Inventor · disambiguated record
Chia-Chan Chen
Also filed as: CHEN CHIA-CHAN
34 granted patents·7 pending applications·27 citations·filing 2012–2025
95Inventor score
Top patents by PatentIndex Score
41 records- 0196US11552205B2Optical sensing device having inclined reflective surfaceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 10, 2023·4 cites·20 claims
- 0296US11380729B2Image sensor having lens layer and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 5, 2022·4 cites·20 claims
- 0390US12363459B2Photosensing pixel including self-aligned light shielding layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 15, 2025·1 cites·20 claims
- 0489US9761623B2Backside illuminated (BSI) image sensor with a reflectorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Sep 12, 2017·7 cites·20 claims
- 0588US11398512B2Photo-sensing device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 26, 2022·2 cites·19 claims
- 0687US2025133862A1Optical sensing device having inclined reflective surfaceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0786US10170517B2Method for forming image sensor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 1, 2019·6 cites·17 claims
- 0884US11728362B2Image sensor pixel and metal shielding of charge storage device of image sensor pixel formed by one step processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 15, 2023·1 cites·18 claims
- 0983US2025331325A1Image sensor pixel and metal shielding of charge storage device of image sensor pixel formed by one step processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1081US12317639B2Optical sensing device having inclined reflective surfaceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 27, 2025·0 cites·20 claims
- 1181US12218260B2Optical sensing device having inclined reflective surfaceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 4, 2025·0 cites·12 claims
- 1281US2025248140A1Image sensor and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1379US12408456B2Image sensor pixel and metal shielding of charge storage device of image sensor pixel formed by one step processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 2, 2025·0 cites·20 claims
- 1477US12507491B2Storage node light shield for pixel of image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 23, 2025·0 cites·20 claims
- 1577US12300713B2Image sensor having lens layer over optical sensing area and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 13, 2025·0 cites·20 claims
- 1676US11735609B2Image sensor with shallow trench edge dopingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 22, 2023·0 cites·20 claims
- 1773US10998360B2Image sensor with shallow trench edge dopingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 4, 2021·0 cites·20 claims
- 1872US10998359B2Image sensor with shallow trench edge dopingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 4, 2021·0 cites·20 claims
- 1970US11133340B2Device comprising photodiode and method of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 28, 2021·0 cites·20 claims
- 2070US2022367538A1Apparatus and methods for effective impurity getteringTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 2168US12113079B2Image sensor with shallow trench edge dopingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 8, 2024·0 cites·20 claims
- 2268US11158591B2Bond pad structure for bonding improvementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 26, 2021·0 cites·20 claims
- 2367US12046614B2Apparatus and methods for effective impurity getteringTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 23, 2024·0 cites·19 claims
- 2467US10714516B2Image sensor with shallow trench edge dopingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 14, 2020·0 cites·20 claims
- 2565US9748187B2Wafer structure and method for wafer dicingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Aug 29, 2017·1 cites·19 claims
- 2662US10672810B2CMOS image sensor with shallow trench edge dopingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 2, 2020·0 cites·20 claims
- 2762US2025393318A1Methods for improving image lag in image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2860US10879123B2Protected chip-scale package (CSP) pad structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 29, 2020·0 cites·20 claims
- 2959US10734339B2Bond pad structure for bonding improvementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 4, 2020·0 cites·20 claims
- 3058US10510606B2Protected chip-scale package (CSP) pad structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 17, 2019·0 cites·20 claims
- 3157US2025224365A1Semiconductor structure including micro wells with different heightsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3254US11139212B2Semiconductor arrangement and method for makingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 5, 2021·0 cites·20 claims
- 3354US10276441B2Protected chip-scale package (CSP) pad structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 30, 2019·0 cites·20 claims
- 3454US10014269B2Method for wafer dicingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jul 3, 2018·0 cites·20 claims
- 3553US10276524B2Bond pad structure for bonding improvementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 30, 2019·0 cites·20 claims
- 3653US2024151686A1Biological material sensing semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3750US10515989B2Device comprising photodiode and method of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 24, 2019·0 cites·20 claims
- 3847US9257463B2Self-aligned implantation process for forming junction isolation regionsTSENG CHIEN-HSIEN·Filed 2012·Granted Feb 9, 2016·1 cites·20 claims
- 3942US9859325B2Complementary metal-oxide-semiconductor (CMOS) image sensor with silicon and silicon germaniumTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 2, 2018·0 cites·20 claims
- 4038US10163952B2Backside illuminated image sensor device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·0 cites·20 claims
- 4136US9748150B2Test line structure and method for performing wafer acceptance testTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 29, 2017·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →