Inventor · disambiguated record
Chia-Yin Chen
Also filed as: CHEN CHIA-YIN
14 granted patents·2 pending applications·27 citations·filing 1989–2025
88Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD11CHEN CHIA-YIN1LEE CHANG YUNG CHEMICAL IND CORP1NAT SCIENCE COUNCIL1SILICONWARE PRECISION INDUSTRIES CO LTD1
Top patents by PatentIndex Score
16 records- 0192US10269611B1Method and apparatus for bonding semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 23, 2019·10 cites·20 claims
- 0288US9449898B2Semiconductor device having backside interconnect structure through substrate via and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Sep 20, 2016·6 cites·20 claims
- 0385US10510641B2Semiconductor device having backside interconnect structure on through substrate via and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 17, 2019·3 cites·18 claims
- 0485US2025266325A1Semiconductor Device Having Backside Interconnect Structure on Through Substrate ViaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0584US12322680B2Semiconductor device having backside interconnect structure on through substrate viaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 3, 2025·0 cites·20 claims
- 0678US8901729B2Semiconductor package, packaging substrate and fabrication method thereofCHEN CHIA-YIN·Filed 2012·Granted Dec 2, 2014·6 cites·12 claims
- 0777US11056419B2Semiconductor device having backside interconnect structure on through substrate via and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 6, 2021·1 cites·19 claims
- 0875US11823979B2Method of forming semiconductor device having backside interconnect structure on through substrate viaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 21, 2023·0 cites·20 claims
- 0968US10867831B1Method and apparatus for bonding semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 15, 2020·0 cites·20 claims
- 1059US10748803B2Method and apparatus for bonding semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 18, 2020·0 cites·20 claims
- 1155US11948920B2Semiconductor device and method for manufacturing the same, and semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 2, 2024·0 cites·18 claims
- 1253US9269677B2Fabrication method of packaging substrateSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Feb 23, 2016·0 cites·9 claims
- 1353US2024274461A1Bonding tool for providing chip on wafer bond and methods for performing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1447US12506482B2Oscillating deviceTXC CORP·Filed 2024·Granted Dec 23, 2025·0 cites·8 claims
- 1543US9616697B2Blanket for transferring a paste image from an engraved plate to a substrateLEE CHANG YUNG CHEMICAL IND CORP·Filed 2015·Granted Apr 11, 2017·0 cites·16 claims
- 1635US4929728AProcess for preparing 3-(1H-tetrazol-5-yl)-4(3H)-quinazolinoneNAT SCIENCE COUNCIL·Filed 1989·Granted May 29, 1990·1 cites·5 claims
Join the waitlist — get patent alerts
Get an alert when Chia-Yin Chen files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →