Inventor · disambiguated record
Chun-Jen Chen
Also filed as: CHEN CHUN · CHEN CHUN-JEN · CHEN CHUN-JEN KEVIN
107 granted patents·47 pending applications·310 citations·filing 1997–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD30UNITED MICROELECTRONICS CORP26HON HAI PREC IND CO LTD15HUANG TSUNG-SHENG10CHEN CHUN-JEN5
Top patents by PatentIndex Score
154 records- 0196US11495686B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2021·Granted Nov 8, 2022·4 cites·19 claims
- 0296US9431483B1Nanowire and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2015·Granted Aug 30, 2016·16 cites·11 claims
- 0396US8101586B2Methods and compositions for the treatment of sterile inflammationROCK KENNETH L·Filed 2010·Granted Jan 24, 2012·33 cites·10 claims
- 0495US11545560B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2021·Granted Jan 3, 2023·4 cites·9 claims
- 0595US11302646B2Semiconductor device packageADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Apr 12, 2022·5 cites·14 claims
- 0695US9379182B1Method for forming nanowire and semiconductor device formed with the nanowireUNITED MICROELECTRONICS CORP·Filed 2015·Granted Jun 28, 2016·13 cites·8 claims
- 0791US8592102B2Cost-effective method for extreme ultraviolet (EUV) mask productionLIN CHIN-HSIANG·Filed 2009·Granted Nov 26, 2013·16 cites·13 claims
- 0890US9671685B2Lithographic plane check for mask processingLIN CHIN-HSIANG·Filed 2010·Granted Jun 6, 2017·8 cites·13 claims
- 0990US2025357196A1Electron migration control in interconnect structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1089US11876551B2Electronic moduleADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Jan 16, 2024·2 cites·19 claims
- 1189US10943991B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2019·Granted Mar 9, 2021·4 cites·8 claims
- 1288US2025364441A1Semiconductor device package and methods of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1388US2025372540A1Semiconductor device package and methods of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1487US12176297B2Semiconductor device packageADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Dec 24, 2024·1 cites·17 claims
- 1585US8237499B2Feedforward controlled envelope modulator and feedforward control circuit thereofCHEN CHUN-JEN·Filed 2010·Granted Aug 7, 2012·14 cites·25 claims
- 1684US12300743B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2024·Granted May 13, 2025·0 cites·7 claims
- 1784US12237415B2Method for fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2023·Granted Feb 25, 2025·0 cites·8 claims
- 1882US12051634B2Package and package-on-package structure having elliptical columns and ellipsoid joint terminalsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 30, 2024·0 cites·20 claims
- 1982US10510609B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted Dec 17, 2019·2 cites·1 claims
- 2082US10090267B2Bump structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Oct 2, 2018·5 cites·20 claims
- 2182US8413097B2Computing device and method for checking design of printed circuit board layout fileWU DAN-CHEN·Filed 2012·Granted Apr 2, 2013·8 cites·9 claims
- 2282US7791429B2Equalizer and connector including the sameHON HAI PREC IND CO LTD·Filed 2008·Granted Sep 7, 2010·10 cites·9 claims
- 2381US12444647B2Electron migration control in interconnect structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 14, 2025·0 cites·20 claims
- 2481US8604954B2Timing calibration circuit for time-interleaved analog-to-digital converter and associated methodCHEN CHUN-JEN·Filed 2012·Granted Dec 10, 2013·12 cites·21 claims
- 2581US2025271753A1Microcapsule imaging system including non-photopolymerizable reactive diluentPOLAROID IP B V·Filed 2025·Application pending·0 cites
- 2680US11769833B2Method for fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2022·Granted Sep 26, 2023·0 cites·9 claims
- 2780US10573573B2Package and package-on-package structure having elliptical conductive columnsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Feb 25, 2020·2 cites·20 claims
- 2880US9735123B2Semiconductor device structure and manufacturing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Aug 15, 2017·5 cites·20 claims
- 2980US8283571B2Printed circuit boardLAI YING-TSO·Filed 2010·Granted Oct 9, 2012·5 cites·2 claims
- 3080US2025241038A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 3179US10163843B2Semiconductor device structure and manufacturing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·2 cites·20 claims
- 3279US8390343B2Injection-locked frequency dividerCHANG HONG-YEH·Filed 2010·Granted Mar 5, 2013·5 cites·10 claims
- 3379US7454296B2Biosensor with multi-channel A/D conversion and a method thereofWANG KUO-JENG·Filed 2003·Granted Nov 18, 2008·16 cites·20 claims
- 3478US12021134B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2022·Granted Jun 25, 2024·0 cites·14 claims
- 3578US8536852B2Current balance circuit to keep dynamic balance between currents in power passages of power connectorHUANG TSUNG-SHENG·Filed 2010·Granted Sep 17, 2013·6 cites·5 claims
- 3677US9997482B2Solder stud structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jun 12, 2018·4 cites·20 claims
- 3776US12401387B2Electronic moduleADVANCED SEMICONDUCTOR ENG·Filed 2024·Granted Aug 26, 2025·0 cites·18 claims
- 3876US11756849B2Package and package-on-package structure having elliptical columns and ellipsoid joint terminalsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 12, 2023·0 cites·17 claims
- 3975US12482763B2Semiconductor device package and methods of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 25, 2025·0 cites·20 claims
- 4075US12354907B2Electron migration control in interconnect structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 8, 2025·0 cites·20 claims
- 4175US12321095B2Microcapsule imaging system including non-photopolymerizable reactive diluentPOLAROID IP B V·Filed 2022·Granted Jun 3, 2025·0 cites·21 claims
- 4275US10366991B1Semiconductor device and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2018·Granted Jul 30, 2019·2 cites·22 claims
- 4375US9748386B2Epitaxial structure of semiconductor device and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2015·Granted Aug 29, 2017·2 cites·20 claims
- 4475US8294035B2Printed circuit board to prevent electrostatic discharge and manufacturing method thereofCHOU WEI-CHIEH·Filed 2010·Granted Oct 23, 2012·4 cites·8 claims
- 4575US7657564B2Method for selecting a ferrite bead for a filterHON HAI PREC IND CO LTD·Filed 2006·Granted Feb 2, 2010·9 cites·8 claims
- 4675US7552353B2Controlling circuit for automatically adjusting clock frequency of a central processing unitHON HAI PREC IND CO LTD·Filed 2006·Granted Jun 23, 2009·7 cites·15 claims
- 4775US2025169119A1Method for fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 4874US8793631B2Computing device and method for automatically checking wiring informationHON HAI PREC IND CO LTD·Filed 2013·Granted Jul 29, 2014·5 cites·15 claims
- 4974US8493105B2Injection-locked frequency dividerCHANG HONG-YEH·Filed 2011·Granted Jul 23, 2013·4 cites·11 claims
- 5074US7680008B2Recording method and apparatus for optical disk driveMEDIATEK INC·Filed 2007·Granted Mar 16, 2010·2 cites·5 claims
Showing the top 50 of 154 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →