Inventor · disambiguated record
Chia-Jen Cheng
Also filed as: CHENG CHIA-JEN
12 granted patents·7 pending applications·220 citations·filing 2002–2025
90Inventor score
Files withTAIWAN SEMICONDUCTOR MFG9TAIWAN SEMICONDUCTOR MFG CO LTD5CHEN TSUNG-JEN1DELTA ELECTRONICS INC1HUANG HON-LIN1
Top patents by PatentIndex Score
19 records- 0196US7863742B2Back end integrated WLCSP structure without aluminum padsTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Jan 4, 2011·72 cites·20 claims
- 0295US8624392B2Electrical connection for chip scale packagingYEW MING-CHIH·Filed 2011·Granted Jan 7, 2014·34 cites·20 claims
- 0382US6541366B1Method for improving a solder bump adhesion bond to a UBM contact layerTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Apr 1, 2003·48 cites·20 claims
- 0480US7122458B2Method for fabricating pad redistribution layerTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Oct 17, 2006·35 cites·17 claims
- 0564US8640569B2Freewheel structureCHEN TSUNG-JEN·Filed 2012·Granted Feb 4, 2014·3 cites·2 claims
- 0663US7187078B2Bump structureTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Mar 6, 2007·13 cites·21 claims
- 0763US2025364383A1Corner Reinforcement Structure for Package InterconnectTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0861US7459386B2Method for forming solder bumps of increased heightTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Dec 2, 2008·14 cites·11 claims
- 0960US2023087397A1Personnel tracking and disinfecting system and methodDELTA ELECTRONICS INC·Filed 2021·Application pending·0 cites
- 1060US2025210484A1Package structure including a package substrate and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1158US2025105115A1Corner Reinforcement Structure for Package InterconnectTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1257US7781140B2Method of fine pitch bump strippingTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Aug 24, 2010·1 cites·20 claims
- 1356US9087882B2Electrical connection for chip scale packagingTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jul 21, 2015·0 cites·20 claims
- 1451US9515038B2Electrical connection for chip scale packagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 6, 2016·0 cites·20 claims
- 1547US10157839B1Interconnect structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 18, 2018·0 cites·20 claims
- 1642US2008303154A1Through-silicon via interconnection formed with a cap layerHUANG HON-LIN·Filed 2007·Application pending·0 cites
- 1739US2008251916A1UBM structure for strengthening solder bumpsTAIWAN SEMICONDUCTOR MFG·Filed 2007·Application pending·0 cites
- 1836US2006046434A1Method for reducing lead precipitation during wafer processingTAIWAN SEMICONDUCTOR MFG·Filed 2004·Application pending·0 cites
- 1932US8669658B2Crosstalk-free WLCSP structure for high frequency applicationTSAI MON-CHIN·Filed 2007·Granted Mar 11, 2014·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →