Inventor · disambiguated record
Chien Chiang
Also filed as: CHIANG CHIEN · CHIANG CHIEN-HAO
31 granted patents·2 pending applications·4,233 citations·filing 1996–2019
98Inventor score
Top patents by PatentIndex Score
33 records- 0199US6621095B2Method to enhance performance of thermal resistor deviceOVONYX INC·Filed 2001·Granted Sep 16, 2003·480 cites·13 claims
- 0299US6339544B1Method to enhance performance of thermal resistor deviceINTEL CORP·Filed 2000·Granted Jan 15, 2002·756 cites·22 claims
- 0399US5739579AMethod for forming interconnections for semiconductor fabrication and semiconductor device having such interconnectionsINTEL CORP·Filed 1996·Granted Apr 14, 1998·427 cites·14 claims
- 0498US6861267B2Reducing shunts in memories with phase-change materialINTEL CORP·Filed 2001·Granted Mar 1, 2005·334 cites·18 claims
- 0598US6797979B2Metal structure for a phase-change memory deviceINTEL CORP·Filed 2003·Granted Sep 28, 2004·294 cites·62 claims
- 0698US6569705B2Metal structure for a phase-change memory deviceINTEL CORP·Filed 2000·Granted May 27, 2003·345 cites·14 claims
- 0798US6545287B2Using selective deposition to form phase-change memory cellsINTEL CORP·Filed 2001·Granted Apr 8, 2003·372 cites·15 claims
- 0897US5817572AMethod for forming multileves interconnections for semiconductor fabricationINTEL CORP·Filed 1996·Granted Oct 6, 1998·242 cites·37 claims
- 0995US6848177B2Integrated circuit die and an electronic assembly having a three-dimensional interconnection schemeINTEL CORP·Filed 2002·Granted Feb 1, 2005·86 cites·20 claims
- 1090US6309956B1Fabricating low K dielectric interconnect systems by using dummy structures to enhance processINTEL CORP·Filed 1999·Granted Oct 30, 2001·138 cites·6 claims
- 1190US5886410AInterconnect structure with hard mask and low dielectric constant materialsINTEL CORP·Filed 1996·Granted Mar 23, 1999·110 cites·14 claims
- 1288US6143647ASilicon-rich block copolymers to achieve unbalanced viasINTEL CORP·Filed 1997·Granted Nov 7, 2000·93 cites·11 claims
- 1387US7217945B2Method to selectively increase the top resistance of the lower programming electrode in a phase-change memory cell and structures obtained therebyINTEL CORP·Filed 2005·Granted May 15, 2007·15 cites·16 claims
- 1485US6303464B1Method and structure for reducing interconnect system capacitance through enclosed voids in a dielectric layerINTEL CORP·Filed 1996·Granted Oct 16, 2001·87 cites·8 claims
- 1583US6051869ASilicon-rich block copolymers to achieve unbalanced viasINTEL CORP·Filed 1998·Granted Apr 18, 2000·60 cites·3 claims
- 1682US7214632B2Using selective deposition to form phase-change memory cellsINTEL CORP·Filed 2003·Granted May 8, 2007·19 cites·17 claims
- 1781US6027995AMethod for fabricating an interconnect structure with hard mask and low dielectric constant materialsINTEL CORP·Filed 1998·Granted Feb 22, 2000·59 cites·8 claims
- 1881US5935868AInterconnect structure and method to achieve unlanded vias for low dielectric constant materialsINTEL CORP·Filed 1997·Granted Aug 10, 1999·69 cites·36 claims
- 1976US6277765B1Low-K Dielectric layer and method of making sameINTEL CORP·Filed 1999·Granted Aug 21, 2001·47 cites·27 claims
- 2075US7112887B2Integrated circuit die and an electronic assembly having a three-dimensional interconnection schemeINTEL CORP·Filed 2004·Granted Sep 26, 2006·15 cites·4 claims
- 2174US6037249AMethod for forming air gaps for advanced interconnect systemsINTEL CORP·Filed 1997·Granted Mar 14, 2000·48 cites·20 claims
- 2272US6040628AInterconnect structure using a combination of hard dielectric and polymer as interlayer dielectricsINTEL CORP·Filed 1996·Granted Mar 21, 2000·36 cites·20 claims
- 2368US6777320B1In-plane on-chip decoupling capacitors and method for making sameINTEL CORP·Filed 1998·Granted Aug 17, 2004·29 cites·35 claims
- 2467US7183567B2Using selective deposition to form phase-change memory cellsINTEL CORP·Filed 2003·Granted Feb 27, 2007·16 cites·15 claims
- 2565US5880030AUnlanded via structure and method for making sameINTEL CORP·Filed 1997·Granted Mar 9, 1999·30 cites·13 claims
- 2664US6770524B2Method to enhance performance of thermal resistor deviceINTEL CORP·Filed 2003·Granted Aug 3, 2004·6 cites·3 claims
- 2761US7161225B2Reducing shunts in memories with phase-change materialINTEL CORP·Filed 2005·Granted Jan 9, 2007·1 cites·18 claims
- 2856US6239019B1Interconnect structure using a combination of hard dielectric and polymer as interlayer dielectricsINTEL CORP·Filed 1999·Granted May 29, 2001·17 cites·15 claims
- 2948US6949831B2In-plane on-chip decoupling capacitors and method for making sameINTEL CORP·Filed 2004·Granted Sep 27, 2005·2 cites·25 claims
- 3047US2021115447A1Nucleic acid aptamers targeting lymphocyte activation gene 3 (lag-3) and uses thereofONENESS BIOTECH CO LTD·Filed 2019·Application pending·0 cites
- 3143US11138037B2Switch policy for hybrid scheduling in multi-processor systemsMEDIATEK INC·Filed 2018·Granted Oct 5, 2021·0 cites·12 claims
- 3235US2003183943A1Integrated circuit die and an electronic assembly having a three-dimensional interconnection schemeFiled 2002·Application pending·0 cites
- 3332US8369342B2System, apparatus, and method for extending network with power supplyETHERWAN SYSTEMS INC·Filed 2010·Granted Feb 5, 2013·0 cites·18 claims
Join the waitlist — get patent alerts
Get an alert when Chien Chiang files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →