Inventor · disambiguated record
Chin-Tien Chiu
Also filed as: CHIU CHIN TIEN
73 granted patents·22 pending applications·274 citations·filing 2002–2022
98Inventor score
Files withWESTERN DIGITAL TECH INC20SANDISK CORP15SANDISK INFORMATION TECH SHANGHAI CO LTD11CHIU CHIN-TIEN8SILICONWARE PRECISION INDUSTRIES CO LTD6
Top patents by PatentIndex Score
95 records- 0194US11444001B1Thermoelectric semiconductor device and method of making sameWESTERN DIGITAL TECH INC·Filed 2021·Granted Sep 13, 2022·8 cites·20 claims
- 0292US10242965B2Semiconductor device including interconnected package on packageSANDISK INFORMATION TECH SHANGHAI CO LTD·Filed 2017·Granted Mar 26, 2019·9 cites·10 claims
- 0389US7485501B2Method of manufacturing flash memory cardsSANDISK CORP·Filed 2005·Granted Feb 3, 2009·18 cites·23 claims
- 0488US10177119B2Fan out semiconductor device including a plurality of semiconductor dieSANDISK INFORMATION TECH SHANGHAI CO LTD·Filed 2017·Granted Jan 8, 2019·6 cites·20 claims
- 0587US11393735B2Semiconductor device including reinforced corner supportsWESTERN DIGITAL TECH INC·Filed 2019·Granted Jul 19, 2022·5 cites·14 claims
- 0687US7538438B2Substrate warpage control and continuous electrical enhancementSANDISK CORP·Filed 2005·Granted May 26, 2009·15 cites·36 claims
- 0786US11302673B2Semiconductor device including vertically stacked semiconductor diesWESTERN DIGITAL TECH INC·Filed 2020·Granted Apr 12, 2022·2 cites·20 claims
- 0886US11257785B2Multi-module integrated interposer and semiconductor device formed therefromWESTERN DIGITAL TECH INC·Filed 2020·Granted Feb 22, 2022·2 cites·11 claims
- 0985US7746661B2Printed circuit board with coextensive electrical connectors and contact pad areasSANDISK CORP·Filed 2006·Granted Jun 29, 2010·8 cites·18 claims
- 1085US7355283B2Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packagingSANDISK CORP·Filed 2005·Granted Apr 8, 2008·10 cites·12 claims
- 1185US6864434B2Warpage-preventive circuit board and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2003·Granted Mar 8, 2005·36 cites·4 claims
- 1284US11276669B2High capacity semiconductor device including bifurcated memory moduleWESTERN DIGITAL TECH INC·Filed 2020·Granted Mar 15, 2022·2 cites·20 claims
- 1383US9773766B2Semiconductor device including independent film layer for embedding and/or spacing semiconductor dieSANDISK SEMICONDUCTOR (SHANGHAI) CO LTD·Filed 2013·Granted Sep 26, 2017·8 cites·20 claims
- 1482US9704797B2Waterfall wire bondingLU ZHONG·Filed 2011·Granted Jul 11, 2017·11 cites·11 claims
- 1581US10490529B2Angled die semiconductor deviceSANDISK INFORMATION TECH SHANGHAI CO LTD·Filed 2017·Granted Nov 26, 2019·3 cites·22 claims
- 1681US7266888B2Method for fabricating a warpage-preventive circuit boardSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2005·Granted Sep 11, 2007·9 cites·6 claims
- 1780US10325881B2Vertical semiconductor device having a stacked die blockSANDISK INFORMATION TECH SHANGAHAI CO LTD·Filed 2017·Granted Jun 18, 2019·4 cites·15 claims
- 1879US8878368B2Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packagingSANDISK TECHNOLOGIES INC·Filed 2013·Granted Nov 4, 2014·3 cites·16 claims
- 1978US9230942B2Semiconductor device including alternating stepped semiconductor die stacksSANDISK INFORMATION TECHNOLOGY SHANGHAI CO LTD·Filed 2013·Granted Jan 5, 2016·6 cites·20 claims
- 2077US10236276B2Semiconductor device including vertically integrated groups of semiconductor packagesSANDISK INFORMATION TECH SHANGHAI CO LTD·Filed 2017·Granted Mar 19, 2019·4 cites·17 claims
- 2176US6835897B2Warpage preventing substrateSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2002·Granted Dec 28, 2004·29 cites·10 claims
- 2275US10607955B2Heterogeneous fan-out structures for memory devicesSANDISK SEMICONDUCTOR SHANGHAI CO LTD·Filed 2017·Granted Mar 31, 2020·4 cites·10 claims
- 2374US12506048B2Bifacial semiconductor waferSANDISK TECHNOLOGIES INC·Filed 2022·Granted Dec 23, 2025·0 cites·15 claims
- 2474US9230919B2Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packagingSANDISK TECHNOLOGIES INC·Filed 2014·Granted Jan 5, 2016·2 cites·22 claims
- 2572US8487441B2Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packagingCHIU CHIN-TIEN·Filed 2007·Granted Jul 16, 2013·4 cites·11 claims
- 2672US7806731B2Rounded contact fingers on substrate/PCB for crack preventionSANDISK CORP·Filed 2005·Granted Oct 5, 2010·5 cites·38 claims
- 2770US10304816B2Semiconductor device including stacked die with continuous integral via holesWESTERN DIGITAL TECH INC·Filed 2016·Granted May 28, 2019·2 cites·13 claims
- 2870US9947606B2Semiconductor device including electromagnetic absorption and shieldingSANDISK INFORMATION TECH SHANGHAI CO LTD·Filed 2016·Granted Apr 17, 2018·2 cites·15 claims
- 2970US9595454B2Semiconductor device including electromagnetic absorption and shieldingHUANG DACHENG·Filed 2012·Granted Mar 14, 2017·5 cites·17 claims
- 3069US9337153B2EMI shielding and thermal dissipation for semiconductor deviceFU PENG·Filed 2011·Granted May 10, 2016·4 cites·21 claims
- 3169US8129272B2Hidden plating tracesTAKIAR HEM·Filed 2009·Granted Mar 6, 2012·3 cites·16 claims
- 3269US7763980B2Semiconductor die having a distribution layerSANDISK CORP·Filed 2007·Granted Jul 27, 2010·3 cites·10 claims
- 3368US10811386B2Semiconductor deviceSANDISK INFORMATION TECH SHANGHAI CO LTD·Filed 2017·Granted Oct 20, 2020·2 cites·13 claims
- 3468US9331045B2Semiconductor die laminating device with independent drivesGU WEI·Filed 2012·Granted May 3, 2016·3 cites·20 claims
- 3568US7967184B2Padless substrate for surface mounted componentsSANDISK CORP·Filed 2005·Granted Jun 28, 2011·4 cites·6 claims
- 3666US11901260B2Thermoelectric semiconductor device and method of making sameWESTERN DIGITAL TECH INC·Filed 2022·Granted Feb 13, 2024·0 cites·20 claims
- 3766US7435624B2Method of reducing mechanical stress on a semiconductor die during fabricationSANDISK CORP·Filed 2006·Granted Oct 14, 2008·4 cites·15 claims
- 3865US11031371B2Semiconductor package and method of fabricating semiconductor packageSANDISK INFORMATION TECH SHANGHAI CO LTD·Filed 2017·Granted Jun 8, 2021·2 cites·17 claims
- 3965US7615861B2Methods of promoting adhesion between transfer molded IC packages and injection molded plastics for creating over-molded memory cardsSANDISK CORP·Filed 2006·Granted Nov 10, 2009·2 cites·9 claims
- 4063US11177239B2Semiconductor device including control switches to reduce pin capacitanceSANDISK INFORMATION TECH SHANGHAI CO LTD·Filed 2018·Granted Nov 16, 2021·1 cites·19 claims
- 4162US12051660B2Wire bond pad design for compact stacked-die packageWESTERN DIGITAL TECH INC·Filed 2021·Granted Jul 30, 2024·0 cites·17 claims
- 4262US7952179B2Semiconductor package having through holes for molding back side of packageSANDISK CORP·Filed 2007·Granted May 31, 2011·2 cites·16 claims
- 4361US7772047B2Method of fabricating a semiconductor die having a redistribution layerSANDISK CORP·Filed 2007·Granted Aug 10, 2010·2 cites·34 claims
- 4460US7592699B2Hidden plating tracesSANDISK CORP·Filed 2005·Granted Sep 22, 2009·1 cites·18 claims
- 4559US6737737B1Semiconductor package with chip supporting memberSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2003·Granted May 18, 2004·9 cites·20 claims
- 4658US7939382B2Method of fabricating a semiconductor package having through holes for molding back side of packageSANDISK CORP·Filed 2007·Granted May 10, 2011·1 cites·30 claims
- 4757US9006912B2Printed circuit board with coextensive electrical connectors and contact pad areasLIAO CHIH-CHIN·Filed 2012·Granted Apr 14, 2015·0 cites·14 claims
- 4856US10051733B2Printed circuit board with coextensive electrical connectors and contact pad areasSANDISK TECHNOLOGIES INC·Filed 2015·Granted Aug 14, 2018·0 cites·18 claims
- 4954US11189582B2Wire bond pad design for compact stacked-die packageWESTERN DIGITAL TECH INC·Filed 2019·Granted Nov 30, 2021·0 cites·11 claims
- 5054US11031378B2Semiconductor device including high speed heterogeneous integrated controller and cacheWESTERN DIGITAL TECH INC·Filed 2020·Granted Jun 8, 2021·0 cites·20 claims
Showing the top 50 of 95 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →