Inventor · disambiguated record
Chien-Hsun Chen
Also filed as: CHEN CHIEN DA · CHEN CHIEN-HSUN
64 granted patents·37 pending applications·235 citations·filing 2002–2025
98Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD39PURDUE RESEARCH FOUNDATION9CHEN CHIEN HSUN6WISECHIP SEMICONDUCTOR INC5HIGHLIGHT TECH CORP4
Top patents by PatentIndex Score
101 records- 0198US9700251B2Enclosed desorption electrospray ionization probes and method of use thereofPURDUE RESEARCH FOUNDATION·Filed 2017·Granted Jul 11, 2017·29 cites·20 claims
- 0297US10004440B2Enclosed desorption electrospray ionization probes and method of use thereofPURDUE RESEARCH FOUNDATION·Filed 2017·Granted Jun 26, 2018·17 cites·20 claims
- 0396US9538945B2Desorption electrospray ionization sampling without damaging an in vivo tissue samplePURDUE RESEARCH FOUNDATION·Filed 2015·Granted Jan 10, 2017·34 cites·20 claims
- 0496US9024254B2Enclosed desorption electrospray ionization probes and method of use thereofCOOKS ROBERT GRAHAM·Filed 2012·Granted May 5, 2015·39 cites·19 claims
- 0594US11923315B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 5, 2024·2 cites·20 claims
- 0693US11715686B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 1, 2023·2 cites·20 claims
- 0792US11304637B2Enclosed desorption electrospray ionization probes and method of use thereofPURDUE RESEARCH FOUNDATION·Filed 2020·Granted Apr 19, 2022·2 cites·10 claims
- 0892US9841789B2Hinge assembly for electronic deviceASUSTEK COMP INC·Filed 2017·Granted Dec 12, 2017·9 cites·9 claims
- 0991US11171090B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 9, 2021·6 cites·20 claims
- 1091US11088059B2Package structure, RDL structure comprising redistribution layer having ground plates and signal lines and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 10, 2021·5 cites·20 claims
- 1191US9823706B2Hinge component and the electronic device using thereofASUSTEK COMP INC·Filed 2017·Granted Nov 21, 2017·14 cites·10 claims
- 1290US9847320B2Semiconductor structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 19, 2017·7 cites·17 claims
- 1389US10665520B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 26, 2020·4 cites·20 claims
- 1489US10213143B2Enclosed desorption electrospray ionization probes and method of use thereofPURDUE RESEARCH FOUNDATION·Filed 2018·Granted Feb 26, 2019·5 cites·20 claims
- 1588US10971446B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 6, 2021·4 cites·20 claims
- 1688US8681326B2Method and apparatus for monitoring mask process impact on lithography performanceTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Mar 25, 2014·9 cites·17 claims
- 1787US11670575B2Package structure, RDL structure comprising redistribution layer having ground plates and signal linesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 6, 2023·1 cites·20 claims
- 1887US7527860B2Vertical aligned nano-scale diamond structure and process for fabricating the sameUNIV TSINGHUA·Filed 2005·Granted May 5, 2009·14 cites·2 claims
- 1986US12354924B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 8, 2025·0 cites·20 claims
- 2085US9276549B1Via system of printed circuit board and method of making sameSCIENBIZIP CONSULTING SHENZHEN CO LTD·Filed 2014·Granted Mar 1, 2016·9 cites·20 claims
- 2184US12489062B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Dec 2, 2025·0 cites·20 claims
- 2284US11532587B2Method for manufacturing semiconductor package with connection structures including via groupsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 20, 2022·1 cites·20 claims
- 2384US10799165B2Enclosed desorption electrospray ionization probes and method of use thereofPURDUE RESEARCH FOUNDATION·Filed 2019·Granted Oct 13, 2020·2 cites·10 claims
- 2483US2025311102A1Laminated structure with padsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2582US11984375B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted May 14, 2024·0 cites·20 claims
- 2681US2025357410A1Method for manufacturing semiconductor package with connection structures including via groupsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2780US12249564B2Package structure, RDL structure comprising redistribution layer having ground plates and signal linesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 11, 2025·0 cites·20 claims
- 2880US11903707B2Enclosed desorption electrospray ionization probes and method of use thereofPURDUE RESEARCH FOUNDATION·Filed 2022·Granted Feb 20, 2024·0 cites·10 claims
- 2980US11515173B2Semiconductor devices and methods of manufacturingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 29, 2022·1 cites·20 claims
- 3080US11387576B1Antenna systemWISTRON CORP·Filed 2021·Granted Jul 12, 2022·1 cites·19 claims
- 3180US8378319B2System and method for generating direct-write patternTAIWAN SEMICONDUCTOR MFG·Filed 2010·Granted Feb 19, 2013·4 cites·20 claims
- 3277US2025183143A1Method of forming package structure, rdl structure comprising redistribution layer having ground plates and signal linesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3377US2024222307A1Integrated circuit packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3477US2025079326A1Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3576US12191251B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 7, 2025·0 cites·20 claims
- 3676US11658085B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 23, 2023·0 cites·20 claims
- 3776US11062998B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 13, 2021·1 cites·20 claims
- 3876US2024379538A1Semiconductor Device and Method of ManufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3976US2025329665A1Dielectric Slots Underneath Conductive Vias in Interconnect Structure of Semiconductor Package and Method of Forming the SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4075US9276548B2Stacked LC resonator and band pass filter using the sameUNIV NAT SUN YAT SEN·Filed 2012·Granted Mar 1, 2016·3 cites·9 claims
- 4175US2024363366A1Semiconductor devices and methods of manufacturingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4274US11961814B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 16, 2024·0 cites·20 claims
- 4373US12469812B2Method for manufacturing semiconductor package with connection structures including via groupsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 11, 2025·0 cites·20 claims
- 4473US12418982B2Laminated structure with pads and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 16, 2025·0 cites·20 claims
- 4573US12080563B2Semiconductor devices and methods of manufacturingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 3, 2024·0 cites·20 claims
- 4673US10555694B2Enclosed desorption electrospray ionization probes and method of use thereofPURDUE RESEARCH FOUNDATION·Filed 2019·Granted Feb 11, 2020·0 cites·20 claims
- 4771US11217497B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 4, 2022·0 cites·20 claims
- 4869US8609456B2Method for fabricating semiconductor layer having textured surface and method for fabricating solar cellWang teng-yu·Filed 2012·Granted Dec 17, 2013·2 cites·16 claims
- 4968US12406941B2Dielectric slots underneath conductive vias in interconnect structure of semiconductor package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 2, 2025·0 cites·20 claims
- 5068US10420495B2Enclosed desorption electrospray ionization probes and method of use thereofPURDUE RESEARCH FOUNDATION·Filed 2019·Granted Sep 24, 2019·0 cites·20 claims
Showing the top 50 of 101 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →