Inventor · disambiguated record
Chien-Hui Chen
Also filed as: CHEN CHIEN-HUI
36 granted patents·4 pending applications·130 citations·filing 2005–2025
96Inventor score
Top patents by PatentIndex Score
40 records- 0196US12027396B2Systems and methods for systematic physical failure analysis (PFA) fault localizationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 2, 2024·2 cites·20 claims
- 0295US8692382B2Chip packageYEN YU-LIN·Filed 2011·Granted Apr 8, 2014·23 cites·25 claims
- 0394US8525345B2Chip package and method for forming the sameYEN YU-LIN·Filed 2011·Granted Sep 3, 2013·21 cites·18 claims
- 0491US8952501B2Chip package and method for forming the sameXINTEC INC·Filed 2013·Granted Feb 10, 2015·14 cites·27 claims
- 0590US8963312B2Stacked chip package and method for forming the sameXINTEC INC·Filed 2014·Granted Feb 24, 2015·11 cites·23 claims
- 0688US11600505B2Systems and methods for systematic physical failure analysis (PFA) fault localizationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 7, 2023·3 cites·20 claims
- 0788US2025323074A1Systems and methods for systematic physical failure analysis (pfa) fault localizationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0886US12374572B2Systems and methods for systematic physical failure analysis (PFA) fault localizationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 29, 2025·0 cites·20 claims
- 0986US8113412B1Methods for detecting defect connections between metal bumpsTSENG NAN-HSIN·Filed 2011·Granted Feb 14, 2012·7 cites·20 claims
- 1084US9355975B2Chip package and method for forming the sameXINTEC INC·Filed 2014·Granted May 31, 2016·6 cites·18 claims
- 1183US11601015B2Wireless chargerCYNTEC CO LTD·Filed 2022·Granted Mar 7, 2023·1 cites·20 claims
- 1277US8698316B2Chip packageYEN YU-LIN·Filed 2011·Granted Apr 15, 2014·3 cites·26 claims
- 1376US7283733B2System and method for regulating a load by utilizing pulse width modulationAOPEN INC·Filed 2005·Granted Oct 16, 2007·9 cites·20 claims
- 1475US9209124B2Chip packageXINTEC INC·Filed 2013·Granted Dec 8, 2015·3 cites·26 claims
- 1573US9349710B2Chip package and method for forming the sameXINTEC INC·Filed 2014·Granted May 24, 2016·2 cites·20 claims
- 1673US9184092B2Chip package and method for forming the sameXINTEC INC·Filed 2014·Granted Nov 10, 2015·2 cites·32 claims
- 1773US8878367B2Substrate structure with through viasLIN CHIA-SHENG·Filed 2011·Granted Nov 4, 2014·4 cites·19 claims
- 1873US8552565B2Chip package and method for forming the sameYEN YU-LIN·Filed 2011·Granted Oct 8, 2013·3 cites·17 claims
- 1970US12488933B2Wireless charger having thermoelectric cooler chips for dissipating heatCYNTEC CO LTD·Filed 2021·Granted Dec 2, 2025·0 cites·12 claims
- 2070US8951836B2Chip package and method for forming the sameXINTEC INC·Filed 2014·Granted Feb 10, 2015·2 cites·20 claims
- 2168US9437478B2Chip package and method for forming the sameXINTEC INC·Filed 2014·Granted Sep 6, 2016·2 cites·27 claims
- 2268US9425134B2Chip packageXINTEC INC·Filed 2014·Granted Aug 23, 2016·2 cites·21 claims
- 2368US9318461B2Wafer level array of chips and method thereofXINTEC INC·Filed 2014·Granted Apr 19, 2016·2 cites·23 claims
- 2467US9024437B2Chip package and method for forming the sameYEN YU-LIN·Filed 2012·Granted May 5, 2015·2 cites·19 claims
- 2567US8558262B2High-reflection submount for light-emitting diode package and fabrication method thereofWU SHANG-YI·Filed 2011·Granted Oct 15, 2013·2 cites·7 claims
- 2666US8981842B1Integrated circuit comprising buffer chainTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Mar 17, 2015·1 cites·20 claims
- 2765US9355970B2Chip package and method for forming the sameXINTEC INC·Filed 2015·Granted May 31, 2016·1 cites·9 claims
- 2863US9165890B2Chip package comprising alignment mark and method for forming the sameXINTEC INC·Filed 2013·Granted Oct 20, 2015·1 cites·20 claims
- 2959US8836134B2Semiconductor stacked package and method of fabricating the sameLIN PO-SHEN·Filed 2013·Granted Sep 16, 2014·1 cites·10 claims
- 3057US2025088032A1Wireless charging moduleCYNTEC CO LTD·Filed 2023·Application pending·0 cites
- 3153US8778707B2High-reflection submount for light-emitting diode package and fabrication method thereofXINTEC INC·Filed 2013·Granted Jul 15, 2014·0 cites·13 claims
- 3251US9478469B2Integrated circuit comprising buffer chainTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 25, 2016·0 cites·20 claims
- 3348US9305843B2Chip package and method for forming the sameXINTEC INC·Filed 2015·Granted Apr 5, 2016·0 cites·10 claims
- 3447US2012267780A1Chip package and method for forming the sameCHEN BING-SIANG·Filed 2012·Application pending·0 cites
- 3544US9275963B2Semiconductor structure having stage difference surface and manufacturing method thereofXINTEC INC·Filed 2014·Granted Mar 1, 2016·0 cites·14 claims
- 3643US10388541B2Wafer coating system and method of manufacturing chip packageXINTEC INC·Filed 2016·Granted Aug 20, 2019·0 cites·14 claims
- 3742US8643070B2Chip package and method for forming the sameCHANG SHU-MING·Filed 2011·Granted Feb 4, 2014·0 cites·20 claims
- 3842US7975157B2Host device with power-saving functionJMICRON TECHNOLOGY CORP·Filed 2008·Granted Jul 5, 2011·0 cites·13 claims
- 3937US2018052500A1Electronic deviceAOPEN INC·Filed 2016·Application pending·0 cites
- 4033US9711403B2Method for forming chip packageCHEN CHIEN-HUI·Filed 2012·Granted Jul 18, 2017·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →