Inventor · disambiguated record
Chin-Hung Chen
Also filed as: CHEN CHIN-HUNG
60 granted patents·28 pending applications·374 citations·filing 2006–2025
98Inventor score
Files withUNITED MICROELECTRONICS CORP51QUALCOMM INC14CHEN CHIN HUNG12IND TECH RES INST4HON YOUNG SEMICONDUCTOR CORP3
Top patents by PatentIndex Score
88 records- 0199US8755756B1Active cancellation of interference in a wireless communication systemZHANG NING·Filed 2010·Granted Jun 17, 2014·115 cites·22 claims
- 0298US11901239B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2023·Granted Feb 13, 2024·2 cites·12 claims
- 0398US11062954B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2020·Granted Jul 13, 2021·11 cites·5 claims
- 0497US11721591B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2021·Granted Aug 8, 2023·3 cites·5 claims
- 0596US10985264B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2019·Granted Apr 20, 2021·9 cites·9 claims
- 0696US10607882B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted Mar 31, 2020·12 cites·9 claims
- 0796US10249488B1Semiconductor devices with same conductive type but different threshold voltages and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted Apr 2, 2019·12 cites·7 claims
- 0895US12068309B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2022·Granted Aug 20, 2024·2 cites·17 claims
- 0995US8804612B1Triggering and transmitting sounding packets for wireless communicationsCHEN CHIN-HUNG·Filed 2009·Granted Aug 12, 2014·33 cites·13 claims
- 1095US8175538B1Calibrating a wireless communication deviceCHEN CHIN-HUNG·Filed 2008·Granted May 8, 2012·33 cites·36 claims
- 1192US10395991B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2017·Granted Aug 27, 2019·7 cites·20 claims
- 1292US8295263B1Triggering and transmitting sounding packets for wireless communicationsCHEN CHIN HUNG·Filed 2009·Granted Oct 23, 2012·23 cites·29 claims
- 1391US11632273B1Processing multiuser multiple-input multiple-output communications having unavailable spatial streamsQUALCOMM INC·Filed 2021·Granted Apr 18, 2023·3 cites·28 claims
- 1491US8514976B2Method and apparatus for coding and interleaving for very high throughput wireless communicationsKIM YOUHAN·Filed 2011·Granted Aug 20, 2013·17 cites·29 claims
- 1591US8042031B2Maximum likelihood detection method and systemIND TECH RES INST·Filed 2007·Granted Oct 18, 2011·23 cites·24 claims
- 1691US2025113589A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 1790US11495681B2Semiconductor device and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2020·Granted Nov 8, 2022·2 cites·16 claims
- 1890US10971397B2Semiconductor device and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2019·Granted Apr 6, 2021·5 cites·19 claims
- 1990US2024379451A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 2089US2024371703A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 2188US12261086B2Method for integrating high-voltage (HV) device, medium-voltage (MV) device, and low-voltage (LV) deviceUNITED MICROELECTRONICS CORP·Filed 2022·Granted Mar 25, 2025·1 cites·7 claims
- 2288US12211751B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2023·Granted Jan 28, 2025·0 cites·12 claims
- 2388US11710778B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2021·Granted Jul 25, 2023·1 cites·10 claims
- 2487US8681896B1Transmitter I/Q and carrier leak calibrationCHEN CHIN-HUNG·Filed 2010·Granted Mar 25, 2014·11 cites·27 claims
- 2586US12074070B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2023·Granted Aug 27, 2024·0 cites·7 claims
- 2686US11152515B2Semiconductor device and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2019·Granted Oct 19, 2021·3 cites·9 claims
- 2785US12094783B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2023·Granted Sep 17, 2024·0 cites·9 claims
- 2885US2024395909A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 2984US12094956B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2023·Granted Sep 17, 2024·0 cites·8 claims
- 3079US8953726B2Antenna selection technique for fast diversityCHEN CHIN-HUNG·Filed 2012·Granted Feb 10, 2015·5 cites·6 claims
- 3178US10529825B2Semiconductor device and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2018·Granted Jan 7, 2020·2 cites·18 claims
- 3277US11600531B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2021·Granted Mar 7, 2023·0 cites·12 claims
- 3377US9178581B2Method and apparatus for coding and interleaving for very high throughput wireless communicationsQUALCOMM INC·Filed 2013·Granted Nov 3, 2015·3 cites·30 claims
- 3475US11557654B2Method for fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2021·Granted Jan 17, 2023·0 cites·14 claims
- 3574US11646349B2Structure of semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2021·Granted May 9, 2023·0 cites·7 claims
- 3674US2024371855A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 3773US12272693B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2022·Granted Apr 8, 2025·0 cites·20 claims
- 3873US11417564B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2021·Granted Aug 16, 2022·0 cites·12 claims
- 3971US11195918B1Structure of semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2020·Granted Dec 7, 2021·0 cites·7 claims
- 4071US10854502B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2020·Granted Dec 1, 2020·0 cites·15 claims
- 4171US2023261108A1Manufacturing method for high-voltage transistorUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 4271US2025204039A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 4370US10985048B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2020·Granted Apr 20, 2021·0 cites·11 claims
- 4470US8160182B2Symbol detector and sphere decoding methodCHEN CHIN-HUNG·Filed 2009·Granted Apr 17, 2012·4 cites·28 claims
- 4569USD864835SVehicle wheelCHEN CHIN HUNG·Filed 2017·Granted Oct 29, 2019·11 cites·1 claims
- 4669US8132065B2Hybrid sphere decoding method and systemCHEN CHIN-HUNG·Filed 2007·Granted Mar 6, 2012·4 cites·25 claims
- 4768US11682728B2Structure of high-voltage transistor and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2020·Granted Jun 20, 2023·0 cites·15 claims
- 4868US2025194226A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 4967US9124318B2Smart antenna array configuration for multiple-input multiple-output communicationsQUALCOMM INC·Filed 2013·Granted Sep 1, 2015·2 cites·15 claims
- 5066US11721770B2Manufacturing method of semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2021·Granted Aug 8, 2023·0 cites·12 claims
Showing the top 50 of 88 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →