Inventor · disambiguated record
Chien-Te Chen
Also filed as: CHEN CHIEN TE
15 granted patents·8 pending applications·71 citations·filing 2001–2024
90Inventor score
Files withSILICONWARE PRECISION INDUSTRIES CO LTD10WESTERN DIGITAL TECH INC6CHEN CHIEN-TE4SANDISK TECHNOLOGIES INC2JOYMAX ELECTRONICS CO LTD1
Top patents by PatentIndex Score
23 records- 0177US6700204B2Substrate for accommodating passive componentSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2002·Granted Mar 2, 2004·21 cites·8 claims
- 0273US7402755B2Circuit board with quality-indicator mark and method for indicating quality of the circuit boardSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2004·Granted Jul 22, 2008·15 cites·9 claims
- 0366US7141868B2Flash preventing substrate and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2005·Granted Nov 28, 2006·4 cites·15 claims
- 0463US6449169B1Ball grid array package with interdigitated power ring and ground ringSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Sep 10, 2002·12 cites·10 claims
- 0561US12193166B2Printed circuit board having a sacrificial pad to mitigate galvanic corrosionWESTERN DIGITAL TECH INC·Filed 2022·Granted Jan 7, 2025·0 cites·13 claims
- 0659US7361846B2High electrical performance semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2004·Granted Apr 22, 2008·9 cites·13 claims
- 0758US8772647B1Single-cap via-in-pad and methods for forming thereofCHEN CHIEN TE·Filed 2012·Granted Jul 8, 2014·1 cites·11 claims
- 0854US2008277144A1Method for indicating quality of a circuit boardSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2008·Application pending·0 cites
- 0954US2025300128A1Symmetrical semiconductor dies for a semiconductor packageSANDISK TECHNOLOGIES INC·Filed 2024·Application pending·0 cites
- 1053US11557555B2Bumped pad structureWESTERN DIGITAL TECH INC·Filed 2020·Granted Jan 17, 2023·0 cites·18 claims
- 1153US2025293218A1Semiconductor package having an integrated passive device that acts as a spacerSANDISK TECHNOLOGIES INC·Filed 2024·Application pending·0 cites
- 1252US8161635B1Methods for forming a single cap via in pad of substrateCHEN CHIEN TE·Filed 2008·Granted Apr 24, 2012·0 cites·9 claims
- 1352US2024120317A1Semiconductor device including vertically interconnected semiconductor diesWESTERN DIGITAL TECH INC·Filed 2023·Application pending·0 cites
- 1451USD687692SSocket wrenchCHEN CHIEN-TE·Filed 2012·Granted Aug 13, 2013·8 cites·1 claims
- 1549US12022618B2Printed circuit board with stacked passive componentsWESTERN DIGITAL TECH INC·Filed 2021·Granted Jun 25, 2024·0 cites·16 claims
- 1648US11924964B2Printed circuit board for galvanic effect reductionWESTERN DIGITAL TECH INC·Filed 2022·Granted Mar 5, 2024·0 cites·20 claims
- 1747US2006053985A1Floatable handle for hand toolsCHEN CHIEN-TE·Filed 2004·Application pending·0 cites
- 1846US11139277B2Semiconductor device including contact fingers on opposed surfacesWESTERN DIGITAL TECH INC·Filed 2020·Granted Oct 5, 2021·0 cites·16 claims
- 1946US7119565B2Chip carrier and method for testing electrical performance of passive componentSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2003·Granted Oct 10, 2006·1 cites·17 claims
- 2041US7427968B2Antenna device having rotatable structureJOYMAX ELECTRONICS CO LTD·Filed 2006·Granted Sep 23, 2008·0 cites·6 claims
- 2139US2006049516A1Nickel/gold pad structure of semiconductor package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2005·Application pending·0 cites
- 2237US2006060958A1Semiconductor package, and fabrication method and carrier thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2005·Application pending·0 cites
- 2332US2006076695A1Semiconductor package with flash-absorbing mechanism and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →