Inventor · disambiguated record
Chau Fatt Chiang
Also filed as: CHIANG CHAU FATT
30 granted patents·9 pending applications·47 citations·filing 2008–2025
94Inventor score
Top patents by PatentIndex Score
39 records- 0193US10796981B1Chip to lead interconnect in encapsulant of molded semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2019·Granted Oct 6, 2020·12 cites·20 claims
- 0290US9475691B1Molded package structure with glue bleed stopper for sealing a MEMs device method of packaging a MEMs deviceINFINEON TECHNOLOGIES AG·Filed 2015·Granted Oct 25, 2016·14 cites·20 claims
- 0388US10549985B2Semiconductor package with a through port for sensor applicationsINFINEON TECHNOLOGIES AG·Filed 2017·Granted Feb 4, 2020·4 cites·15 claims
- 0484US10396007B2Semiconductor package with plateable encapsulant and a method for manufacturing the sameINFINEON TECHNOLOGIES AG·Filed 2017·Granted Aug 27, 2019·4 cites·13 claims
- 0576US11133281B2Chip to chip interconnect in encapsulant of molded semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2019·Granted Sep 28, 2021·2 cites·10 claims
- 0673US10631100B2Micro-electrical mechanical system sensor package and method of manufacture thereofINFINEON TECHNOLOGIES AG·Filed 2018·Granted Apr 21, 2020·1 cites·28 claims
- 0771US11081417B2Manufacturing a package using plateable encapsulantINFINEON TECHNOLOGIES AG·Filed 2019·Granted Aug 3, 2021·1 cites·17 claims
- 0868US10886199B1Molded semiconductor package with double-sided coolingINFINEON TECHNOLOGIES AG·Filed 2019·Granted Jan 5, 2021·1 cites·20 claims
- 0968US10777536B2Semiconductor package with air cavityINFINEON TECHNOLOGIES AG·Filed 2018·Granted Sep 15, 2020·2 cites·22 claims
- 1067US11569196B2Chip to chip interconnect in encapsulant of molded semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2021·Granted Jan 31, 2023·0 cites·12 claims
- 1165US2023049564A1Semiconductor Package with Lead Tip Inspection FeatureINFINEON TECHNOLOGIES AG·Filed 2022·Application pending·0 cites
- 1264US10396018B2Multi-phase half bridge driver package and methods of manufactureINFINEON TECHNOLOGIES AG·Filed 2017·Granted Aug 27, 2019·1 cites·13 claims
- 1364US2025266311A1Methods for Manufacturing Semiconductor PackagesINFINEON TECHNOLOGIES AG·Filed 2025·Application pending·0 cites
- 1462US7977161B2Method of manufacturing a semiconductor package using a carrierINFINEON TECHNOLOGIES AG·Filed 2008·Granted Jul 12, 2011·2 cites·23 claims
- 1560US2024343553A1Semiconductor package with floating metal portion and method for manufacturingINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 1659US12300559B2Semiconductor packages and methods for manufacturing thereofINFINEON TECHNOLOGIES AG·Filed 2021·Granted May 13, 2025·0 cites·15 claims
- 1758US11587800B2Semiconductor package with lead tip inspection featureINFINEON TECHNOLOGIES AG·Filed 2020·Granted Feb 21, 2023·0 cites·11 claims
- 1857US8053280B2Method of producing multiple semiconductor devicesINFINEON TECHNOLOGIES AG·Filed 2008·Granted Nov 8, 2011·2 cites·17 claims
- 1957US7838332B2Method of manufacturing a semiconductor package with a bump using a carrierINFINEON TECHNOLOGIES AG·Filed 2008·Granted Nov 23, 2010·1 cites·20 claims
- 2056US11174152B2Over-under sensor packaging with sensor spaced apart from control chipINFINEON TECHNOLOGIES AG·Filed 2019·Granted Nov 16, 2021·0 cites·20 claims
- 2155US12021000B2Semiconductor package and method for fabricating a semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2021·Granted Jun 25, 2024·0 cites·10 claims
- 2255US11274984B2Pressure sensor having a lidless/laminate structureINFINEON TECHNOLOGIES AG·Filed 2020·Granted Mar 15, 2022·0 cites·16 claims
- 2355US10304780B2Device having substrate with conductive pillarsINFINEON TECHNOLOGIES AG·Filed 2018·Granted May 28, 2019·0 cites·10 claims
- 2452US12176222B2Semiconductor package with metal posts from structured leadframeINFINEON TECHNOLOGIES AG·Filed 2021·Granted Dec 24, 2024·0 cites·20 claims
- 2552US11302613B2Double-sided cooled molded semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2020·Granted Apr 12, 2022·0 cites·20 claims
- 2651US10501312B2Over-under sensor packaging with sensor spaced apart from control chipINFINEON TECHNOLOGIES AG·Filed 2017·Granted Dec 10, 2019·0 cites·20 claims
- 2750US10163812B2Device having substrate with conductive pillarsINFINEON TECHNOLOGIES AG·Filed 2016·Granted Dec 25, 2018·0 cites·8 claims
- 2849US12218038B2Leadframe, semiconductor package and methodINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2019·Granted Feb 4, 2025·0 cites·20 claims
- 2949US10639833B2Molding system with movable mold toolINFINEON TECHNOLOGIES AG·Filed 2017·Granted May 5, 2020·0 cites·18 claims
- 3049US2022278085A1Method for connecting an electrical device to a bottom unit by using a solderless jointINFINEON TECHNOLOGIES AG·Filed 2022·Application pending·0 cites
- 3147US11791169B2Dual step laser processing of an encapsulant of a semiconductor chip packageINFINEON TECHNOLOGIES AG·Filed 2020·Granted Oct 17, 2023·0 cites·21 claims
- 3244US2023170329A1Semiconductor package with metal posts from structured leadframeINFINEON TECHNOLOGIES AG·Filed 2022·Application pending·0 cites
- 3343US2023178428A1Leaded semiconductor package formation using lead frame with structured central padINFINEON TECHNOLOGIES AG·Filed 2021·Application pending·0 cites
- 3440US10490470B2Semiconductor package and method for fabricating a semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2017·Granted Nov 26, 2019·0 cites·11 claims
- 3540US2021313294A1Semiconductor package and method for fabricating the sameINFINEON TECHNOLOGIES AG·Filed 2021·Application pending·0 cites
- 3640US2020185293A1Semiconductor Package Having a Laser-Activatable Mold CompoundINFINEON TECHNOLOGIES AG·Filed 2018·Application pending·0 cites
- 3739US9868632B2Molded cavity package with embedded conductive layer and enhanced sealingINFINEON TECHNOLOGIES AG·Filed 2016·Granted Jan 16, 2018·0 cites·14 claims
- 3833US2019109103A1Method of Forming a Semiconductor Package and Semiconductor PackageINFINEON TECHNOLOGIES AG·Filed 2018·Application pending·0 cites
- 3927US10099411B2Method and apparatus for simultaneously encapsulating semiconductor dies with layered lead frame stripsINFINEON TECHNOLOGIES AG·Filed 2015·Granted Oct 16, 2018·0 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →