Inventor · disambiguated record
Chen-Shien Chen
Also filed as: CHEN CHEN · CHEN CHEN-SHIEN
375 granted patents·61 pending applications·3,876 citations·filing 2004–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD278TAIWAN SEMICONDUCTOR MFG77CHEN CHIH-HUA7CHUANG YAO-CHUN7HSIAO CHING-WEN5
Top patents by PatentIndex Score
436 records- 0199US9379078B23D die stacking structure with fine pitchesTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jun 28, 2016·86 cites·20 claims
- 0299US9368460B2Fan-out interconnect structure and method for forming sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jun 14, 2016·1k cites·20 claims
- 0399US7564115B2Tapered through-silicon via structureTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Jul 21, 2009·155 cites·15 claims
- 0498US9343442B2Passive devices in package-on-package structures and methods for forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted May 17, 2016·56 cites·20 claims
- 0598US9258922B2PoP structures including through-assembly via modulesCHEN CHIH-HUA·Filed 2012·Granted Feb 9, 2016·54 cites·18 claims
- 0698US9087832B2Warpage reduction and adhesion improvement of semiconductor die packageTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jul 21, 2015·54 cites·20 claims
- 0798US8975726B2POP structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Mar 10, 2015·140 cites·17 claims
- 0898US8278152B2Bonding process for CMOS image sensorLIU JEN-CHENG·Filed 2009·Granted Oct 2, 2012·129 cites·19 claims
- 0998US7928534B2Bond pad connection to redistribution lines having tapered profilesTAIWAN SEMICONDUCTOR MFG·Filed 2008·Granted Apr 19, 2011·66 cites·20 claims
- 1097US9105530B2Conductive contacts having varying widths and method of manufacturing sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Aug 11, 2015·22 cites·20 claims
- 1197US8922005B2Methods and apparatus for package on package devices with reversed stud bump through via interconnectionsHU YEN-CHANG·Filed 2012·Granted Dec 30, 2014·62 cites·18 claims
- 1297US8476769B2Through-silicon vias and methods for forming the sameCHEN CHIH-HUA·Filed 2007·Granted Jul 2, 2013·67 cites·27 claims
- 1397US7969013B2Through silicon via with dummy structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2010·Granted Jun 28, 2011·32 cites·10 claims
- 1497US7956442B2Backside connection to TSVs having redistribution linesTAIWAN SEMICONDUCTOR MFG·Filed 2008·Granted Jun 7, 2011·55 cites·14 claims
- 1597US7816227B2Tapered through-silicon via structureTAIWAN SEMICONDUCTOR MFG·Filed 2009·Granted Oct 19, 2010·45 cites·20 claims
- 1697US7633165B2Introducing a metal layer between SiN and TiN to improve CBD contact resistance for P-TSVTAIWAN SEMICONDUCTOR MANFACTUR·Filed 2008·Granted Dec 15, 2009·188 cites·18 claims
- 1796US11854835B2Heterogeneous bonding structure and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·2 cites·20 claims
- 1896US9773755B2Substrate interconnections having different sizesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Sep 26, 2017·16 cites·20 claims
- 1996US9640521B2Multi-die package with bridge layer and method for making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted May 2, 2017·15 cites·20 claims
- 2096US9425136B2Conical-shaped or tier-shaped pillar connectionsKUO TIN-HAO·Filed 2012·Granted Aug 23, 2016·24 cites·17 claims
- 2196US8928114B2Through-assembly via modules and methods for forming the sameCHEN CHIH-HUA·Filed 2012·Granted Jan 6, 2015·26 cites·20 claims
- 2296US8158489B2Formation of TSV backside interconnects by modifying carrier wafersHUANG HON-LIN·Filed 2010·Granted Apr 17, 2012·47 cites·16 claims
- 2396US8158456B2Method of forming stacked diesCHEN MING-FA·Filed 2008·Granted Apr 17, 2012·127 cites·20 claims
- 2495US11302537B2Chip package structure with conductive adhesive layer and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 12, 2022·3 cites·20 claims
- 2595US10276548B2Semiconductor packages having dummy connectors and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 30, 2019·11 cites·20 claims
- 2695US9508674B2Warpage control of semiconductor die packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Nov 29, 2016·18 cites·20 claims
- 2795US9490167B2Pop structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Nov 8, 2016·12 cites·20 claims
- 2895US9224688B2Metal routing architecture for integrated circuitsTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Dec 29, 2015·17 cites·20 claims
- 2995US9035461B2Packaged semiconductor devices and packaging methodsTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted May 19, 2015·19 cites·19 claims
- 3095US8513119B2Method of forming bump structure having tapered sidewalls for stacked diesCHANG HUNG-PIN·Filed 2008·Granted Aug 20, 2013·35 cites·12 claims
- 3195US8318596B2Pillar structure having a non-planar surface for semiconductor devicesKUO TIN-HAO·Filed 2010·Granted Nov 27, 2012·24 cites·22 claims
- 3295US8299616B2T-shaped post for semiconductor devicesCHUANG YAO-CHUN·Filed 2010·Granted Oct 30, 2012·24 cites·20 claims
- 3394US12327782B2Systems for semiconductor package mounting with improved co-planarityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 10, 2025·2 cites·20 claims
- 3494US12131974B2Semiconductor package and method of manufacturing semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 29, 2024·2 cites·20 claims
- 3594US10510710B2Bump-on-trace interconnectTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·6 cites·20 claims
- 3694US10157884B23D die stacking structure with fine pitchesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 18, 2018·9 cites·20 claims
- 3794US9881885B2Metal routing architecture for integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jan 30, 2018·11 cites·19 claims
- 3894US9449941B2Connecting function chips to a package to form package-on-packageTSAI PEI-CHUN·Filed 2011·Granted Sep 20, 2016·44 cites·19 claims
- 3994US9287234B2Dummy flip chip bumps for reducing stressTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Mar 15, 2016·10 cites·20 claims
- 4094US9117825B2Substrate pad structureTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Aug 25, 2015·12 cites·19 claims
- 4194US8889484B2Apparatus and method for a component packageTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Nov 18, 2014·16 cites·20 claims
- 4294US8853853B2Bump structuresCHANG CHIH-HORNG·Filed 2011·Granted Oct 7, 2014·24 cites·20 claims
- 4394US8829673B2Bonded structures for package and substrateTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Sep 9, 2014·17 cites·20 claims
- 4494US8803319B2Pillar structure having a non-planar surface for semiconductor devicesTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Aug 12, 2014·14 cites·20 claims
- 4594US8736050B2Front side copper post joint structure for temporary bond in TSV applicationHUANG HON-LIN·Filed 2010·Granted May 27, 2014·23 cites·14 claims
- 4694US8653626B2Package structures including a capacitor and methods of forming the sameLO SUT-I·Filed 2012·Granted Feb 18, 2014·51 cites·19 claims
- 4794US8049327B2Through-silicon via with scalloped sidewallsTAIWAN SEMICONDUCTOR MFG·Filed 2009·Granted Nov 1, 2011·30 cites·20 claims
- 4894US8034708B2Structure and process for the formation of TSVsTAIWAN SEMICONDUCTOR MFG·Filed 2010·Granted Oct 11, 2011·13 cites·21 claims
- 4993US11862588B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 2, 2024·2 cites·20 claims
- 5093US11764118B2Structure and formation method of chip package with protective lidTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 19, 2023·2 cites·20 claims
Showing the top 50 of 436 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →