHONG·Filed 2011·Granted Jul 29, 2014·3 cites·10 claims
- 3272US7994632B2Interdigitated conductive lead frame or laminate lead frame for GaN dieINT RECTIFIER CORP·Filed 2007·Granted Aug 9, 2011·4 cites·17 claims
- 3372US6586280B2Method of manufacturing a semiconductor chip array with two-sided coolingINT RECTIFIER CORP·Filed 2001·Granted Jul 1, 2003·16 cites·11 claims
- 3472US6297552B1Commonly housed diverse semiconductor dieINT RECTIFIER CORP·Filed 2000·Granted Oct 2, 2001·15 cites·7 claims
- 3572US6242800B1Heat dissipating device packageINT RECTIFIER CORP·Filed 1997·Granted Jun 5, 2001·45 cites·6 claims
- 3670US6949822B2Semiconductor multichip module package with improved thermal performance; reduced size and improved moisture resistanceINT RECTIFIER CORP·Filed 2001·Granted Sep 27, 2005·16 cites·2 claims
- 3767US8853706B2High voltage cascoded III-nitride rectifier package with stamped leadframeCHEAH CHUAN·Filed 2012·Granted Oct 7, 2014·2 cites·20 claims
- 3867US7402845B2Cascoded rectifier packageINT RECTIFIER CORP·Filed 2007·Granted Jul 22, 2008·3 cites·11 claims
- 3966US8564124B2Semiconductor packageBRIERE MICHAEL A·Filed 2007·Granted Oct 22, 2013·2 cites·10 claims
- 4065US9105619B2Semiconductor package with conductive heat spreaderINT RECTIFIER CORP·Filed 2013·Granted Aug 11, 2015·1 cites·11 claims
- 4165US7859089B2Copper strapsINT RECTIFIER CORP·Filed 2007·Granted Dec 28, 2010·2 cites·22 claims
- 4264US6388319B1Three commonly housed diverse semiconductor diceINT RECTIFIER CORP·Filed 2000·Granted May 14, 2002·14 cites·17 claims
- 4360US6765292B2Contact structure for semiconductor deviceINT RECTIFIER CORP·Filed 2002·Granted Jul 20, 2004·10 cites·11 claims
- 4460US6133632ACommonly housed diverse semiconductor dieINT RECTIFIER CORP·Filed 1998·Granted Oct 17, 2000·19 cites·35 claims
- 4559US9312375B2III-Nitride device with solderable front metalINT RECTIFIER CORP·Filed 2014·Granted Apr 12, 2016·0 cites·20 claims
- 4659US7867823B2Method for fabricating a semiconductor packageINT RECTIFIER CORP·Filed 2007·Granted Jan 11, 2011·1 cites·21 claims
- 4758US12205919B2Method of processing a semiconductor wafer, semiconductor die, and method of producing a semiconductor moduleINFINEON TECHNOLOGIES AG·Filed 2021·Granted Jan 21, 2025·0 cites·6 claims
- 4857US9520341B2Semiconductor package with conductive clipsINFINEON TECHNOLOGIES AMERICAS CORP·Filed 2015·Granted Dec 13, 2016·0 cites·20 claims
- 4957US9142503B2III-nitride rectifier packageINT RECTIFIER CORP·Filed 2014·Granted Sep 22, 2015·0 cites·15 claims
- 5057US9048230B2Half-bridge package with a conductive clipINT RECTIFIER CORP·Filed 2014·Granted Jun 2, 2015·0 cites·20 claims
Showing the top 50 of 65 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Chuan Cheah files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →