Inventor · disambiguated record
Chung-Sung Chiang
Also filed as: CHIANG CHUNG-SUNG
4 granted patents·7 pending applications·35 citations·filing 2013–2024
68Inventor score
Files withUNITED MICROELECTRONICS CORP11
Top patents by PatentIndex Score
11 records- 0194US8916471B1Method for forming semiconductor structure having through silicon via for signal and shielding structureUNITED MICROELECTRONICS CORP·Filed 2013·Granted Dec 23, 2014·35 cites·19 claims
- 0283US12243839B2Bonded semiconductor structure utilizing concave/convex profile design for bonding padsUNITED MICROELECTRONICS CORP·Filed 2024·Granted Mar 4, 2025·0 cites·17 claims
- 0383US2025079363A1Bonded semiconductor structure utilizing concave/convex profileUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 0478US11935854B2Method for forming bonded semiconductor structure utilizing concave/convex profile design for bonding padsUNITED MICROELECTRONICS CORP·Filed 2023·Granted Mar 19, 2024·0 cites·6 claims
- 0573US11640949B2Bonded semiconductor structure utilizing concave/convex profile design for bonding padsUNITED MICROELECTRONICS CORP·Filed 2021·Granted May 2, 2023·0 cites·7 claims
- 0660US2025385218A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 0759US2025194230A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 0859US2025201731A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 0956US2024387418A1Semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 1056US2024371758A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 1143US2015332996A1Interposer and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2014·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →