Inventor · disambiguated record
Cheng-Lien Chiang
Also filed as: CHIANG CHENG-LIEN
51 granted patents·5 pending applications·2,166 citations·filing 1996–2011
99Inventor score
Files withBRIDGE SEMICONDUCTOR CORP39NICHEPAC TECHNOLOGY INC7IND TECH RES INST5CHIANG CHENG-LIEN3APACK TECHNOLOGIES INC2
Top patents by PatentIndex Score
56 records- 0199US7262082B1Method of making a three-dimensional stacked semiconductor package with a metal pillar and a conductive interconnect in an encapsulant apertureBRIDGE SEMICONDUCTOR CORP·Filed 2006·Granted Aug 28, 2007·134 cites·200 claims
- 0298US7417314B1Semiconductor chip assembly with laterally aligned bumped terminal and fillerBRIDGE SEMICONDUCTOR CORP·Filed 2006·Granted Aug 26, 2008·65 cites·100 claims
- 0398US7067911B1Three-dimensional stacked semiconductor package with metal pillar in encapsulant apertureBRIDGE SEMICONDUCTOR CORP·Filed 2004·Granted Jun 27, 2006·161 cites·150 claims
- 0498US7009297B1Semiconductor chip assembly with embedded metal particleBRIDGE SEMICONDUCTOR CORP·Filed 2004·Granted Mar 7, 2006·158 cites·110 claims
- 0596US6809414B1Semiconductor chip assembly with bumped conductive traceBRIDGE SEMICONDUCTOR CORP·Filed 2002·Granted Oct 26, 2004·73 cites·120 claims
- 0696US6744126B1Multichip semiconductor package deviceBRIDGE SEMICONDUCTOR CORP·Filed 2002·Granted Jun 1, 2004·91 cites·40 claims
- 0796US6486549B1Semiconductor module with encapsulant baseBRIDGE SEMICONDUCTOR CORP·Filed 2001·Granted Nov 26, 2002·134 cites·70 claims
- 0895US6740576B1Method of making a contact terminal with a plated metal peripheral sidewall portion for a semiconductor chip assemblyBRIDGE SEMICONDUCTOR CORP·Filed 2002·Granted May 25, 2004·105 cites·280 claims
- 0994US7190060B1Three-dimensional stacked semiconductor package device with bent and flat leads and method of making sameBRIDGE SEMICONDUCTOR CORP·Filed 2003·Granted Mar 13, 2007·92 cites·115 claims
- 1094US6794741B1Three-dimensional stacked semiconductor package with pillars in pillar cavitiesBRIDGE SEMICONDUCTOR CORP·Filed 2002·Granted Sep 21, 2004·77 cites·180 claims
- 1194US5736785ASemiconductor package for improving the capability of spreading heatIND TECH RES INST·Filed 1996·Granted Apr 7, 1998·192 cites·37 claims
- 1292US7622795B2Light emitting diode packageNICHEPAC TECHNOLOGY INC·Filed 2007·Granted Nov 24, 2009·25 cites·4 claims
- 1392US6716670B1Method of forming a three-dimensional stacked semiconductor package deviceBRIDGE SEMICONDUCTOR CORP·Filed 2002·Granted Apr 6, 2004·45 cites·80 claims
- 1490US6803651B1Optoelectronic semiconductor package deviceBRIDGE SEMICONDUCTOR CORP·Filed 2002·Granted Oct 12, 2004·38 cites·154 claims
- 1590US6307256B1Semiconductor package with a stacked chip on a leadframeAPACK TECHNOLOGIES INC·Filed 1998·Granted Oct 23, 2001·117 cites·11 claims
- 1689US6774659B1Method of testing a semiconductor package deviceBRIDGE SEMICONDUCTOR CORP·Filed 2002·Granted Aug 10, 2004·36 cites·40 claims
- 1787US7015128B1Method of making a semiconductor chip assembly with an embedded metal particleBRIDGE SEMICONDUCTOR CORP·Filed 2004·Granted Mar 21, 2006·34 cites·210 claims
- 1887US6576493B1Method of connecting a conductive trace and an insulative base to a semiconductor chip using multiple etch stepsBRIDGE SEMICONDUCTOR CORP·Filed 2002·Granted Jun 10, 2003·44 cites·100 claims
- 1985US6492252B1Method of connecting a bumped conductive trace to a semiconductor chipBRIDGE SEMICONDUCTOR CORP·Filed 2001·Granted Dec 10, 2002·26 cites·180 claims
- 2085US5942907AMethod and apparatus for testing diesIND TECH RES INST·Filed 1997·Granted Aug 24, 1999·56 cites·20 claims
- 2184US7192803B1Method of making a semiconductor chip assembly with simultaneously formed interconnect and connection jointBRIDGE SEMICONDUCTOR CORP·Filed 2003·Granted Mar 20, 2007·36 cites·300 claims
- 2283US7132741B1Semiconductor chip assembly with carved bumped terminalBRIDGE SEMICONDUCTOR CORP·Filed 2004·Granted Nov 7, 2006·35 cites·100 claims
- 2383US7129113B1Method of making a three-dimensional stacked semiconductor package with a metal pillar in an encapsulant apertureBRIDGE SEMICONDUCTOR CORP·Filed 2004·Granted Oct 31, 2006·35 cites·200 claims
- 2482US7129575B1Semiconductor chip assembly with bumped metal pillarBRIDGE SEMICONDUCTOR CORP·Filed 2004·Granted Oct 31, 2006·25 cites·100 claims
- 2581US7459385B1Method of making a semiconductor chip assembly with a laterally aligned bumped terminal and fillerBRIDGE SEMICONDUCTOR CORP·Filed 2006·Granted Dec 2, 2008·6 cites·100 claims
- 2680US7871274B2IC adapter for removably mounting integrated circuitNICHEPAC TECHNOLOGY INC·Filed 2009·Granted Jan 18, 2011·8 cites·17 claims
- 2779US6891276B1Semiconductor package deviceBRIDGE SEMICONDUCTOR CORP·Filed 2002·Granted May 10, 2005·17 cites·120 claims
- 2879US5877552ASemiconductor package for improving the capability of spreading heat and electrical functionIND TECH RES INST·Filed 1997·Granted Mar 2, 1999·58 cites·8 claims
- 2978US6608374B1Semiconductor chip assembly with bumped conductive traceBRIDGE SEMICONDUCTOR CORP·Filed 2002·Granted Aug 19, 2003·16 cites·80 claims
- 3077US6987034B1Method of making a semiconductor package device that includes singulating and trimming a leadBRIDGE SEMICONDUCTOR CORP·Filed 2003·Granted Jan 17, 2006·17 cites·40 claims
- 3175US7227249B1Three-dimensional stacked semiconductor package with chips on opposite sides of leadBRIDGE SEMICONDUCTOR CORP·Filed 2004·Granted Jun 5, 2007·22 cites·60 claims
- 3275US6699780B1Method of connecting a conductive trace to a semiconductor chip using plasma undercut etchingBRIDGE SEMICONDUCTOR CORP·Filed 2002·Granted Mar 2, 2004·18 cites·200 claims
- 3374US6800506B1Method of making a bumped terminal in a laminated structure for a semiconductor chip assemblyBRIDGE SEMICONDUCTOR CORP·Filed 2002·Granted Oct 5, 2004·14 cites·100 claims
- 3473US5822848ALead frame having a detachable and interchangeable die-attach paddleIND TECH RES INST·Filed 1996·Granted Oct 20, 1998·41 cites·23 claims
- 3571US7112521B1Method of making a semiconductor chip assembly with a bumped metal pillarBRIDGE SEMICONDUCTOR CORP·Filed 2004·Granted Sep 26, 2006·13 cites·100 claims
- 3671US6846735B1Compliant test probe with jagged contact surfaceBRIDGE SEMICONDUCTOR CORP·Filed 2002·Granted Jan 25, 2005·14 cites·155 claims
- 3771US6537851B1Method of connecting a bumped compliant conductive trace to a semiconductor chipBRIDGE SEMICONDUCTOR CORP·Filed 2001·Granted Mar 25, 2003·15 cites·180 claims
- 3870US6667229B1Method of connecting a bumped compliant conductive trace and an insulative base to a semiconductor chipBRIDGE SEMICONDUCTOR CORP·Filed 2001·Granted Dec 23, 2003·12 cites·300 claims
- 3968US7071089B1Method of making a semiconductor chip assembly with a carved bumped terminalBRIDGE SEMICONDUCTOR CORP·Filed 2004·Granted Jul 4, 2006·14 cites·100 claims
- 4060US6908794B1Method of making a semiconductor package device that includes a conductive trace with recessed and non-recessed portionsBRIDGE SEMICONDUCTOR CORP·Filed 2002·Granted Jun 21, 2005·5 cites·80 claims
- 4157US7940070B2Singulated bare die testing fixtureNICHEPAC TECHNOLOGY INC·Filed 2009·Granted May 10, 2011·2 cites·10 claims
- 4257US7508070B2Two dimensional stacking using interposersCHIANG CHENG-LIEN·Filed 2007·Granted Mar 24, 2009·2 cites·19 claims
- 4357US6984576B1Method of connecting an additively and subtractively formed conductive trace and an insulative base to a semiconductor chipBRIDGE SEMICONDUCTOR CORP·Filed 2003·Granted Jan 10, 2006·7 cites·300 claims
- 4452US2010027277A1Light emitting diode packageNICHEPAC TECHNOLOGY INC·Filed 2009·Application pending·0 cites
- 4551US5863805AMethod of packaging semiconductor chips based on lead-on-chip (LOC) architectureIND TECH RES INST·Filed 1996·Granted Jan 26, 1999·17 cites·24 claims
- 4650US6936495B1Method of making an optoelectronic semiconductor package deviceBRIDGE SEMICONDUCTOR CORP·Filed 2003·Granted Aug 30, 2005·3 cites·80 claims
- 4749US7652894B2Contact leadNICHEPAC TECHNOLOGY INC·Filed 2007·Granted Jan 26, 2010·0 cites·23 claims
- 4849US6989584B1Semiconductor package device that includes a conductive trace with a routing line, a terminal and a leadBRIDGE SEMICONDUCTOR CORP·Filed 2003·Granted Jan 24, 2006·2 cites·60 claims
- 4949US6949408B1Method of connecting a conductive trace and an insulative base to a semiconductor chip using multiple etch stepsBRIDGE SEMICONDUCTOR CORP·Filed 2003·Granted Sep 27, 2005·3 cites·300 claims
- 5047US7009309B1Semiconductor package device that includes an insulative housing with a protruding peripheral portionBRIDGE SEMICONDUCTOR CORP·Filed 2003·Granted Mar 7, 2006·1 cites·60 claims
Showing the top 50 of 56 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →