Inventor · disambiguated record

Chii-Ping Chen

Also filed as: CHEN CHII-PING

43 granted patents·10 pending applications·116 citations·filing 2003–2025

97Inventor score

Technology areasH10W H10P G03F H10D B24B

Files withTAIWAN SEMICONDUCTOR MFG CO LTD38 TAIWAN SEMICONDUCTOR MFG6 CHEN CHII-PING2 CHIH MING-HUI2 HUANG CHENG-LIN1

Top patents by PatentIndex Score

53 records

0196US11798848B2Semiconductor device structure with resistive elementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 24, 2023·2 cites·20 claims
0295US11942390B2Thermal dissipation in semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 26, 2024·2 cites·20 claims
0395US11694926B2Barrier free interface between beol interconnectsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 4, 2023·4 cites·20 claims
0495US11551968B2Inter-wire cavity for low capacitanceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 10, 2023·4 cites·20 claims
0594US11342222B2Self-aligned scheme for semiconductor device and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 24, 2022·3 cites·20 claims
0692US11217482B2Method for forming semiconductor device with resistive elementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jan 4, 2022·5 cites·20 claims
0792US10985011B2Structure and formation method of semiconductor device with resistive elementsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 20, 2021·6 cites·20 claims
0892US10304772B2Semiconductor device structure with resistive elementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 28, 2019·7 cites·20 claims
0991US8304906B2Partial air gap formation for providing interconnect isolation in integrated circuitsHUANG CHENG-LIN·Filed 2010·Granted Nov 6, 2012·19 cites·20 claims
1090US11404369B2Semiconductor device structure with resistive elementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 2, 2022·5 cites·20 claims
1190US10515852B2Structure and formation method of semiconductor device with resistive elementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 24, 2019·4 cites·20 claims
1288US11355410B2Thermal dissipation in semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 7, 2022·2 cites·20 claims
1387US2025364328A1Self-aligned scheme for semiconductor device and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
1486US2025329584A1Self-aligned scheme for semiconductor device and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
1585US11901228B2Self-aligned scheme for semiconductor device and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 13, 2024·1 cites·20 claims
1684US8436473B2Integrated circuits including air gaps around interconnect structures, and fabrication methods thereofCHEN CHII-PING·Filed 2010·Granted May 7, 2013·7 cites·19 claims
1784US2025343095A1Thermal dissipation in semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
1883US12119262B2Semiconductor device structure with resistive elementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 15, 2024·0 cites·20 claims
1982US12451401B2Thermal dissipation in semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Oct 21, 2025·0 cites·20 claims
2082US2024404953A1Diffusion barrier layer for conductive via to decrease contact resistanceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
2180US12387977B2Self-aligned scheme for semiconductor device and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 12, 2025·0 cites·20 claims
2280US12368103B2Diffusion barrier layer for conductive via to decrease contact resistanceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 22, 2025·0 cites·20 claims
2380US11362035B2Diffusion barrier layer for conductive via to decrease contact resistanceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 14, 2022·1 cites·20 claims
2479US12476146B2Self-aligned scheme for semiconductor device and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Nov 18, 2025·0 cites·20 claims
2579US12040178B2Method for manufacturing semiconductor structure with resistive elementsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 16, 2024·0 cites·20 claims
2677US2025323164A1Semiconductor device structure with barrier layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
2776US11742291B2Diffusion barrier layer for conductive via to decrease contact resistanceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 29, 2023·0 cites·20 claims
2876US8617986B2Integrated circuits and methods for forming the integrated circuitsLIANG MING-CHUNG·Filed 2010·Granted Dec 31, 2013·4 cites·20 claims
2975US11901289B2Semiconductor device structure with resistive elementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 13, 2024·0 cites·20 claims
3075US11830770B2Self-aligned scheme for semiconductor device and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 28, 2023·0 cites·20 claims
3174US12362235B2Barrier free interface between BEOL interconnectsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 15, 2025·0 cites·20 claims
3274US2025316531A1Inter-wire cavity for low capacitanceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
3374US2024379436A1Self-aligned interconnect structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
3473US2025300011A1Barrier free interface between beol interconnectsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
3572US12341101B2Method for forming a semiconductor structure by diffusing manganese from a seed layer to a barrier layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 24, 2025·0 cites·20 claims
3672US11670501B2Semiconductor device structure with resistive elementsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 6, 2023·0 cites·20 claims
3769US9496217B2Method and apparatus of forming a viaTSAI HSIN-YI·Filed 2009·Granted Nov 15, 2016·5 cites·20 claims
3869US6949007B1System and method for multi-stage process control in film removalTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Sep 27, 2005·15 cites·18 claims
3969US6756309B1Feed forward process control method for adjusting metal line RsTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Jun 29, 2004·18 cites·19 claims
4067US10164002B2Semiconductor device and layout methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·1 cites·20 claims
4165US12165947B2Semiconductor devices and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 10, 2024·0 cites·20 claims
4261US2023011792A1Self-Aligned Interconnect Structure And Method Of Forming The SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Application pending·0 cites
4358US9257279B2Mask treatment for double patterning designYANG JIING-FENG·Filed 2012·Granted Feb 9, 2016·1 cites·20 claims
4458US9147602B2Methods of making integrated circuits including air gaps around interconnect structuresTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Sep 29, 2015·0 cites·20 claims
4555US8847405B2Integrated circuits including air gaps around interconnect structures, and fabrication methods thereofTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Sep 30, 2014·0 cites·20 claims
4654US9153484B2Methods of forming integrated circuitsTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Oct 6, 2015·0 cites·20 claims
4754US2024266279A1Conductive structure in semiconductor structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
4849US12512363B2Forming interconnect structures in semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 30, 2025·0 cites·20 claims
4948US8499261B2Method and apparatus of patterning semiconductor deviceCHIH MING-HUI·Filed 2012·Granted Jul 30, 2013·0 cites·4 claims
5046US9003336B2Mask assignment optimizationTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Apr 7, 2015·0 cites·18 claims

Showing the top 50 of 53 patent records by PatentIndex Score.

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →